Inventor · disambiguated record
Eric M. Prophet
Also filed as: PROPHET ERIC · PROPHET ERIC M
11 granted patents·1 pending application·164 citations·filing 2001–2021
89Inventor score
Top patents by PatentIndex Score
12 records- 0196US9337124B1Method of integration of wafer level heat spreaders and backside interconnects on microelectronics wafersHRL LAB LLC·Filed 2014·Granted May 10, 2016·34 cites·33 claims
- 0295US10079160B1Surface mount package for semiconductor devices with embedded heat spreadersHRL LAB LLC·Filed 2014·Granted Sep 18, 2018·21 cites·31 claims
- 0392US6788175B1Anchors for micro-electro-mechanical systems (MEMS) devicesSUPERCONDUCTOR TECH·Filed 2001·Granted Sep 7, 2004·56 cites·25 claims
- 0484US6924966B2Spring loaded bi-stable MEMS switchSUPERCONDUCTOR TECH·Filed 2002·Granted Aug 2, 2005·29 cites·55 claims
- 0583US9641156B1Active circulator with cascode transistorHRL LAB LLC·Filed 2015·Granted May 2, 2017·4 cites·22 claims
- 0671US7894867B2Zig-zag array resonators for relatively high-power HTS applicationsSUPERCONDUCTOR TECH·Filed 2008·Granted Feb 22, 2011·4 cites·23 claims
- 0768US6876046B2Stiction alleviation using passivation layer patterningSUPERCONDUCTOR TECH·Filed 2002·Granted Apr 5, 2005·15 cites·18 claims
- 0859US9893401B2Effective biasing active circulator with RF choke conceptHRL LAB LLC·Filed 2014·Granted Feb 13, 2018·1 cites·28 claims
- 0952US10950562B1Impedance-matched through-wafer transition using integrated heat-spreader technologyHRL LAB LLC·Filed 2019·Granted Mar 16, 2021·0 cites·20 claims
- 1049US11756783B1Method for creating cavities in silicon carbide and other semiconductor substratesHRL LAB LLC·Filed 2021·Granted Sep 12, 2023·0 cites·24 claims
- 1144US9553057B1E-plane probe with stepped surface profile for high-frequencyHRL LAB LLC·Filed 2014·Granted Jan 24, 2017·0 cites·23 claims
- 1240US2010073107A1Micro-miniature monolithic electromagnetic resonatorsSUPERCONDUCTOR TECH·Filed 2009·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →