Inventor · disambiguated record

No Sun Park

Also filed as: PARK NO SUN

22 granted patents·3 pending applications·192 citations·filing 2009–2025

94Inventor score

Technology areasH10W A63F G06Q

Files withAMKOR TECHNOLOGY INC14 AMKOR TECH SINGAPORE HOLDING PTE LTD7 NSPARK INC2 PARK NO SUN1 SO KWANG SUP1

Top patents by PatentIndex Score

25 records

0197US7977783B1Wafer level chip size package having redistribution layersAMKOR TECHNOLOGY INC·Filed 2009·Granted Jul 12, 2011·132 cites·16 claims
0295US9831282B2Electronic device package and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Nov 28, 2017·9 cites·20 claims
0394US9466580B2Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2015·Granted Oct 11, 2016·9 cites·20 claims
0494US9431447B2Package of finger print sensor and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2015·Granted Aug 30, 2016·8 cites·20 claims
0593US9129873B2Package of finger print sensor and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2013·Granted Sep 8, 2015·10 cites·20 claims
0692US10304890B2Electronic device package and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted May 28, 2019·5 cites·22 claims
0790US10692918B2Electronic device package and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2019·Granted Jun 23, 2020·3 cites·20 claims
0889US12230661B2Electronic device package and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Granted Feb 18, 2025·0 cites·20 claims
0986US9929113B2Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Mar 27, 2018·3 cites·22 claims
1084US2024258253A1Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Application pending·0 cites
1183US9293403B2Semiconductor package with improved redistribution layer design and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2013·Granted Mar 22, 2016·8 cites·22 claims
1281US11961867B2Electronic device package and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Apr 16, 2024·0 cites·20 claims
1380US2025160031A1Electronic device package and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
1477US9184148B2Semiconductor package and method thereforAMKOR TECHNOLOGY INC·Filed 2014·Granted Nov 10, 2015·3 cites·20 claims
1576US11842970B2Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Dec 12, 2023·0 cites·20 claims
1674US11362128B2Electronic device package and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Jun 14, 2022·0 cites·20 claims
1772US11121102B2Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Sep 14, 2021·0 cites·20 claims
1870US9406639B2Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2013·Granted Aug 2, 2016·2 cites·29 claims
1960US10535620B2Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2018·Granted Jan 14, 2020·0 cites·20 claims
2051US9543235B2Semiconductor package and method thereforAMKOR TECHNOLOGY INC·Filed 2015·Granted Jan 10, 2017·0 cites·20 claims
2150US10115705B2Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Oct 30, 2018·0 cites·18 claims
2248US2022258062A14d screen shooting range and playing method using thereofNSPARK INC·Filed 2022·Application pending·0 cites
2347US11420112B2System and method for operating match-up gamePARK NO SUN·Filed 2020·Granted Aug 23, 2022·0 cites·14 claims
2442US11707668B2Screen shooting range and method of playing screen shooting game using artificial intelligence technologyNSPARK INC·Filed 2021·Granted Jul 25, 2023·0 cites·1 claims
2531US9070675B2Plating structure for wafer level packagesSO KWANG SUP·Filed 2013·Granted Jun 30, 2015·0 cites·20 claims

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