Inventor · disambiguated record
Heiko Specht
Also filed as: SPECHT HEIKO
30 granted patents·14 pending applications·232 citations·filing 2003–2023
96Inventor score
Files withHERAEUS DEUTSCHLAND GMBH & CO KG13HERAEUS GMBH W C10SPECHT HEIKO8HERAEUS PRECIOUS METALS GMBH6SCHIEFER HERWIG3
Top patents by PatentIndex Score
44 records- 0196US8755887B2Cermet-containing bushing for an implantable medical deviceTROETZSCHEL JENS·Filed 2010·Granted Jun 17, 2014·36 cites·9 claims
- 0294US9032614B2Method for manufacturing an electrical bushing for an implantable medical deviceSPECHT HEIKO·Filed 2012·Granted May 19, 2015·24 cites·9 claims
- 0392US9552899B2Ceramic bushing for an implantable medical deviceHERAEUS PRECIOUS METALS GMBH·Filed 2015·Granted Jan 24, 2017·18 cites·14 claims
- 0487US8929987B2Electrical bushing for an implantable medical deviceTROETZSCHEL JENS·Filed 2010·Granted Jan 6, 2015·35 cites·10 claims
- 0586US9855420B2Medical implantHERAEUS PRECIOUS METALS GMBH·Filed 2015·Granted Jan 2, 2018·2 cites·19 claims
- 0684US9480168B2Method of producing a cermet-containing bushing for an implantable medical deviceHERAEUS PRECIOUS METALS GMBH·Filed 2014·Granted Oct 25, 2016·17 cites·6 claims
- 0783US11806142B2Method for the manufacture of precious metal electrodesHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2020·Granted Nov 7, 2023·2 cites·13 claims
- 0879US10290400B2Method of producing a cermet-containing bushing for an implantable medical deviceHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2016·Granted May 14, 2019·3 cites·10 claims
- 0979US8394170B2Use of powder-metallurgical pre-material for producing an NB alloy that is free of inclusionsSCHIEFER HERWIG·Filed 2010·Granted Mar 12, 2013·2 cites·12 claims
- 1079US7687102B2Methods and apparatus for producing carbon cathodesMEDTRONIC INC·Filed 2004·Granted Mar 30, 2010·17 cites·32 claims
- 1175US10487377B2Cr, Ni, Mo and Co alloy for use in medical devicesHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2016·Granted Nov 26, 2019·4 cites·10 claims
- 1274US2023340654A1Method for manufacturing a biocompatible wireHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2023·Application pending·0 cites
- 1372US8487210B2Joined dissimilar materials and methodSPECHT HEIKO·Filed 2010·Granted Jul 16, 2013·9 cites·12 claims
- 1468US8636825B2Melting method for producing an inclusion-free Ta-base alloySCHIEFER HERWIG·Filed 2011·Granted Jan 28, 2014·1 cites·11 claims
- 1567US11697869B2Method for manufacturing a biocompatible wireHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2020·Granted Jul 11, 2023·0 cites·6 claims
- 1667US10092766B2Capacitor and method to manufacture the capacitorHERAEUS PRECIOUS METALS GMBH·Filed 2012·Granted Oct 9, 2018·1 cites·17 claims
- 1764US8778262B2Alloy having reduced inclusionsHERAEUS PRECIOUS METALS GMBH·Filed 2013·Granted Jul 15, 2014·0 cites·17 claims
- 1862US7871662B2Method for producing a stimulation electrodeHERAEUS GMBH W C·Filed 2008·Granted Jan 18, 2011·3 cites·9 claims
- 1961US7603169B2Stimulation electrode with porous coatingHERAEUS GMBH W C·Filed 2006·Granted Oct 13, 2009·4 cites·13 claims
- 2061US7421299B2Stimulation electrode and methods of making and using sameHERAEUS GMBH W C·Filed 2003·Granted Sep 2, 2008·23 cites·15 claims
- 2160US6901297B2Stimulation electrode and its useHERAEUS GMBH W C·Filed 2003·Granted May 31, 2005·26 cites·15 claims
- 2260US2017047138A1Method of manufacturing a ceramic bushing for an implantable medical deviceHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2016·Application pending·0 cites
- 2357US8951464B2Method for manufacturing a medical implant and medical implantSPECHT HEIKO·Filed 2011·Granted Feb 10, 2015·0 cites·9 claims
- 2456US8594808B2Stimulation electrodeSPECHT HEIKO·Filed 2010·Granted Nov 26, 2013·1 cites·8 claims
- 2553US12339287B2Method for manufacturing an electrochemical sensorHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2020·Granted Jun 24, 2025·0 cites·11 claims
- 2652US2007062810A1Sputtering system using silver-based alloyHERAEUS GMBH W C·Filed 2006·Application pending·0 cites
- 2749US2012193117A1Ceramic bushing for an implantable medical deviceSPECHT HEIKO·Filed 2012·Application pending·0 cites
- 2848US8597872B2Method for production of a medical markerSPECHT HEIKO·Filed 2009·Granted Dec 3, 2013·0 cites·6 claims
- 2946US7653439B2Electrode structure and methods for making and using sameHERAEUS GMBH W C·Filed 2004·Granted Jan 26, 2010·4 cites·9 claims
- 3046US2004253137A1Alloy and its useHERAEUS GMBH W C·Filed 2004·Application pending·0 cites
- 3144US11510626B2Conductive polymer composite based sensorHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2018·Granted Nov 29, 2022·0 cites·13 claims
- 3244US2013299038A1Joined dissimilar materials and methodHERAEUS PRECIOUS METALS GMBH·Filed 2013·Application pending·0 cites
- 3343US2018363146A1Method for manufacturing a passivated productHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2018·Application pending·0 cites
- 3442US8414679B2Producing an alloy with a powder metallurgical pre-materialSCHIEFER HERWIG·Filed 2010·Granted Apr 9, 2013·0 cites·16 claims
- 3542US2019221327A1Piezoresistive materialHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2017·Application pending·0 cites
- 3641US2018363115A1Method for manufacturing a composite wireHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2018·Application pending·0 cites
- 3740US9072908B2Active implantable deviceSPECHT HEIKO·Filed 2011·Granted Jul 7, 2015·0 cites·18 claims
- 3839US8298608B2Method for producing a stimulation electrodeFRERICKS MATTHIAS·Filed 2010·Granted Oct 30, 2012·0 cites·4 claims
- 3938US9090975B2Structuring three-dimensional components with non-diffusing noble or special metals and their alloys, with use being made of sputter technologySPECHT HEIKO·Filed 2011·Granted Jul 28, 2015·0 cites·17 claims
- 4038US2018366239A1Method for manufacturing a cableHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2018·Application pending·0 cites
- 4134US2010211147A1Electrically conducting materials, leads, and cables for stimulation electrodesHERAEUS GMBH W C·Filed 2010·Application pending·0 cites
- 4234US2004161630A1Alloys, reflector layers and their useHERAEUS GMBH W C·Filed 2004·Application pending·0 cites
- 4333US2018366238A1Composite wireHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2018·Application pending·0 cites
- 4431US2010233507A1Device with at least two interconnected metal partsHERAEUS GMBH W C·Filed 2010·Application pending·0 cites
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