Inventor · disambiguated record
Sheng-Hsiang Chiu
Also filed as: CHIU SHENG-HSIANG
24 granted patents·11 pending applications·129 citations·filing 2010–2025
94Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD29PRIMAX ELECTRONICS LTD4HUANG CHANG-CHIA1TAIWAN SEMICONDUCTOR MFG1
Top patents by PatentIndex Score
35 records- 0198US9818729B1Package-on-package structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 14, 2017·35 cites·20 claims
- 0296US10163754B2Lid design for heat dissipation enhancement of die packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Dec 25, 2018·31 cites·20 claims
- 0396US9859229B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 2, 2018·16 cites·20 claims
- 0496US8048778B1Methods of dicing a semiconductor structureTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Nov 1, 2011·36 cites·20 claims
- 0591US11705409B2Semiconductor device having antenna on chip package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 18, 2023·2 cites·20 claims
- 0688US10283377B1Integrated fan-out package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 7, 2019·6 cites·13 claims
- 0787US12358194B2Molded semiconductor device and manufacturing method of molded semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 0887US2025303621A1Molding apparatus and molded semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0984US2025132268A1Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1083US12011859B2Molding apparatus and manufacturing method of molded semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 18, 2024·0 cites·20 claims
- 1182US12512419B2Method of fabricating memory device and package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 30, 2025·0 cites·20 claims
- 1282US12218082B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 4, 2025·0 cites·20 claims
- 1380US12057415B2Semiconductor device having antenna and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 6, 2024·0 cites·20 claims
- 1479US11731327B2Molding apparatus and manufacturing method of molded semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 22, 2023·0 cites·20 claims
- 1575US2024404954A1Method of forming packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1674US12230549B2Three-dimensional integrated circuit structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 18, 2025·0 cites·20 claims
- 1774US2025300130A1Manufacturing method of package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1873US11855006B2Memory device, package structure and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·17 claims
- 1973US10741508B2Semiconductor device having antenna and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 11, 2020·1 cites·20 claims
- 2072US2025167060A1Three-dimensional integrated circuit structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2170US10797025B2Advanced INFO POP and method of forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 6, 2020·1 cites·20 claims
- 2269US2025372941A1Optical module packaging structure and method of manufacturing the samePRIMAX ELECTRONICS LTD·Filed 2024·Application pending·0 cites
- 2368US10757310B1Miniature image pickup module and manufacturing method thereofPRIMAX ELECTRONICS LTD·Filed 2019·Granted Aug 25, 2020·1 cites·19 claims
- 2464US12354997B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 8, 2025·0 cites·20 claims
- 2564US11955460B2Advanced info POP and method of forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 9, 2024·0 cites·20 claims
- 2662US11446851B2Molding apparatus, manufacturing method of molded semiconductor device and molded semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 20, 2022·0 cites·20 claims
- 2762US11309226B2Three-dimensional integrated circuit structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 19, 2022·0 cites·20 claims
- 2858US2025140643A1Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2958US2025062592A1Optical module packaging structure and method of manufacturing the samePRIMAX ELECTRONICS LTD·Filed 2023·Application pending·0 cites
- 3055US11785723B2Lens modulePRIMAX ELECTRONICS LTD·Filed 2021·Granted Oct 10, 2023·0 cites·6 claims
- 3154US10325883B2Package-on-package structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 18, 2019·0 cites·20 claims
- 3252US2023067664A1Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 3351US2020020634A1Package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Application pending·0 cites
- 3449US10283470B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 7, 2019·0 cites·20 claims
- 3536US2013277828A1Methods and Apparatus for bump-on-trace Chip PackagingHUANG CHANG-CHIA·Filed 2012·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →