Inventor · disambiguated record
Takao Matsuura
Also filed as: MATSUURA TAKAO
9 granted patents·1 pending application·165 citations·filing 2000–2010
89Inventor score
Top patents by PatentIndex Score
10 records- 0193US6596561B2Method of manufacturing a semiconductor device using reinforcing patterns for ensuring mechanical strength during manufactureHITACHI LTD·Filed 2001·Granted Jul 22, 2003·65 cites·35 claims
- 0291US7015069B2Method of manufacturing a semiconductor device and a semiconductor deviceHITACHI YONEZAWA ELECTRONICS·Filed 2005·Granted Mar 21, 2006·22 cites·6 claims
- 0386US6399423B2Semiconductor device an a method of manufacturing the sameHITACHI LTD·Filed 2000·Granted Jun 4, 2002·35 cites·13 claims
- 0482US6723583B2Method of manufacturing a semiconductor device using a moldRENESAS TECH CORP·Filed 2003·Granted Apr 20, 2004·25 cites·22 claims
- 0572US6872597B2Method of manufacturing a semiconductor device and a semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted Mar 29, 2005·13 cites·15 claims
- 0647US6590276B2Semiconductor device and a method of manufacturing the sameHITACHI LTD·Filed 2002·Granted Jul 8, 2003·2 cites·2 claims
- 0746US6897097B2Semiconductor device and a method of manufacturing the sameHITACHI YONEZAWA ELECTRONICS·Filed 2003·Granted May 24, 2005·2 cites·10 claims
- 0845US6667193B2Semiconductor device and a method of manufacturing the sameHITACHI LTD·Filed 2002·Granted Dec 23, 2003·1 cites·4 claims
- 0935US8105878B2Manufacturing method of a semiconductor device having a package dicingHARADA HARUHIKO·Filed 2007·Granted Jan 31, 2012·0 cites·4 claims
- 1033US2011291692A1Method and apparatus for inspecting semiconductor using absorbed current imageANDO TOHRU·Filed 2010·Application pending·0 cites
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