Inventor · disambiguated record
Masaru Akino
Also filed as: AKINO MASARU
19 granted patents·19 citations·filing 2010–2020
90Inventor score
Top patents by PatentIndex Score
19 records- 0190US9945912B2Hall sensor and compensation method for offset caused by temperature distribution in hall sensorSEIKO INSTR INC·Filed 2015·Granted Apr 17, 2018·5 cites·7 claims
- 0281US9117799B2Method of manufacturing semiconductor device having pad region for wire-bondingSEIKO INSTR INC·Filed 2014·Granted Aug 25, 2015·5 cites·7 claims
- 0378US10388618B2Semiconductor device and method of manufacturing a semiconductor deviceABLIC INC·Filed 2019·Granted Aug 20, 2019·2 cites·2 claims
- 0465US9296142B2Semiconductor manufacturing apparatusSEIKO INSTR INC·Filed 2014·Granted Mar 29, 2016·2 cites·13 claims
- 0564US8324708B2Semiconductor integrated circuit device and manufacturing method thereofMINAMI YUKIMASA·Filed 2010·Granted Dec 4, 2012·3 cites·3 claims
- 0663US10978414B2Semiconductor device and method of manufacturing a semiconductor deviceABLIC INC·Filed 2020·Granted Apr 13, 2021·0 cites·7 claims
- 0763US9184116B2Method of manufacturing resin-encapsulated semiconductor device, and lead frameSEIKO INSTR INC·Filed 2014·Granted Nov 10, 2015·1 cites·7 claims
- 0860US9694523B2Semiconductor manufacturing apparatusSII SEMICONDUCTOR CORP·Filed 2016·Granted Jul 4, 2017·1 cites·13 claims
- 0956US10607954B2Semiconductor device and method of manufacturing a semiconductor deviceABLIC INC·Filed 2018·Granted Mar 31, 2020·0 cites·8 claims
- 1055US11043434B2Method of manufacturing a semiconductor deviceABLIC INC·Filed 2020·Granted Jun 22, 2021·0 cites·4 claims
- 1154US10249584B2Semiconductor device and method of manufacturing a semiconductor deviceABLIC INC·Filed 2018·Granted Apr 2, 2019·0 cites·2 claims
- 1252US10580708B2Method of manufacturing a semiconductor device and semiconductor deviceABLIC INC·Filed 2018·Granted Mar 3, 2020·0 cites·6 claims
- 1348US9679835B2Method of manufacturing resin-encapsulated semiconductor device, and lead frameSEIKO INSTR INC·Filed 2015·Granted Jun 13, 2017·0 cites·6 claims
- 1448US9362195B2Semiconductor deviceSEIKO INSTR INC·Filed 2014·Granted Jun 7, 2016·0 cites·7 claims
- 1543US10297562B2Semiconductor device and method of manufacturing a semiconductor deviceABLIC INC·Filed 2018·Granted May 21, 2019·0 cites·4 claims
- 1643US9917055B2Semiconductor device having fuse elementSII SEMICONDUCTOR CORP·Filed 2016·Granted Mar 13, 2018·0 cites·19 claims
- 1743US8704385B2Semiconductor device having pad region for wire-bonding and method of manufacturing the semiconductor deviceAKINO MASARU·Filed 2012·Granted Apr 22, 2014·0 cites·18 claims
- 1842US9818691B2Semiconductor device having a fuse elementSII SEMICONDUCTOR CORP·Filed 2016·Granted Nov 14, 2017·0 cites·19 claims
- 1937US9437669B2Semiconductor deviceSEIKO INSTR INC·Filed 2015·Granted Sep 6, 2016·0 cites·10 claims
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