Inventor · disambiguated record
Yoshitomo Shimazu
Also filed as: SHIMAZU YOSHITOMO
6 granted patents·3 pending applications·67 citations·filing 2001–2020
79Inventor score
Top patents by PatentIndex Score
9 records- 0186US6740589B2Composition for polishing semiconductor wafer, semiconductor circuit wafer, and method for producing the sameSHOWA DENKO KK·Filed 2001·Granted May 25, 2004·39 cites·23 claims
- 0279US6547843B2LSI device polishing composition and method for producing LSI deviceSHOWA DENKO KK·Filed 2001·Granted Apr 15, 2003·21 cites·9 claims
- 0362US6844263B2LSI device polishing composition and method for producing LSI deviceSHOWA DENKO KK·Filed 2003·Granted Jan 18, 2005·7 cites·14 claims
- 0449US8425276B2Polishing compositionSATO TAKASHI·Filed 2008·Granted Apr 23, 2013·0 cites·17 claims
- 0547US7901474B2Polishing composition and polishing methodSHOWA DENKO KK·Filed 2005·Granted Mar 8, 2011·0 cites·19 claims
- 0645US2009289217A1Polishing compositionSHOWA DENKO KK·Filed 2007·Application pending·0 cites
- 0743US2022050125A1Probe production method and surface observation methodSHOWA DENKO KK·Filed 2020·Application pending·0 cites
- 0843US2009194504A1Method for producing abrasive compositionSHOWA DENKO KK·Filed 2007·Application pending·0 cites
- 0942US8592314B2Polishing composition and polishing methodNISHIOKA AYAKO·Filed 2006·Granted Nov 26, 2013·0 cites·19 claims
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