Inventor · disambiguated record
Chia-Wen Lien
Also filed as: LIEN CHIA-WEN
6 granted patents·1 pending application·12 citations·filing 2012–2019
73Inventor score
Files withHSU CHANG-SHENG3BIO HELIX CO LTD1EVERLIGHT CHEM IND CORP1POWERTECH TECHNOLOGY INC1UNIV NAT TAIWAN OCEAN1
Top patents by PatentIndex Score
7 records- 0183US8536709B1Wafer with eutectic bonding carrier and method of manufacturing the sameHSU CHANG-SHENG·Filed 2012·Granted Sep 17, 2013·8 cites·7 claims
- 0266US8776363B2Method for supporting semiconductor wafer and wafer supporting assemblyHSU CHANG-SHENG·Filed 2012·Granted Jul 15, 2014·3 cites·11 claims
- 0361US11112366B2Reagent and kit for enhancing chemiluminescent reactionUNIV NAT TAIWAN OCEAN·Filed 2019·Granted Sep 7, 2021·0 cites·16 claims
- 0460US8754504B2Thinned wafer and fabricating method thereofHSU CHANG-SHENG·Filed 2012·Granted Jun 17, 2014·1 cites·13 claims
- 0546US2019031881A1Reactive black dye composition and method for dying fibers using the sameEVERLIGHT CHEM IND CORP·Filed 2018·Application pending·0 cites
- 0636US10711185B2Reagent and kit for performing chemiluminescent reactionBIO HELIX CO LTD·Filed 2018·Granted Jul 14, 2020·0 cites·16 claims
- 0736US9972554B2Wafer level chip scale package having continuous through hole via configuration and fabrication method thereofPOWERTECH TECHNOLOGY INC·Filed 2017·Granted May 15, 2018·0 cites·19 claims
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