Inventor · disambiguated record
Kazushi Nakazawa
Also filed as: NAKAZAWA KAZUSHI
13 granted patents·4 pending applications·206 citations·filing 1994–2014
92Inventor score
Files withPANASONIC CORP8SHINETSU HANDOTAI KK4NAKAZAWA KAZUSHI3PANASONIC IP MAN CO LTD1YANAGIHARA MANABU1
Top patents by PatentIndex Score
17 records- 0194US7838904B2Nitride based semiconductor device with concave gate regionPANASONIC CORP·Filed 2008·Granted Nov 23, 2010·32 cites·4 claims
- 0293US7550821B2Nitride semiconductor devicePANASONIC CORP·Filed 2007·Granted Jun 23, 2009·29 cites·11 claims
- 0387US8344463B2Bidirectional switchPANASONIC CORP·Filed 2009·Granted Jan 1, 2013·13 cites·11 claims
- 0481US5478408ASOI substrate and manufacturing method thereforSHINETSU HANDOTAI KK·Filed 1995·Granted Dec 26, 1995·63 cites·4 claims
- 0576US8569843B2Semiconductor devicePANASONIC CORP·Filed 2012·Granted Oct 29, 2013·3 cites·11 claims
- 0671US8436399B2Semiconductor deviceNAKAZAWA KAZUSHI·Filed 2010·Granted May 7, 2013·4 cites·18 claims
- 0771US7605441B2Semiconductor devicePANASONIC CORP·Filed 2007·Granted Oct 20, 2009·4 cites·23 claims
- 0868US8716756B2Semiconductor devicePANASONIC CORP·Filed 2013·Granted May 6, 2014·2 cites·15 claims
- 0961US6110391AMethod of manufacturing a bonding substrateSHINETSU HANDOTAI KK·Filed 1997·Granted Aug 29, 2000·28 cites·15 claims
- 1054US5804494AMethod of fabricating bonded waferSHINETSU HANDOTAI KK·Filed 1996·Granted Sep 8, 1998·20 cites·20 claims
- 1147US7821030B2Semiconductor device and method for manufacturing the samePANASONIC CORP·Filed 2006·Granted Oct 26, 2010·0 cites·10 claims
- 1244US2011024797A1Nitride-based semiconductor device with concave gate regionPANASONIC CORP·Filed 2010·Application pending·0 cites
- 1343US8710548B2Semiconductor device and method for manufacturing the sameYANAGIHARA MANABU·Filed 2010·Granted Apr 29, 2014·0 cites·15 claims
- 1439US2016322967A1Circuit constant variable circuitPANASONIC IP MAN CO LTD·Filed 2014·Application pending·0 cites
- 1539US2011037101A1Semiconductor deviceNAKAZAWA KAZUSHI·Filed 2009·Application pending·0 cites
- 1637US5538904AMethod of estimating quantity of boron at bonding interface in bonded waferSHINETSU HANDOTAI KK·Filed 1994·Granted Jul 23, 1996·8 cites·13 claims
- 1731US2012012893A1Semiconductor transistor and method of manufacturing the sameNAKAZAWA KAZUSHI·Filed 2011·Application pending·0 cites
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