Inventor · disambiguated record
Vassoudevane Lebonheur
Also filed as: LEBONHEUR VASSOUDEVANE
6 granted patents·3 pending applications·147 citations·filing 2001–2007
83Inventor score
Technology areasH10W
Top patents by PatentIndex Score
9 records- 0193US6617683B2Thermal performance in flip chip/integral heat spreader packages using low modulus thermal interface materialINTEL CORP·Filed 2001·Granted Sep 9, 2003·99 cites·26 claims
- 0272US6794225B2Surface treatment for microelectronic device substrateINTEL CORP·Filed 2002·Granted Sep 21, 2004·19 cites·24 claims
- 0369US6975025B2Semiconductor chip package and method of manufacturing sameINTEL CORP·Filed 2001·Granted Dec 13, 2005·17 cites·27 claims
- 0457US7514300B2Mold compound cap in a flip chip multi-matrix array package and process of making sameINTEL CORP·Filed 2007·Granted Apr 7, 2009·1 cites·19 claims
- 0555US7147735B2Vibratable die attachment toolINTEL CORP·Filed 2004·Granted Dec 12, 2006·7 cites·16 claims
- 0641US6908789B1Method of making a microelectronic assemblyINTEL CORP·Filed 2003·Granted Jun 21, 2005·4 cites·16 claims
- 0737US2006097403A1No-flow underfill materials for flip chipsLEBONHEUR VASSOUDEVANE·Filed 2004·Application pending·0 cites
- 0836US2005104180A1Electronic device with reduced entrapment of material between die and substrate electrical connectionsFiled 2003·Application pending·0 cites
- 0932US2003113952A1Underfill materials dispensed in a flip chip package by way of a through holeFiled 2001·Application pending·0 cites
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