Inventor · disambiguated record
Wan-Chun Kuan
Also filed as: KUAN WAN-CHUN
10 granted patents·15 citations·filing 2016–2022
83Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD10
Top patents by PatentIndex Score
10 records- 0195US10297555B2Integrated circuit structure having crown-shaped semiconductor strips and recesses in the substrate from etched dummy finsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 21, 2019·10 cites·20 claims
- 0289US10679950B2Methods of forming recesses in substrates by etching dummy FinsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 9, 2020·4 cites·20 claims
- 0380US12424568B2Method for forming recesses in a substrate by etching dummy finsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 23, 2025·0 cites·20 claims
- 0474US11488912B2Method for forming recesses in a substrate by etching dummy finsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 1, 2022·0 cites·19 claims
- 0574US10734246B2Heat shield for chamber door and devices manufactured using sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 4, 2020·1 cites·20 claims
- 0670US12074032B2Heat shield for chamber door and devices manufactured using sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 27, 2024·0 cites·20 claims
- 0766US10861800B2Integrated circuit structure having a crown-shaped semiconductor strip and an isolation region recessed in the substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 8, 2020·0 cites·20 claims
- 0860US10825739B2FinFET devices and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 3, 2020·0 cites·20 claims
- 0955US11031252B2Heat shield for chamber door and devices manufactured using sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 8, 2021·0 cites·26 claims
- 1051US10510615B2FinFET devices and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 17, 2019·0 cites·20 claims
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