Inventor · disambiguated record
Chon Cheong Lei
Also filed as: LEI CHON C · LEI CHON CHEONG
17 granted patents·2 pending applications·379 citations·filing 1997–2004
95Inventor score
Files withIBM18
Top patents by PatentIndex Score
19 records- 0190US6569252B1Semi-aqueous solvent cleaning of paste processing residue from substratesIBM·Filed 2000·Granted May 27, 2003·44 cites·20 claims
- 0289US6276596B1Low temperature solder column attach by injection molded solder and structure formedIBM·Filed 2000·Granted Aug 21, 2001·54 cites·20 claims
- 0385US6652665B1Method of removing silicone polymer deposits from electronic componentsIBM·Filed 2002·Granted Nov 25, 2003·43 cites·20 claims
- 0485US6425518B1Method and apparatus for applying solder to an element on a substrateIBM·Filed 2001·Granted Jul 30, 2002·28 cites·11 claims
- 0581US6708872B2Method and apparatus for applying solder to an element on a substrateIBM·Filed 2002·Granted Mar 23, 2004·22 cites·16 claims
- 0675US6153505APlastic solder array using injection molded solderIBM·Filed 1999·Granted Nov 28, 2000·46 cites·8 claims
- 0775US6029882APlastic solder array using injection molded solderIBM·Filed 1998·Granted Feb 29, 2000·38 cites·8 claims
- 0872US6965171B1Method and structure for selective thermal paste deposition and retention on integrated circuit chip modulesIBM·Filed 2004·Granted Nov 15, 2005·21 cites·14 claims
- 0971US5938856AProcess of removing flux residue from microelectronic componentsIBM·Filed 1997·Granted Aug 17, 1999·39 cites·9 claims
- 1061US6503874B2Cleaning method to remove flux residue in electronic assemblyIBM·Filed 2001·Granted Jan 7, 2003·10 cites·6 claims
- 1150US6742530B2Semi-aqueous solvent cleaning of paste processing residue from substratesIBM·Filed 2002·Granted Jun 1, 2004·2 cites·4 claims
- 1248US6491205B1Assembly of multi-chip modules using eutectic soldersIBM·Filed 2001·Granted Dec 10, 2002·3 cites·11 claims
- 1345US6800141B2Semi-aqueous solvent based method of cleaning rosin flux residueIBM·Filed 2001·Granted Oct 5, 2004·9 cites·20 claims
- 1444US6910615B2Solder reflow type electrical apparatus packaging having integrated circuit and discrete componentsIBM·Filed 2003·Granted Jun 28, 2005·2 cites·11 claims
- 1544US6448796B1Selective netlist to test fine pitch multi-chip semiconductorIBM·Filed 2000·Granted Sep 10, 2002·4 cites·14 claims
- 1639US5913985AFixture and method for securing electronic modules during wet processingIBM·Filed 1997·Granted Jun 22, 1999·8 cites·20 claims
- 1738US2002023945A1Low temperature solder column attach by injection molded solder and structure formedIBM·Filed 2001·Application pending·0 cites
- 1834US6016947ANon-destructive low melt test for off-composition solderIBM·Filed 1997·Granted Jan 25, 2000·6 cites·20 claims
- 1930US2002000239A1Removal of cured silicone adhesive for reworking electronic componentsFiled 1999·Application pending·0 cites
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