Inventor · disambiguated record
Steven Oliver
Also filed as: OLIVER STEVEN · OLIVER STEVEN D · OLIVER STEVEN DAVID
39 granted patents·6 pending applications·705 citations·filing 2001–2022
98Inventor score
Top patents by PatentIndex Score
45 records- 0198US9305956B2Optical assembly including plenoptic microlens arrayLYTRO INC·Filed 2015·Granted Apr 5, 2016·31 cites·35 claims
- 0298US7683458B2Through-wafer interconnects for photoimager and memory wafersMICRON TECHNOLOGY INC·Filed 2007·Granted Mar 23, 2010·54 cites·17 claims
- 0398US7390687B2Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagersMICRON TECHNOLOGY INC·Filed 2006·Granted Jun 24, 2008·55 cites·9 claims
- 0497US9419049B2Optical assembly including plenoptic microlens arrayLYTRO INC·Filed 2016·Granted Aug 16, 2016·23 cites·33 claims
- 0597US7300857B2Through-wafer interconnects for photoimager and memory wafersMICRON TECHNOLOGY INC·Filed 2004·Granted Nov 27, 2007·166 cites·32 claims
- 0697US7190039B2Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagersMICRON TECHNOLOGY INC·Filed 2005·Granted Mar 13, 2007·38 cites·18 claims
- 0796US9184199B2Optical assembly including plenoptic microlens arrayPITTS COLVIN·Filed 2012·Granted Nov 10, 2015·29 cites·55 claims
- 0896US7452743B2Microelectronic imaging units and methods of manufacturing microelectronic imaging units at the wafer levelAPTINA IMAGING CORP·Filed 2005·Granted Nov 18, 2008·52 cites·34 claims
- 0995US7956443B2Through-wafer interconnects for photoimager and memory wafersMICRON TECHNOLOGY INC·Filed 2010·Granted Jun 7, 2011·16 cites·17 claims
- 1092US7696588B2Microelectronic imagers with shaped image sensors and methods for manufacturing microelectronic imagersAPTINA IMAGING CORP·Filed 2007·Granted Apr 13, 2010·14 cites·19 claims
- 1191US11927751B2Adjustable optical units for a wearable e-readerSINDARIN INC·Filed 2022·Granted Mar 12, 2024·4 cites·20 claims
- 1290US7169248B1Methods for releasably attaching support members to microfeature workpieces and microfeature assemblies formed using such methodsMICRON TECHNOLOGY INC·Filed 2005·Granted Jan 30, 2007·14 cites·38 claims
- 1389US9848113B2Multi-band biometric camera system having iris color recognitionSAMSUNG ELECTRONICC CO LTD·Filed 2015·Granted Dec 19, 2017·12 cites·20 claims
- 1488US12135426B2Wearable e-readerSINDARIN INC·Filed 2022·Granted Nov 5, 2024·2 cites·16 claims
- 1588US7923298B2Imager die package and methods of packaging an imager die on a temporary carrierMICRON TECHNOLOGY INC·Filed 2007·Granted Apr 12, 2011·17 cites·25 claims
- 1688US7749899B2Microelectronic workpieces and methods and systems for forming interconnects in microelectronic workpiecesMICRON TECHNOLOGY INC·Filed 2006·Granted Jul 6, 2010·17 cites·55 claims
- 1787US8324100B2Methods of forming conductive viasAKRAM SALMAN·Filed 2011·Granted Dec 4, 2012·7 cites·26 claims
- 1886US8669179B2Through-wafer interconnects for photoimager and memory wafersMICRON TECHNOLOGY INC·Filed 2013·Granted Mar 11, 2014·5 cites·13 claims
- 1985US8502353B2Through-wafer interconnects for photoimager and memory wafersAKRAM SALMAN·Filed 2011·Granted Aug 6, 2013·5 cites·11 claims
- 2085US7560371B2Methods for selectively filling apertures in a substrate to form conductive vias with a liquid using a vacuumMICRON TECHNOLOGY INC·Filed 2006·Granted Jul 14, 2009·14 cites·32 claims
- 2185US7133197B2Metal-dielectric coating for image sensor lidsJDS UNIPHASE CORP·Filed 2004·Granted Nov 7, 2006·32 cites·23 claims
- 2284US7397066B2Microelectronic imagers with curved image sensors and methods for manufacturing microelectronic imagersMICRON TECHNOLOGY INC·Filed 2004·Granted Jul 8, 2008·26 cites·36 claims
- 2382US7425499B2Methods for forming interconnects in vias and microelectronic workpieces including such interconnectsMICRON TECHNOLOGY INC·Filed 2004·Granted Sep 16, 2008·30 cites·10 claims
- 2477US9411122B2Light field image capture device having 2D image capture modeLYTRO INC·Filed 2015·Granted Aug 9, 2016·2 cites·7 claims
- 2575US9077901B2Light field image capture device having 2D image capture modeLYTRO INC·Filed 2014·Granted Jul 7, 2015·2 cites·28 claims
- 2672US6701043B2Arrayed waveguide grating having a reflective input couplingJDS UNIPHASE INC·Filed 2001·Granted Mar 2, 2004·13 cites·21 claims
- 2770US11624914B2Systems and methods for minimally intrusive displaysFLIPPER INC·Filed 2019·Granted Apr 11, 2023·2 cites·20 claims
- 2870US10488667B1Systems and methods for minimally intrusive displaysFLIPPER INC·Filed 2018·Granted Nov 26, 2019·1 cites·24 claims
- 2968US10154197B2Image capture device having light field image capture mode, 2D image capture mode, and intermediate capture modeGOOGLE LLC·Filed 2016·Granted Dec 11, 2018·1 cites·28 claims
- 3068US7993944B2Microelectronic imagers with optical devices having integral reference features and methods for manufacturing such microelectronic imagersMICRON TECHNOLOGY INC·Filed 2008·Granted Aug 9, 2011·3 cites·38 claims
- 3165US7920339B2Method and apparatus providing singlet wafer lens system with field flattenerAPTINA IMAGING CORP·Filed 2008·Granted Apr 5, 2011·3 cites·12 claims
- 3264US10500770B2LED packaging with integrated optics and methods of manufacturing the sameOLIVER STEVEN D·Filed 2011·Granted Dec 10, 2019·1 cites·27 claims
- 3363US8513113B2Methods of forming semiconductor constructions and assembliesOLIVER STEVEN·Filed 2009·Granted Aug 20, 2013·2 cites·34 claims
- 3455US7429494B2Microelectronic imagers with optical devices having integral reference features and methods for manufacturing such microelectronic imagersMICRON TECHNOLOGY INC·Filed 2004·Granted Sep 30, 2008·5 cites·44 claims
- 3554US12131008B2Interpupillary distance and focal distance initialization for an e-readerSINDARIN INC·Filed 2022·Granted Oct 29, 2024·0 cites·22 claims
- 3653US7833601B2Methods for releasably attaching support members to microfeature workpieces and microfeature assemblies formed using such methodsMICRON TECHNOLOGY INC·Filed 2006·Granted Nov 16, 2010·0 cites·17 claims
- 3753US2008237443A1Microelectronic imagers with curved image sensors and methods for manufacturing microelectronic imagersOLIVER STEVEN D·Filed 2008·Application pending·0 cites
- 3851US6865323B2Athermal optical couplerJDS UNIPHASE CORP·Filed 2002·Granted Mar 8, 2005·7 cites·20 claims
- 3950US7864457B2Achromatic lens structure, method of fabrication, and imaging devices and systems using the sameMICRON TECHNOLOGY INC·Filed 2009·Granted Jan 4, 2011·0 cites·35 claims
- 4050US2020108528A1Led packaging with integrated optics and methods of manufacturing the sameOLIVER STEVEN D·Filed 2019·Application pending·0 cites
- 4150US2009321861A1Microelectronic imagers with stacked lens assemblies and processes for wafer-level packaging of microelectronic imagersMICRON TECHNOLOGY INC·Filed 2008·Application pending·0 cites
- 4249US2006275941A1Methods for manufacturing microelectronic imagersOLIVER STEVEN D·Filed 2006·Application pending·0 cites
- 4342US8792190B2Lens and method for manufacturing sameDUPARRÉ JACQUES·Filed 2011·Granted Jul 29, 2014·0 cites·12 claims
- 4441US2006177999A1Microelectronic workpieces and methods for forming interconnects in microelectronic workpiecesMICRON TECHNOLOGY INC·Filed 2005·Application pending·0 cites
- 4537US2016182786A1Hybrid light-field cameraLYTRO INC·Filed 2016·Application pending·0 cites
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