Inventor · disambiguated record
Wei-Chi Cheng
Also filed as: CHENG WEI · CHENG WEI-CHI
22 granted patents·6 pending applications·92 citations·filing 2013–2025
94Inventor score
Top patents by PatentIndex Score
28 records- 0198US9735047B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Aug 15, 2017·30 cites·10 claims
- 0295US11200413B2Table recognition in portable document format documentsIBM·Filed 2018·Granted Dec 14, 2021·25 cites·20 claims
- 0388US12328922B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Granted Jun 10, 2025·0 cites·9 claims
- 0488US10546922B2Method for fabricating cap layer on an epitaxial layerUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jan 28, 2020·4 cites·13 claims
- 0588US9916978B2Method for fabricating a Fin field effect transistor (FinFET)UNITED MICROELECTRONICS CORP·Filed 2016·Granted Mar 13, 2018·5 cites·21 claims
- 0687US10008569B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Jun 26, 2018·3 cites·9 claims
- 0786US9685385B1Method of fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2016·Granted Jun 20, 2017·4 cites·18 claims
- 0886US2025275202A1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0984US9847398B1Semiconductor device with gate structure having dielectric layer on one side and contact plug on the other sideUNITED MICROELECTRONICS CORP·Filed 2016·Granted Dec 19, 2017·4 cites·9 claims
- 1082US10566285B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Feb 18, 2020·3 cites·9 claims
- 1179US9431256B2Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2013·Granted Aug 30, 2016·5 cites·7 claims
- 1278US8921913B1Floating gate forming processUNITED MICROELECTRONICS CORP·Filed 2013·Granted Dec 30, 2014·4 cites·11 claims
- 1377US11948975B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Apr 2, 2024·0 cites·9 claims
- 1469US11189695B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Nov 30, 2021·0 cites·9 claims
- 1569US9929234B2Semiconductor device having a cap layer with V-shapeUNITED MICROELECTRONICS CORP·Filed 2016·Granted Mar 27, 2018·1 cites·8 claims
- 1667US9023726B1Method of fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2013·Granted May 5, 2015·2 cites·20 claims
- 1765US9711394B1Method for cleaning the surface of an epitaxial layer in openings of semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2016·Granted Jul 18, 2017·1 cites·11 claims
- 1864US10541304B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jan 21, 2020·0 cites·10 claims
- 1963US10978398B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Apr 13, 2021·0 cites·11 claims
- 2060US9401280B2Semiconductor processUNITED MICROELECTRONICS CORP·Filed 2014·Granted Jul 26, 2016·1 cites·18 claims
- 2159US12477740B2Semiconductor memory structure and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2021·Granted Nov 18, 2025·0 cites·6 claims
- 2257US10062604B2Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Aug 28, 2018·0 cites·7 claims
- 2354US2024081158A1Rram structure and fabricating method of the sameUNITED MICROELECTRONICS CORP·Filed 2022·Application pending·0 cites
- 2450US2021089992A1Method for automated code reviewer recommendationNEC LAB AMERICA INC·Filed 2020·Application pending·0 cites
- 2545US9111796B2Semiconductor structure and layout structure for memory devicesUNITED MICROELECTRONICS CORP·Filed 2014·Granted Aug 18, 2015·0 cites·18 claims
- 2642US2023051313A1Method and system for analyzing specification parameter of electronic component, computer program product with stored program, and computer readable medium with stored programFOOTPRINTKU INC·Filed 2021·Application pending·0 cites
- 2741US2015249158A1Semiconductor structure and method for manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 2837US2016358827A1Method of forming fin-shaped structureUNITED MICROELECTRONICS CORP·Filed 2016·Application pending·0 cites
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