Inventor · disambiguated record
Masahiro Ichitani
Also filed as: ICHITANI MASAHIRO · TAKAHASHI NORIYUKI
53 granted patents·1 pending application·1,468 citations·filing 1989–2008
99Inventor score
Technology areasH10W
Files withHITACHI LTD37RENESAS TECH CORP10HITACHI HOKKAI SEMICONDUCTOR4HITACHI YONEZAWA ELECTRONICS1
Top patents by PatentIndex Score
54 records- 0198US5068712ASemiconductor deviceHITACHI LTD·Filed 1989·Granted Nov 26, 1991·165 cites·36 claims
- 0293US6596561B2Method of manufacturing a semiconductor device using reinforcing patterns for ensuring mechanical strength during manufactureHITACHI LTD·Filed 2001·Granted Jul 22, 2003·65 cites·35 claims
- 0392US6232650B1Semiconductor device having a chip mounted on a flexible substrate with separated insulation layers to prevent short-circuitingHITACHI LTD·Filed 1998·Granted May 15, 2001·94 cites·9 claims
- 0491US7015069B2Method of manufacturing a semiconductor device and a semiconductor deviceHITACHI YONEZAWA ELECTRONICS·Filed 2005·Granted Mar 21, 2006·22 cites·6 claims
- 0591US5571428ASemiconductor leadframe and its production method and plastic encapsulated semiconductor deviceHITACHI LTD·Filed 1995·Granted Nov 5, 1996·113 cites·3 claims
- 0690US5714405ASemiconductor deviceHITACHI LTD·Filed 1996·Granted Feb 3, 1998·98 cites·40 claims
- 0786US6340793B1Semiconductor deviceHITACHI LTD·Filed 2000·Granted Jan 22, 2002·37 cites·14 claims
- 0886US5530286ASemiconductor deviceHITACHI LTD·Filed 1994·Granted Jun 25, 1996·53 cites·6 claims
- 0985US5583375ASemiconductor device with lead structure within the planar area of the deviceHITACHI LTD·Filed 1992·Granted Dec 10, 1996·73 cites·39 claims
- 1084US6404049B1Semiconductor device, manufacturing method thereof and mounting boardHITACHI LTD·Filed 1996·Granted Jun 11, 2002·59 cites·30 claims
- 1184US5358904ASemiconductor deviceHITACHI LTD·Filed 1992·Granted Oct 25, 1994·47 cites·15 claims
- 1283US7286386B2Semiconductor deviceRENESAS TECH CORP·Filed 2006·Granted Oct 23, 2007·11 cites·12 claims
- 1383US5466888APackaged semiconductor device having stress absorbing filmHITACHI LTD·Filed 1995·Granted Nov 14, 1995·72 cites·6 claims
- 1482US6723583B2Method of manufacturing a semiconductor device using a moldRENESAS TECH CORP·Filed 2003·Granted Apr 20, 2004·25 cites·22 claims
- 1580US6326681B1Semiconductor deviceHITACHI LTD·Filed 2000·Granted Dec 4, 2001·14 cites·14 claims
- 1680US5793099ASemiconductor deviceHITACHI LTD·Filed 1996·Granted Aug 11, 1998·30 cites·12 claims
- 1779US6512176B2Semiconductor deviceHITACHI LTD·Filed 2002·Granted Jan 28, 2003·23 cites·18 claims
- 1879US6081023ASemiconductor deviceHITACHI LTD·Filed 1999·Granted Jun 27, 2000·28 cites·13 claims
- 1978US5612569ASemiconductor deviceHITACHI LTD·Filed 1995·Granted Mar 18, 1997·35 cites·9 claims
- 2076US7061785B2Stacked large-scale integrated circuit (LSI) semiconductor device with miniaturization and thinning of packageRENESAS TECH CORP·Filed 2003·Granted Jun 13, 2006·21 cites·10 claims
- 2176US5437915ASemiconductor leadframe and its production method and plastic encapsulated semiconductor deviceHITACHI LTD·Filed 1994·Granted Aug 1, 1995·47 cites·4 claims
- 2275US6764878B2Method of manufacturing a resin encapsulated semiconductor device to provide a vent hole in a base substrateRENESAS TECH CORP·Filed 2002·Granted Jul 20, 2004·13 cites·8 claims
- 2374US6303982B2Semiconductor deviceHITACHI LTD·Filed 2001·Granted Oct 16, 2001·10 cites·28 claims
- 2474US5252854ASemiconductor device having stacked lead structureHITACHI LTD·Filed 1991·Granted Oct 12, 1993·51 cites·44 claims
- 2572US6872597B2Method of manufacturing a semiconductor device and a semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted Mar 29, 2005·13 cites·15 claims
- 2670US6621160B2Semiconductor device and mounting boardHITACHI LTD·Filed 2002·Granted Sep 16, 2003·13 cites·1 claims
- 2770US6590275B2Ball grid array type semiconductor package having a flexible substrateHITACHI LTD·Filed 2002·Granted Jul 8, 2003·10 cites·15 claims
- 2869US6563212B2Semiconductor deviceHITACHI LTD·Filed 2002·Granted May 13, 2003·12 cites·2 claims
- 2969US6130114ASemiconductor deviceHITACHI LTD·Filed 1999·Granted Oct 10, 2000·17 cites·22 claims
- 3069US6018191ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Jan 25, 2000·18 cites·23 claims
- 3168US6437428B1Ball grid array type semiconductor package having a flexible substrateHITACHI HOKKAI SEMICONDUCTOR·Filed 2000·Granted Aug 20, 2002·9 cites·2 claims
- 3267US6531760B1Semiconductor deviceFiled 2000·Granted Mar 11, 2003·6 cites·8 claims
- 3367US5914530ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Jun 22, 1999·15 cites·12 claims
- 3466US7479705B2Semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted Jan 20, 2009·15 cites·9 claims
- 3563US6100580ASemiconductor device having all outer leads extending from one side of a resin memberHITACHI LTD·Filed 1998·Granted Aug 8, 2000·17 cites·19 claims
- 3663US6069029ASemiconductor device chip on lead and lead on chip manufacturingHITACHI LTD·Filed 1998·Granted May 30, 2000·13 cites·36 claims
- 3761US6072231ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Jun 6, 2000·12 cites·40 claims
- 3860US6887739B2Method of manufacturing semiconductor package including forming a resin sealing memberHITACHI HOKKAI SEMICONDUCTOR·Filed 2003·Granted May 3, 2005·5 cites·9 claims
- 3958US5406028APackaged semiconductor device having stress absorbing filmHITACHI LTD·Filed 1994·Granted Apr 11, 1995·24 cites·9 claims
- 4057US7615872B2Semiconductor deviceRENESAS TECH CORP·Filed 2008·Granted Nov 10, 2009·1 cites·7 claims
- 4157US6476466B2Ball grid array type semiconductor package having a flexible substrateHITACHI HOKKAI SEMICONDUCTOR·Filed 2002·Granted Nov 5, 2002·4 cites·1 claims
- 4257US6448111B1Method of manufacturing a semiconductor deviceHITACHI HOKKAI SEMICONDUCTOR·Filed 2000·Granted Sep 10, 2002·4 cites·7 claims
- 4353US6720208B2Semiconductor deviceRENESAS TECH CORP·Filed 2002·Granted Apr 13, 2004·2 cites·13 claims
- 4451US5981315ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Nov 9, 1999·7 cites·37 claims
- 4551US5821606ASemiconductor deviceHITACHI LTD·Filed 1997·Granted Oct 13, 1998·9 cites·45 claims
- 4650US6759279B2Method of manufacturing semiconductor device having resin sealing bodyRENESAS TECH CORP·Filed 2002·Granted Jul 6, 2004·2 cites·6 claims
- 4750US5863817ASemiconductor deviceHITACHI LTD·Filed 1998·Granted Jan 26, 1999·7 cites·23 claims
- 4848US5869888ASemiconductor device with lead structure on principal surface of chipHITACHI LTD·Filed 1996·Granted Feb 9, 1999·12 cites·9 claims
- 4944US6919622B2Semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted Jul 19, 2005·0 cites·6 claims
- 5041US6204552B1Semiconductor deviceHITACHI LTD·Filed 2000·Granted Mar 20, 2001·0 cites·15 claims
Showing the top 50 of 54 patent records by PatentIndex Score.
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