Inventor · disambiguated record
Jumpei Konno
Also filed as: KONNO JUMPEI
8 granted patents·3 pending applications·15 citations·filing 2004–2017
80Inventor score
Technology areasH10W
Files withRENESAS ELECTRONICS CORP4KONNO JUMPEI2HATA HANAE1RENEASAS ELECTRONICS CORP1RENESAS TECH CORP1
Top patents by PatentIndex Score
11 records- 0177US9349678B2Chip having a pillar electrode offset from the bonding padRENESAS ELECTRONICS CORP·Filed 2015·Granted May 24, 2016·3 cites·18 claims
- 0275US9455240B2Method of manufacturing semiconductor device and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted Sep 27, 2016·4 cites·13 claims
- 0365US8534532B2Method of manufacturing semiconductor deviceKONNO JUMPEI·Filed 2012·Granted Sep 17, 2013·2 cites·17 claims
- 0465US7598121B2Method of manufacturing a semiconductor deviceRENESAS TECH CORP·Filed 2007·Granted Oct 6, 2009·3 cites·19 claims
- 0564US8633103B2Semiconductor device and manufacturing method of the sameHATA HANAE·Filed 2010·Granted Jan 21, 2014·3 cites·4 claims
- 0655US9818678B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Nov 14, 2017·0 cites·19 claims
- 0747US8701972B2Method of manufacturing semiconductor deviceRENEASAS ELECTRONICS CORP·Filed 2013·Granted Apr 22, 2014·0 cites·20 claims
- 0843US2014312498A1Semiconductor device and method of manufacturing sameRENESAS ELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 0940US10199562B2Electronic device and method of fabricating the sameTAIYO YUDEN KK·Filed 2017·Granted Feb 5, 2019·0 cites·9 claims
- 1039US2005140023A1Method of manufacturing a semiconductor deviceFiled 2004·Application pending·0 cites
- 1135US2015236003A1Method of manufacturing semiconductor deviceKONNO JUMPEI·Filed 2012·Application pending·0 cites
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