Inventor · disambiguated record
Shin Takanezawa
Also filed as: TAKANEZAWA SHIN
29 granted patents·4 pending applications·334 citations·filing 1986–2025
96Inventor score
Top patents by PatentIndex Score
33 records- 0194US5153987AProcess for producing printed wiring boardsHITACHI CHEMICAL CO LTD·Filed 1989·Granted Oct 13, 1992·85 cites·12 claims
- 0286US5309632AProcess for producing printed wiring boardHITACHI CHEMICAL CO LTD·Filed 1992·Granted May 10, 1994·66 cites·9 claims
- 0383US5874009AMultilayer printed circuit board with epoxy resin and carboxylated rubber as adhesiveHITACHI CHEMICAL CO LTD·Filed 1995·Granted Feb 23, 1999·50 cites·3 claims
- 0480US7740936B2Adhesion assisting agent fitted metal foil, and printed wiring board using thereofHITACHI CHEMICAL CO LTD·Filed 2005·Granted Jun 22, 2010·11 cites·24 claims
- 0579US5935452AResin composition and its use in production of multilayer printed circuit boardHITACHI CHEMICAL CO LTD·Filed 1998·Granted Aug 10, 1999·33 cites·4 claims
- 0676US11432400B2Interlayer insulating film and method for producing sameHITACHI CHEMICAL CO LTD·Filed 2017·Granted Aug 30, 2022·2 cites·19 claims
- 0774US10119047B2Thermosetting resin composition, and prepreg, insulating film with support, laminate plate, and printed wiring board, each obtained using sameHITACHI CHEMICAL CO LTD·Filed 2015·Granted Nov 6, 2018·1 cites·22 claims
- 0871US7572503B2Method for preparing an insulating resin composition, insulating resin composition, multilayer wiring board and process for producing the sameHITACHI CHEMICAL CO LTD·Filed 2005·Granted Aug 11, 2009·4 cites·9 claims
- 0970US12256490B2Prepreg, laminate, and production methods therefor, as well as printed circuit board and semiconductor packageHITACHI CHEMICAL CO LTD·Filed 2018·Granted Mar 18, 2025·0 cites·16 claims
- 1068US6979712B2Method for preparing an insulating resin composition, insulating resin composition, multilayer wiring board and process for producing the sameHITACHI CHEMICAL CO LTD·Filed 2004·Granted Dec 27, 2005·11 cites·4 claims
- 1167US11319457B2Support-provided insulating layer, laminate, and wiring boardHITACHI CHEMICAL CO LTD·Filed 2019·Granted May 3, 2022·0 cites·19 claims
- 1267US9079376B2Prepreg, laminate obtained with the same and printed-wiring boardKOTAKE TOMOHIKO·Filed 2012·Granted Jul 14, 2015·1 cites·22 claims
- 1367US6156870AResin composition which can be cured by application of heat or irradiation of light, film, laminate and production of multilayer wiring boardHITACHI CHEMICAL CO LTD·Filed 1998·Granted Dec 5, 2000·22 cites·35 claims
- 1466US2025234456A1Prepreg, laminate, and production methods therefor, as well as printed circuit board and semiconductor packageRESONAC CORP·Filed 2025·Application pending·0 cites
- 1563US7700185B2Insulation material, film, circuit board and method of producing themHITACHI CHEMICAL CO LTD·Filed 2004·Granted Apr 20, 2010·9 cites·49 claims
- 1662US7629045B2Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2005·Granted Dec 8, 2009·2 cites·19 claims
- 1757US10465089B2Varnish, prepreg, film with resin, metal foil-clad laminate, and printed circuit boardHITACHI CHEMICAL CO LTD·Filed 2018·Granted Nov 5, 2019·0 cites·22 claims
- 1855US10681807B2Coreless substrate prepreg, coreless substrate, coreless substrate manufacturing method and semiconductor packageHITACHI CHEMICAL CO LTD·Filed 2018·Granted Jun 9, 2020·0 cites·9 claims
- 1954US8815334B2Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring boardTAKAI KENJI·Filed 2009·Granted Aug 26, 2014·0 cites·7 claims
- 2053US7862889B2Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring boardHITACHI CHEMICAL CO LTD·Filed 2009·Granted Jan 4, 2011·0 cites·18 claims
- 2152US10323126B2Siloxane compound, modified imide resin, thermosetting resin composition, prepreg, film with resin, laminated plate, multilayer printed wiring board, and semiconductor packageHITACHI CHEMICAL CO LTD·Filed 2013·Granted Jun 18, 2019·0 cites·17 claims
- 2252US9133308B2Resin composition, and printed wiring board, laminated sheet, and prepreg using sameNAGAI SHUNSUKE·Filed 2012·Granted Sep 15, 2015·0 cites·17 claims
- 2350US11581212B2Prepreg for coreless substrate, coreless substrate and semiconductor packageHITACHI CHEMICAL CO LTD·Filed 2018·Granted Feb 14, 2023·0 cites·12 claims
- 2448US5053280AAdhesive composition for printed wiring boards with acrylonitrile-butadiene rubber having carboxyl groups and 20 ppm or less metal ionic impurities; an alkyl phenol resin; an epoxy resin; palladium catalyst, and coupling agentHITACHI CHEMICAL CO LTD·Filed 1989·Granted Oct 1, 1991·13 cites·4 claims
- 2548US2012077401A1Resin composition for production of clad layer, resin film for production of clad layer utilizing the resin composition, and optical waveguide and optical module each utilizing the resin composition or the resin filmKOTAKE TOMOHIKO·Filed 2010·Application pending·0 cites
- 2647US2016083614A1Varnish, prepreg, film with resin, metal foil-clad laminate, and printed circuit boardHITACHI CHEMICAL CO LTD·Filed 2015·Application pending·0 cites
- 2746US9265145B2Varnish, prepreg, film with resin, metal foil-clad laminate, and printed circuit boardMORITA KOUJI·Filed 2010·Granted Feb 16, 2016·0 cites·6 claims
- 2846US2013199830A1Resin composition, cured resin product, wiring board, and manufacturing method for wiring boardMORITA MASAKI·Filed 2011·Application pending·0 cites
- 2944US4837086AAdhesive clad insulating substrate used for producing printed circuit boardsHITACHI CHEMICAL CO LTD·Filed 1986·Granted Jun 6, 1989·9 cites·6 claims
- 3043US9078365B2Resin composition, prepreg, laminate, and wiring boardMORITA KOJI·Filed 2007·Granted Jul 7, 2015·0 cites·11 claims
- 3143US5419946AAdhesive for printed wiring board and production thereofHITACHI CHEMICAL CO LTD·Filed 1994·Granted May 30, 1995·15 cites·9 claims
- 3242US8735733B2Resin composition, prepreg laminate obtained with the same and printed-wiring boardMIYATAKE MASATO·Filed 2012·Granted May 27, 2014·0 cites·16 claims
- 3341US11401381B2Modified silicone compound, and thermosetting resin composition, prepreg, laminate plate and printed wiring board using sameKOTAKE TOMOHIKO·Filed 2012·Granted Aug 2, 2022·0 cites·17 claims
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