Inventor · disambiguated record
Peter A. Gruber
Also filed as: GRUBER PETER A · GRUBER PETER ALFRED
121 granted patents·26 pending applications·3,373 citations·filing 1984–2020
99Inventor score
Top patents by PatentIndex Score
147 records- 0199US8987132B2Double solder bumps on substrates for low temperature flip chip bondingIBM·Filed 2014·Granted Mar 24, 2015·76 cites·2 claims
- 0297US8828860B2Double solder bumps on substrates for low temperature flip chip bondingGRUBER PETER A·Filed 2012·Granted Sep 9, 2014·30 cites·23 claims
- 0397US5673846ASolder anchor decal and methodIBM·Filed 1995·Granted Oct 7, 1997·135 cites·32 claims
- 0497US5388635ACompliant fluidic coolant hatIBM·Filed 1992·Granted Feb 14, 1995·258 cites·48 claims
- 0597US5244143AApparatus and method for injection molding solder and applications thereofIBM·Filed 1992·Granted Sep 14, 1993·297 cites·35 claims
- 0696US6534863B2Common ball-limiting metallurgy for I/O sitesIBM·Filed 2001·Granted Mar 18, 2003·112 cites·17 claims
- 0796US6332569B1Etched glass solder bump transfer for flip chip integrated circuit devicesIBM·Filed 2000·Granted Dec 25, 2001·97 cites·12 claims
- 0894US6452117B2Method for filling high aspect ratio via holes in electronic substrates and the resulting holesIBM·Filed 2001·Granted Sep 17, 2002·76 cites·13 claims
- 0994US6056191AMethod and apparatus for forming solder bumpsIBM·Filed 1998·Granted May 2, 2000·83 cites·21 claims
- 1093US8162203B1Spherical solder reflow methodGRUBER PETER A·Filed 2011·Granted Apr 24, 2012·14 cites·16 claims
- 1193US8162200B2Micro-fluidic injection molded solder (IMS)BUCHWALTER STEPHEN L·Filed 2011·Granted Apr 24, 2012·12 cites·8 claims
- 1293US8117982B2Method and apparatus for depositing coplanar microelectronic interconnectors using a compliant moldGRUBER PETER A·Filed 2009·Granted Feb 21, 2012·25 cites·3 claims
- 1393US7931187B2Injection molded solder method for forming solder bumps on substratesIBM·Filed 2008·Granted Apr 26, 2011·16 cites·16 claims
- 1493US7348270B1Techniques for forming interconnectsIBM·Filed 2007·Granted Mar 25, 2008·23 cites·22 claims
- 1593US6231333B1Apparatus and method for vacuum injection moldingIBM·Filed 1995·Granted May 15, 2001·119 cites·20 claims
- 1692US7838954B2Semiconductor structure with solder bumpsIBM·Filed 2008·Granted Nov 23, 2010·24 cites·16 claims
- 1792US7332424B2Fluxless solder transfer and reflow processIBM·Filed 2005·Granted Feb 19, 2008·27 cites·10 claims
- 1892US5775569AMethod for building interconnect structures by injection molded solder and structures builtIBM·Filed 1996·Granted Jul 7, 1998·120 cites·16 claims
- 1991US7786001B2Electrical interconnect structure and methodIBM·Filed 2007·Granted Aug 31, 2010·16 cites·9 claims
- 2091US7497366B2Global vacuum injection molded solder system and methodIBM·Filed 2007·Granted Mar 3, 2009·17 cites·1 claims
- 2191US6105852AEtched glass solder bump transfer for flip chip integrated circuit devicesIBM·Filed 1998·Granted Aug 22, 2000·73 cites·7 claims
- 2290US7980446B2Micro-fluidic injection molded solder (IMS)INTERNAT BUSINSS MACHINES CORP·Filed 2009·Granted Jul 19, 2011·10 cites·20 claims
- 2390US5198189ALiquid metal matrix thermal pasteIBM·Filed 1992·Granted Mar 30, 1993·110 cites·20 claims
- 2490US5022462AFlexible finned heat exchangerIBM·Filed 1990·Granted Jun 11, 1991·122 cites·23 claims
- 2589US8523046B1Forming an array of metal balls or shapes on a substrateIBM·Filed 2012·Granted Sep 3, 2013·8 cites·11 claims
- 2689US8492262B2Direct IMS (injection molded solder) without a mask for forming solder bumps on substratesGRUBER PETER A·Filed 2010·Granted Jul 23, 2013·11 cites·9 claims
- 2789US6276596B1Low temperature solder column attach by injection molded solder and structure formedIBM·Filed 2000·Granted Aug 21, 2001·54 cites·20 claims
- 2888US9082754B2Metal cored solder decal structure and processGRUBER PETER A·Filed 2012·Granted Jul 14, 2015·5 cites·13 claims
- 2988US7416104B2Rotational fill techniques for injection molding of solderIBM·Filed 2006·Granted Aug 26, 2008·14 cites·1 claims
- 3088US6924171B2Bilayer wafer-level underfillIBM·Filed 2001·Granted Aug 2, 2005·51 cites·22 claims
- 3187US8561880B2Forming metal preforms and metal ballsGRUBER PETER ALFRED·Filed 2012·Granted Oct 22, 2013·4 cites·7 claims
- 3287US7928585B2Sprocket opening alignment process and apparatus for multilayer solder decalIBM·Filed 2007·Granted Apr 19, 2011·13 cites·17 claims
- 3387US6581280B2Method for filling high aspect ratio via holes in electronic substratesIBM·Filed 2002·Granted Jun 24, 2003·40 cites·18 claims
- 3486US8053283B2Die level integrated interconnect decal manufacturing method and apparatusIBM·Filed 2010·Granted Nov 8, 2011·7 cites·9 claims
- 3585US8875978B2Forming constant diameter spherical metal ballsIBM·Filed 2013·Granted Nov 4, 2014·3 cites·5 claims
- 3685US6425518B1Method and apparatus for applying solder to an element on a substrateIBM·Filed 2001·Granted Jul 30, 2002·28 cites·11 claims
- 3785US6149122AMethod for building interconnect structures by injection molded solder and structures builtIBM·Filed 1998·Granted Nov 21, 2000·61 cites·5 claims
- 3885US6003757AApparatus for transferring solder bumps and method of usingIBM·Filed 1998·Granted Dec 21, 1999·81 cites·41 claims
- 3984US9543273B2Reduced volume interconnect for three-dimensional chip stackIBM·Filed 2015·Granted Jan 10, 2017·4 cites·13 claims
- 4084US9278401B2Fill head interface with combination vacuum pressure chamberIBM·Filed 2013·Granted Mar 8, 2016·5 cites·16 claims
- 4184US9095081B1Double solder bumps on substrates for low temperature flip chip bondingIBM·Filed 2015·Granted Jul 28, 2015·3 cites·4 claims
- 4284US8820616B2Method and apparatus providing fine alignment of a structure relative to a supportIBM·Filed 2013·Granted Sep 2, 2014·2 cites·9 claims
- 4384US6340630B1Method for making interconnect for low temperature chip attachmentIBM·Filed 2000·Granted Jan 22, 2002·28 cites·18 claims
- 4484US5821161ACast metal seal for semiconductor substrates and process thereofIBM·Filed 1997·Granted Oct 13, 1998·79 cites·21 claims
- 4583US8551816B2Direct edge connection for multi-chip integrated circuitsCORDES STEVEN A·Filed 2012·Granted Oct 8, 2013·6 cites·6 claims
- 4683US8138020B2Wafer level integrated interconnect decal and manufacturing method thereofGRUBER PETER A·Filed 2010·Granted Mar 20, 2012·7 cites·25 claims
- 4783US7516879B1Method of producing coaxial solder bump connections using injection molding of solderIBM·Filed 2008·Granted Apr 14, 2009·10 cites·1 claims
- 4883US7410092B2Fill head for injection molding of solderIBM·Filed 2006·Granted Aug 12, 2008·10 cites·1 claims
- 4983US6390439B1Hybrid molds for molten solder screening processIBM·Filed 1999·Granted May 21, 2002·44 cites·40 claims
- 5083US5982038ACast metal seal for semiconductor substratesIBM·Filed 1997·Granted Nov 9, 1999·71 cites·17 claims
Showing the top 50 of 147 patent records by PatentIndex Score.
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