Inventor · disambiguated record
Tsong-Lin Tai
Also filed as: TAI TSONG L L · TAI TSONG LIN LEO · TAI TSONG-LIN · TAI TSONG-LIN L
6 granted patents·3 pending applications·19 citations·filing 2003–2016
77Inventor score
Top patents by PatentIndex Score
9 records- 0186US9418846B1Selective dopant junction for a group III-V semiconductor deviceIBM·Filed 2015·Granted Aug 16, 2016·4 cites·16 claims
- 0286US8969197B2Copper interconnect structure and its formationEDELSTEIN DANIEL C·Filed 2012·Granted Mar 3, 2015·7 cites·7 claims
- 0378US9679775B2Selective dopant junction for a group III-V semiconductor deviceIBM·Filed 2016·Granted Jun 13, 2017·2 cites·10 claims
- 0478US7405153B2Method for direct electroplating of copper onto a non-copper plateable layerIBM·Filed 2006·Granted Jul 29, 2008·6 cites·22 claims
- 0555US9589894B2Copper interconnect structure and its formationIBM·Filed 2014·Granted Mar 7, 2017·0 cites·18 claims
- 0648US2008076690A1Non-hermetic encapsulant removal for module reworkIBM·Filed 2007·Application pending·0 cites
- 0739US2005066995A1Non-hermetic encapsulant removal for module reworkIBM·Filed 2003·Application pending·0 cites
- 0837US7223691B2Method of forming low resistance and reliable via in inter-level dielectric interconnectIBM·Filed 2004·Granted May 29, 2007·0 cites·10 claims
- 0937US2007134861A1Semiconductor devices and methods of manufacture thereofHAN JIN-PING·Filed 2005·Application pending·0 cites
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