Inventor · disambiguated record
Michael D. Cusack
Also filed as: CUSACK MICHAEL · CUSACK MICHAEL D · CUSACK MICHAEL DAVID
20 granted patents·2 pending applications·165 citations·filing 1982–2021
94Inventor score
Files withMARVELL INT TECHNOLOGY LTD5UNITED TECHNOLOGIES CORP5AVAGO TECHNOLOGIES GENERAL IP3MARVELL INT LTD2ANALOG DEVICES GLOBAL1
Top patents by PatentIndex Score
22 records- 0186US7629675B2System and method for routing signals between side-by-side die in lead frame type system in a package (SIP) devicesMARVELL INT TECHNOLOGY LTD·Filed 2006·Granted Dec 8, 2009·12 cites·15 claims
- 0282US8021928B1System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devicesMARVELL INT TECHNOLOGY LTD·Filed 2010·Granted Sep 20, 2011·5 cites·12 claims
- 0380US7977773B1Leadframe including die paddle apertures for reducing delaminationMARVELL INT LTD·Filed 2007·Granted Jul 12, 2011·10 cites·11 claims
- 0480US7443011B2System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devicesMARVELL INT TECHNOLOGY LTD·Filed 2006·Granted Oct 28, 2008·7 cites·21 claims
- 0571US4711700AMethod for densifying leadframe conductor spacingUNITED TECHNOLOGIES CORP·Filed 1986·Granted Dec 8, 1987·40 cites·3 claims
- 0665US8039318B1System and method for routing signals between side-by-side die in lead frame type system in a package (SIP) devicesMARVELL INT TECHNOLOGY LTD·Filed 2009·Granted Oct 18, 2011·2 cites·12 claims
- 0765US4730160AProgrammable thermal emulator test dieUNITED TECHNOLOGIES CORP·Filed 1986·Granted Mar 8, 1988·26 cites·9 claims
- 0861US7495320B2System and method for providing a power bus in a wirebond leadframe packageAVAGO TECHNOLOGIES GENERAL IP·Filed 2006·Granted Feb 24, 2009·2 cites·8 claims
- 0961US7446677B2Method and apparatus for optically detecting selections made on an input deviceAVAGO TECHNOLOGIES ECBU IP PTE·Filed 2005·Granted Nov 4, 2008·2 cites·12 claims
- 1060US7745263B2System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devicesMARVELL INT TECHNOLOGY LTD·Filed 2008·Granted Jun 29, 2010·1 cites·13 claims
- 1158US9986639B2Vertical magnetic barrier for integrated electronic module and related methodsANALOG DEVICES GLOBAL·Filed 2015·Granted May 29, 2018·1 cites·20 claims
- 1258US7902655B1Multichip package leadframe including electrical bussingMARVELL INT LTD·Filed 2007·Granted Mar 8, 2011·1 cites·31 claims
- 1357US7800205B2Quad flat pack (QFP) package and flexible power distribution method thereforAVAGO TECHNOLOGIES GENERAL IP·Filed 2005·Granted Sep 21, 2010·1 cites·15 claims
- 1456US8269334B1Multichip package leadframe including electrical bussingCUSACK MICHAEL D·Filed 2011·Granted Sep 18, 2012·1 cites·9 claims
- 1552US4753820AVariable pitch IC bond pad arrangementUNITED TECHNOLOGIES CORP·Filed 1986·Granted Jun 28, 1988·18 cites·4 claims
- 1652US2022061971A1System and method for dental ventilationCUSACK MICHAEL·Filed 2021·Application pending·0 cites
- 1747US4875138AVariable pitch IC bond pad arrangementUNITED TECHNOLOGIES CORP·Filed 1988·Granted Oct 17, 1989·14 cites·7 claims
- 1845US4959706AIntegrated circuit having an improved bond padUNITED TECHNOLOGIES CORP·Filed 1988·Granted Sep 25, 1990·17 cites·14 claims
- 1942US7202546B2Integrated circuit with copper interconnect and top level bonding/interconnect layerAVAGO TECHNOLOGIES GENERAL IP·Filed 2003·Granted Apr 10, 2007·1 cites·22 claims
- 2040US2007086035A1Printer controller apparatus implemented as a system in a packageWHELESS THOMAS O JR·Filed 2005·Application pending·0 cites
- 2128US4463892AMethod for manufacturing IC packagesBURROUGHS CORP·Filed 1982·Granted Aug 7, 1984·2 cites·10 claims
- 2221USD728093SEnteral feeding deviceXeridiem·Filed 2013·Granted Apr 28, 2015·2 cites·1 claims
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