Inventor · disambiguated record
Cheeman Yu
Also filed as: YU CHEEMAN
25 granted patents·6 pending applications·88 citations·filing 2009–2016
94Inventor score
Files withSANDISK TECHNOLOGIES INC7LIAO CHIH-CHIN4SANDISK INFORMATION TECHNOLOGY SHANGHAI CO LTD4CHANG CHE-JUNG2POMERANTZ ITZHAK2
Top patents by PatentIndex Score
31 records- 0192US8415808B2Semiconductor device with die stack arrangement including staggered die and efficient wire bondingLIAO CHIH-CHIN·Filed 2010·Granted Apr 9, 2013·24 cites·8 claims
- 0284US9240393B2High yield semiconductor deviceSANDISK INFORMATION TECHNOLOGY SHANGHAI CO LTD·Filed 2014·Granted Jan 19, 2016·9 cites·25 claims
- 0383US9773766B2Semiconductor device including independent film layer for embedding and/or spacing semiconductor dieSANDISK SEMICONDUCTOR (SHANGHAI) CO LTD·Filed 2013·Granted Sep 26, 2017·8 cites·20 claims
- 0482US9704797B2Waterfall wire bondingLU ZHONG·Filed 2011·Granted Jul 11, 2017·11 cites·11 claims
- 0582US8053276B2Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packagesSANDISK TECHNOLOGIES INC·Filed 2009·Granted Nov 8, 2011·10 cites·7 claims
- 0679US8878368B2Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packagingSANDISK TECHNOLOGIES INC·Filed 2013·Granted Nov 4, 2014·3 cites·16 claims
- 0774US10229886B2Discrete component backward traceability and semiconductor device forward traceabilitySANDISK SEMICONDUCTOR SHANGHAI CO LTD·Filed 2016·Granted Mar 12, 2019·3 cites·13 claims
- 0874US9230919B2Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packagingSANDISK TECHNOLOGIES INC·Filed 2014·Granted Jan 5, 2016·2 cites·22 claims
- 0971US8053880B2Stacked, interconnected semiconductor packageSANDISK TECHNOLOGIES INC·Filed 2009·Granted Nov 8, 2011·4 cites·16 claims
- 1069US9337153B2EMI shielding and thermal dissipation for semiconductor deviceFU PENG·Filed 2011·Granted May 10, 2016·4 cites·21 claims
- 1169US8129272B2Hidden plating tracesTAKIAR HEM·Filed 2009·Granted Mar 6, 2012·3 cites·16 claims
- 1268US9331045B2Semiconductor die laminating device with independent drivesGU WEI·Filed 2012·Granted May 3, 2016·3 cites·20 claims
- 1366US8502375B2Corrugated die edge for stacked die semiconductor packageLIAO CHIH-CHIN·Filed 2010·Granted Aug 6, 2013·2 cites·34 claims
- 1461US8853863B2Semiconductor device with die stack arrangement including staggered die and efficient wire bondingSANDISK TECHNOLOGIES INC·Filed 2013·Granted Oct 7, 2014·1 cites·16 claims
- 1556US10051733B2Printed circuit board with coextensive electrical connectors and contact pad areasSANDISK TECHNOLOGIES INC·Filed 2015·Granted Aug 14, 2018·0 cites·18 claims
- 1653US8217522B2Printed circuit board with coextensive electrical connectors and contact pad areasLIAO CHIH-CHIN·Filed 2010·Granted Jul 10, 2012·0 cites·13 claims
- 1753US8110439B2Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packagesYU CHEEMAN·Filed 2009·Granted Feb 7, 2012·1 cites·10 claims
- 1852US9209159B2Hidden plating tracesTAKIAR HEM·Filed 2012·Granted Dec 8, 2015·0 cites·17 claims
- 1951US8482139B2Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cardsCHANG CHE-JUNG·Filed 2009·Granted Jul 9, 2013·0 cites·12 claims
- 2051US8232145B2Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cardsCHANG CHE-JUNG·Filed 2009·Granted Jul 31, 2012·0 cites·16 claims
- 2150US8653653B2High density three dimensional semiconductor die packageYU CHEEMAN·Filed 2009·Granted Feb 18, 2014·0 cites·12 claims
- 2250US7939944B2Semiconductor die having a redistribution layerSANDISK CORP·Filed 2010·Granted May 10, 2011·0 cites·20 claims
- 2346US8349655B2Method of fabricating a two-sided die in a four-sided leadframe based packageSANDISK TECHNOLOGIES INC·Filed 2010·Granted Jan 8, 2013·0 cites·8 claims
- 2445US9362244B2Wire tail connector for a semiconductor deviceSANDISK INFORMATION TECHNOLOGY SHANGHAI CO LTD·Filed 2012·Granted Jun 7, 2016·0 cites·15 claims
- 2543US2012146247A1Pre-treatment of memory cards for binding glue and other curable fluidsPOMERANTZ ITZHAK·Filed 2011·Application pending·0 cites
- 2643US2014346686A1Methods for forming color images on memory devices and memory devices formed therebyPENG FU·Filed 2011·Application pending·0 cites
- 2743US2016086827A1Methods for forming color images on memory devices and memory devices formed therebySANDISK INFORMATION TECHNOLOGY SHANGHAI CO LTD·Filed 2015·Application pending·0 cites
- 2842US9236368B2Semiconductor device including embedded controller die and method of making sameSANDISK INFORMATION TECHNOLOGY SHANGHAI CO LTD·Filed 2013·Granted Jan 12, 2016·0 cites·22 claims
- 2937US2012081860A1Pre-treatment of memory cards for ink jet printingPOMERANTZ ITZHAK·Filed 2010·Application pending·0 cites
- 3036US2013006564A1Discrete component backward traceability and semiconductor device forward traceabilityCHAVET DIDIER·Filed 2010·Application pending·0 cites
- 3135US2013015589A1Chip-on-package structure for multiple die stacksLIAO CHIH-CHIN·Filed 2011·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →