Inventor · disambiguated record
Kyung Wook Paik
Also filed as: PAIK KYUNG W · PAIK KYUNG-WOOK
22 granted patents·8 pending applications·1,000 citations·filing 1990–2019
97Inventor score
Files withKOREA ADVANCED INST SCI & TECH11GEN ELECTRIC6PAIK KYUNG-WOOK3HYUNDAI ELECTRONICS IND2KIM DEOK-HOON2
Top patents by PatentIndex Score
30 records- 0196US6238597B1Preparation method of anisotropic conductive adhesive for flip chip interconnection on organic substrateKOREA ADVANCED INST SCI & TECH·Filed 2000·Granted May 29, 2001·133 cites·5 claims
- 0295US5849623AMethod of forming thin film resistors on organic surfacesGEN ELECTRIC·Filed 1997·Granted Dec 15, 1998·183 cites·5 claims
- 0395US5675310AThin film resistors on organic surfacesGEN ELECTRIC·Filed 1994·Granted Oct 7, 1997·165 cites·9 claims
- 0487US6362090B1Method for forming flip chip bump and UBM for high speed copper interconnect chip using electroless plating methodKOREA ADVANCED INST SCI & TECH·Filed 2000·Granted Mar 26, 2002·50 cites·4 claims
- 0587US5879964AMethod for fabricating chip size packages using lamination processKOREA ADVANCED INST SCI & TECH·Filed 1998·Granted Mar 9, 1999·94 cites·1 claims
- 0686US7446384B2CMOS image sensor module with wafersKOREA ADVANCED INST SCI & TECH·Filed 2006·Granted Nov 4, 2008·15 cites·9 claims
- 0786US6878435B2High adhesion triple layered anisotropic conductive adhesive filmKOREA ADVANCED INST SCI & TECH·Filed 2002·Granted Apr 12, 2005·46 cites·6 claims
- 0884US6188129B1Stacked semiconductor chip package having external terminal pads and stackable chips having a protection layerHYUNDAI ELECTRONICS IND·Filed 1998·Granted Feb 13, 2001·76 cites·16 claims
- 0979US5352629AProcess for self-alignment and planarization of semiconductor chips attached by solder die adhesive to multi-chip modulesGEN ELECTRIC·Filed 1993·Granted Oct 4, 1994·63 cites·12 claims
- 1078US5418002ADirect bonding of copper to aluminum nitride substratesHARRIS CORP·Filed 1990·Granted May 23, 1995·29 cites·22 claims
- 1176US9376541B2Non-conductive film and non-conductive paste including zinc particles, semiconductor package including the same, and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jun 28, 2016·4 cites·12 claims
- 1275US8486318B2Fiber, fiber aggregate and adhesive having the sameKIM DEOK HOON·Filed 2011·Granted Jul 16, 2013·2 cites·19 claims
- 1375US5653841AFabrication of compact magnetic circulator components in microwave packages using high density interconnectionsMARTIN MARIETTA CORP·Filed 1995·Granted Aug 5, 1997·30 cites·8 claims
- 1474US6930399B2High reliability non-conductive adhesives for non-solder flip chip bondings and flip chip bonding method using the sameTELEPHUS INC·Filed 2001·Granted Aug 16, 2005·11 cites·7 claims
- 1566US6124149AMethod of making stackable semiconductor chips to build a stacked chip moduleHYUNDAI ELECTRONICS IND·Filed 1998·Granted Sep 26, 2000·38 cites·18 claims
- 1656US5206186AMethod for forming semiconductor electrical contacts using metal foil and thermocompression bondingGEN ELECTRIC·Filed 1992·Granted Apr 27, 1993·24 cites·7 claims
- 1752US5776275AFabrication of compact magnetic circulator components in microwave packages using high density interconnectionsMARTIN MARIETTA CORP·Filed 1996·Granted Jul 7, 1998·13 cites·12 claims
- 1850US6514560B2Method for manufacturing conductive adhesive for high frequency flip chip package applicationsKOREA ADVANCED INST SCI & TECH·Filed 2002·Granted Feb 4, 2003·4 cites·10 claims
- 1949US7381468B2Polymer/ceramic composite paste for embedded capacitor and method for fabricating capacitor using sameKOREA ADVANCED INST SCI & TECH·Filed 2004·Granted Jun 3, 2008·3 cites·13 claims
- 2048US2012231689A1Fiber, fiber aggregate and adhesive having the sameKIM DEOK HOON·Filed 2011·Application pending·0 cites
- 2147US11472933B2Method of uniformly dispersing nickel-plated conductive particles of single layer within polymer film by applying magnetic field to polymer film and method of fabricating anisotropic conductive film using the sameKOREA ADVANCED INST SCI & TECH·Filed 2019·Granted Oct 18, 2022·0 cites·21 claims
- 2245US2009042336A1Fabrication method of an organic substrate having embedded active-chipsPAIK KYUNG-WOOK·Filed 2008·Application pending·0 cites
- 2344US2013118672A1Substrate bonding methodPARK HO JOON·Filed 2012·Application pending·0 cites
- 2444US2009029504A1Wafer-level aca flip chip package using double-layered aca/ncaKOREA ADVANCED INST SCI & TECH·Filed 2008·Application pending·0 cites
- 2544US2007259515A1Method for manufacturing wafer-level packages for flip chips capable of preventing adhesives from absorbing waterKOREA ADVANCED INST SCI & TECH·Filed 2007·Application pending·0 cites
- 2642US2007054419A1Wafer level chip size package for CMOS image sensor module and manufacturing method thereofPAIK KYUNG-WOOK·Filed 2006·Application pending·0 cites
- 2741US5184206ADirect thermocompression bonding for thin electronic power chipsGEN ELECTRIC·Filed 1990·Granted Feb 2, 1993·12 cites·9 claims
- 2840US2012118480A1Anisotropic conductive adhesive for ultrasonic wave adhesion, and electronic parts connection method using samePAIK KYUNG-WOOK·Filed 2012·Application pending·0 cites
- 2938US2003008133A1Anisotropic conductive film and method of fabricating the same for ultra-fine pitch COG applicationKOREA ADVANCED INST SCI & TECH·Filed 2002·Application pending·0 cites
- 3034US5304847ADirect thermocompression bonding for thin electronic power chipsGEN ELECTRIC·Filed 1993·Granted Apr 19, 1994·5 cites·3 claims
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