Inventor · disambiguated record
Tomoya Oohiraki
Also filed as: OOHIRAKI TOMOYA
16 granted patents·3 pending applications·18 citations·filing 2014–2022
88Inventor score
Files withMITSUBISHI MATERIALS CORP19
Top patents by PatentIndex Score
19 records- 0184US10607915B2Joined body manufacturing method, multilayer joined body manufacturing method, power-module substrate manufacturing method, heat sink equipped power-module substrate manufacturing method, and laminated body manufacturing deviceMITSUBISHI MATERIALS CORP·Filed 2015·Granted Mar 31, 2020·3 cites·18 claims
- 0282US10211068B2Power-module substrate with cooler and method of producing the sameMITSUBISHI MATERIALS CORP·Filed 2015·Granted Feb 19, 2019·4 cites·5 claims
- 0378US11476127B2Manufacturing method of electronic-component-mounted moduleMITSUBISHI MATERIALS CORP·Filed 2018·Granted Oct 18, 2022·3 cites·12 claims
- 0475US10032648B2Method of manufacturing power-module substrate with heat-sinkMITSUBISHI MATERIALS CORP·Filed 2014·Granted Jul 24, 2018·4 cites·3 claims
- 0569US11908768B2Method of manufacturing bonded body for insulation circuit substrate board and bonded body for insulation circuit substrate boardMITSUBISHI MATERIALS CORP·Filed 2022·Granted Feb 20, 2024·0 cites·1 claims
- 0663US10453772B2Heat-sink-attached power-module substrate and power moduleMITSUBISHI MATERIALS CORP·Filed 2016·Granted Oct 22, 2019·1 cites·20 claims
- 0763US2022223493A1Insulation circuit board with heat sinkMITSUBISHI MATERIALS CORP·Filed 2022·Application pending·0 cites
- 0861US9837363B2Power-module substrate unit and power moduleMITSUBISHI MATERIALS CORP·Filed 2015·Granted Dec 5, 2017·1 cites·9 claims
- 0960US10068829B2Power-module substrate unit and power moduleMITSUBISHI MATERIALS CORP·Filed 2015·Granted Sep 4, 2018·1 cites·16 claims
- 1059US9579739B2Manufacturing method of power-module substrateMITSUBISHI MATERIALS CORP·Filed 2014·Granted Feb 28, 2017·1 cites·4 claims
- 1155US11289400B2Method of manufacturing bonded body for insulation circuit substrate board and bonded body for insulation circuit substrate boardMITSUBISHI MATERIALS CORP·Filed 2019·Granted Mar 29, 2022·0 cites·26 claims
- 1254US11322424B2Insulation circuit board with heat sinkMITSUBISHI MATERIALS CORP·Filed 2019·Granted May 3, 2022·0 cites·5 claims
- 1349US11676882B2Method of manufacturing power module substrate board and ceramic-copper bonded bodyMITSUBISHI MATERIALS CORP·Filed 2019·Granted Jun 13, 2023·0 cites·3 claims
- 1447US11289390B2Insulation circuit board with heat sinkMITSUBISHI MATERIALS CORP·Filed 2019·Granted Mar 29, 2022·0 cites·10 claims
- 1542US2020413534A1Insulated circuit boardMITSUBISHI MATERIALS CORP·Filed 2019·Application pending·0 cites
- 1641US11355415B2Heat sink-attached power module substrate board and power moduleMITSUBISHI MATERIALS CORP·Filed 2019·Granted Jun 7, 2022·0 cites·6 claims
- 1741US11315868B2Electronic-component-mounted module design to reduce linear expansion coefficient mismatchesMITSUBISHI MATERIALS CORP·Filed 2018·Granted Apr 26, 2022·0 cites·6 claims
- 1837US11735434B2Method for producing insulating circuit substrate with heat sinkMITSUBISHI MATERIALS CORP·Filed 2018·Granted Aug 22, 2023·0 cites·7 claims
- 1933US2017229320A1Producing method of power-module substrateMITSUBISHI MATERIALS CORP·Filed 2015·Application pending·0 cites
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