Inventor · disambiguated record

Chandrashekar Ramaswamy

Also filed as: RAMASWAMY CHANDRASHEKAR

1 granted patent·3 citations·filing 2011–2011

24Inventor score

Technology areasH05K

Files withINTEL CORP1

Top patents by PatentIndex Score

1 record

0174US8353101B2Method of making substrate package with through holes for high speed I/O flex cableINTEL CORP·Filed 2011·Granted Jan 15, 2013·3 cites·5 claims

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →