Inventor · disambiguated record
Wonjin Cho
Also filed as: CHO WONJIN
14 granted patents·2 pending applications·34 citations·filing 2014–2023
88Inventor score
Files withALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD7ATOTECH DEUTSCHLAND GMBH3ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN) LTD2ALPHA & OMEGA SEMICONDUCTOR1ATOTECH DEUTSCHLAND GMBH & CO KG1
Top patents by PatentIndex Score
16 records- 0191US9704789B1Molded intelligent power moduleALPHA AND OMEGA SEMICONDUCTOR (CAYMAN) LTD·Filed 2016·Granted Jul 11, 2017·11 cites·15 claims
- 0290US10477626B2Hard switching disable for switching power deviceALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD·Filed 2017·Granted Nov 12, 2019·9 cites·15 claims
- 0389US10476494B2Intelligent power modules for resonant convertersALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD·Filed 2017·Granted Nov 12, 2019·6 cites·21 claims
- 0483US9881856B1Molded intelligent power moduleALPHA AND OMEGA SEMICONDUCTOR (CAYMAN) LTD·Filed 2017·Granted Jan 30, 2018·4 cites·15 claims
- 0576US10141249B2Molded intelligent power module and method of making the sameALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD·Filed 2017·Granted Nov 27, 2018·2 cites·12 claims
- 0667US10177080B2Molded intelligent power moduleALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD·Filed 2017·Granted Jan 8, 2019·1 cites·16 claims
- 0760US10477700B2Method for manufacturing a printed circuit boardATOTECH DEUTSCHLAND GMBH·Filed 2017·Granted Nov 12, 2019·1 cites·14 claims
- 0856US11271559B2Intelligent power module control method for resonant converterALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD·Filed 2019·Granted Mar 8, 2022·0 cites·20 claims
- 0954US10396019B2Molded intelligent power module and method of making the sameALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD·Filed 2018·Granted Aug 27, 2019·0 cites·6 claims
- 1054US2025375815A1Method for manufacturing three-dimensional structure using conductive floating maskGLOBAL FRONTIER CT MULTISCALE ENERGY SYSTEMS·Filed 2022·Application pending·0 cites
- 1146US2025313958A1Method for nano etching of copper and copper alloy surfacesATOTECH DEUTSCHLAND GMBH & CO KG·Filed 2023·Application pending·0 cites
- 1243US11963308B2Method for increasing adhesion strength between a surface of copper or copper alloy and an organic layerATOTECH DEUTSCHLAND GMBH·Filed 2019·Granted Apr 16, 2024·0 cites·20 claims
- 1342US10056893B2Molded power module having single in-line leadsALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD·Filed 2016·Granted Aug 21, 2018·0 cites·20 claims
- 1442US9331521B2Energy storage apparatusPOWER BRIDGE CO LTD·Filed 2014·Granted May 3, 2016·0 cites·7 claims
- 1536US11991835B2Method for increasing adhesion strength between a metal and an organic materialATOTECH DEUTSCHLAND GMBH·Filed 2020·Granted May 21, 2024·0 cites·15 claims
- 1636US10411692B2Active clamp overvoltage protection for switching power deviceALPHA & OMEGA SEMICONDUCTOR·Filed 2016·Granted Sep 10, 2019·0 cites·15 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →