Inventor · disambiguated record
Doo Sung Jung
Also filed as: JUNG DOO SUNG
7 granted patents·3 pending applications·53 citations·filing 2009–2019
80Inventor score
Top patents by PatentIndex Score
10 records- 0196US9425200B2Semiconductor device including air gaps and method for fabricating the sameSK HYNIX INC·Filed 2014·Granted Aug 23, 2016·42 cites·21 claims
- 0292US10411014B2Semiconductor device including air gaps and method for fabricating the sameSK HYNIX INC·Filed 2016·Granted Sep 10, 2019·7 cites·10 claims
- 0382US11296088B2Semiconductor device including air gaps and method for fabricating the sameSK HYNIX INC·Filed 2019·Granted Apr 5, 2022·2 cites·15 claims
- 0472US9236182B2Common mode filterSAMSUNG ELECTRO MECH·Filed 2014·Granted Jan 12, 2016·2 cites·20 claims
- 0550US9502173B2Shield part, method of fabricating the same, and contactless power transmission device having the shield partSAMSUNG ELECTRO MECH·Filed 2013·Granted Nov 22, 2016·0 cites·9 claims
- 0650US2015111164A1Ceramic substrate, firing setter, and manufacturing method of ceramic substrate using the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 0749US9761371B2Coil type unit for wireless power transmission, wireless power transmission device, electronic device and manufacturing method of coil type unit for wireless power transmissionSAMSUNG ELECTRO MECH·Filed 2014·Granted Sep 12, 2017·0 cites·5 claims
- 0848US10186875B2Coil type unit for wireless power transmission, wireless power transmission device, electronic device and manufacturing method of coil type unit for wireless power transmissionSAMSUNG ELECTRO MECH·Filed 2014·Granted Jan 22, 2019·0 cites·11 claims
- 0945US2011097856A1Method of manufacturing wafer level packageKIM HONG WON·Filed 2009·Application pending·0 cites
- 1040US2014186651A1Printed circuit board having copper plated layer with roughness and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
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