Inventor · disambiguated record
Masanao Fujii
Also filed as: FUJII MASANAO
17 granted patents·4 pending applications·137 citations·filing 2001–2017
92Inventor score
Top patents by PatentIndex Score
21 records- 0186US6903876B2DisplayFUJITSU LTD·Filed 2002·Granted Jun 7, 2005·37 cites·13 claims
- 0283US6653761B2Micro-actuator and method of producing the sameFUJITSU LTD·Filed 2001·Granted Nov 25, 2003·22 cites·2 claims
- 0379US8915666B2Taper coupling structure and rotating machineYANAGISAWA EIICHI·Filed 2010·Granted Dec 23, 2014·6 cites·5 claims
- 0476US7133733B2Design support systemFUJITSU LTD·Filed 2004·Granted Nov 7, 2006·15 cites·28 claims
- 0571US7111390B2Parts mounting and assembling apparatusFUJITSU LTD·Filed 2004·Granted Sep 26, 2006·16 cites·19 claims
- 0669US6541898B2Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding methodFUJITSU LTD·Filed 2001·Granted Apr 1, 2003·14 cites·7 claims
- 0767US7691662B2Optical module producing method and apparatusFUJITSU LTD·Filed 2007·Granted Apr 6, 2010·1 cites·9 claims
- 0866US7753251B2Micro component removing apparatusFUJITSU LTD·Filed 2007·Granted Jul 13, 2010·2 cites·4 claims
- 0966US6467141B2Method of assembling micro-actuatorFUJITSU LTD·Filed 2001·Granted Oct 22, 2002·12 cites·14 claims
- 1064US6848154B2Method of producing a micro-actuatorFUJITSU LTD·Filed 2003·Granted Feb 1, 2005·8 cites·8 claims
- 1162US7717317B2Ball capturing apparatus, solder ball disposing apparatus, ball capturing method, and solder ball disposing methodFUJITSU LTD·Filed 2007·Granted May 18, 2010·2 cites·19 claims
- 1252US7963434B2Micro component removing methodFUJITSU LTD·Filed 2010·Granted Jun 21, 2011·0 cites·2 claims
- 1348US2007261233A1Method and system for fabricating a semiconductor deviceFUJITSU LTD·Filed 2007·Application pending·0 cites
- 1448US2007281395A1Method and system for fabricating a semiconductor deviceFUJITSU LTD·Filed 2007·Application pending·0 cites
- 1547US7824111B2Optical moduleFUJITSU LTD·Filed 2006·Granted Nov 2, 2010·0 cites·23 claims
- 1647US6744183B2Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding methodFUJITSU LTD·Filed 2003·Granted Jun 1, 2004·2 cites·2 claims
- 1744US7356894B2Method of producing a micro-actuatorFUJITSU LTD·Filed 2004·Granted Apr 15, 2008·0 cites·4 claims
- 1844US2006169750A1Soldering method and apparatusFUJITSU LTD·Filed 2005·Application pending·0 cites
- 1940US2007102441A1Component supplying apparatus and component supplying methodFUJITSU LTD·Filed 2006·Application pending·0 cites
- 2039US10346202B2Task circumstance processing device and methodFUJITSU LTD·Filed 2017·Granted Jul 9, 2019·0 cites·18 claims
- 2133US8153941B2Method of heating superposed components and heating apparatus thereforFUJII MASANAO·Filed 2002·Granted Apr 10, 2012·0 cites·14 claims
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