Inventor · disambiguated record
Yoshihisa Imori
Also filed as: IMORI YOSHIHISA
14 granted patents·3 pending applications·45 citations·filing 1993–2019
90Inventor score
Top patents by PatentIndex Score
17 records- 0184US7638858B2Semiconductor device and manufacturing method thereofTOSHIBA KK·Filed 2007·Granted Dec 29, 2009·8 cites·8 claims
- 0283US8338904B2Semiconductor device and method for manufacturing the sameTANIDA KAZUMASA·Filed 2010·Granted Dec 25, 2012·3 cites·11 claims
- 0381US7202563B2Semiconductor device package having a semiconductor element with resinTOSHIBA KK·Filed 2005·Granted Apr 10, 2007·7 cites·12 claims
- 0479US10790219B2Semiconductor package and method of manufacturing the sameTOSHIBA KK·Filed 2019·Granted Sep 29, 2020·2 cites·10 claims
- 0577US10340207B2Semiconductor package and method of manufacturing the sameTOSHIBA KK·Filed 2017·Granted Jul 2, 2019·2 cites·4 claims
- 0674US9887311B2Semiconductor module having a light-transmissive insulating bodyTOSHIBA KK·Filed 2016·Granted Feb 6, 2018·2 cites·20 claims
- 0769US7405159B2Method of fabricating a semiconductor device package having a semiconductor element with a roughened surfaceTOSHIBA KK·Filed 2007·Granted Jul 29, 2008·3 cites·22 claims
- 0868US7880301B2Semiconductor device and method for manufacturing the sameTOSHIBA KK·Filed 2007·Granted Feb 1, 2011·4 cites·7 claims
- 0968US7217640B2Semiconductor device and manufacturing method thereofTOSHIBA KK·Filed 2004·Granted May 15, 2007·10 cites·12 claims
- 1055US8084499B2Modified clay mineralOOTAKE SOUICHIROU·Filed 2008·Granted Dec 27, 2011·2 cites·12 claims
- 1152US7608911B2Semiconductor device package having a semiconductor element with a roughened surfaceTOSHIBA KK·Filed 2008·Granted Oct 27, 2009·0 cites·13 claims
- 1244US2008064186A1Manufacturing method of semiconductor elementTOSHIBA KK·Filed 2007·Application pending·0 cites
- 1340US10840166B2Semiconductor deviceTOSHIBA KK·Filed 2018·Granted Nov 17, 2020·0 cites·8 claims
- 1439US11264313B2Semiconductor device and method for manufacturing sameTOSHIBA KK·Filed 2019·Granted Mar 1, 2022·0 cites·12 claims
- 1539US2005202650A1Method of dividing a wafer which has a low-k film formed on dicing linesFiled 2005·Application pending·0 cites
- 1636US2003060024A1Method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2002·Application pending·0 cites
- 1732US5397453ASemiconductor product plating apparatusTOSHIBA KK·Filed 1993·Granted Mar 14, 1995·2 cites·8 claims
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