Inventor · disambiguated record
Chen-Peng Fan
Also filed as: FAN CHEN-PENG
12 granted patents·1 pending application·177 citations·filing 1997–2006
91Inventor score
Files withTAIWAN SEMICONDUCTOR MFG13
Top patents by PatentIndex Score
13 records- 0174US5879993ANitride spacer technology for flash EPROMTAIWAN SEMICONDUCTOR MFG·Filed 1997·Granted Mar 9, 1999·35 cites·20 claims
- 0269US6001690AMethod of forming flash EPROM by using iso+aniso silicon nitride spacer etching technologyTAIWAN SEMICONDUCTOR MFG·Filed 1998·Granted Dec 14, 1999·29 cites·33 claims
- 0369US5930664AProcess for preventing corrosion of aluminum bonding pads after passivation/ARC layer etchingTAIWAN SEMICONDUCTOR MFG·Filed 1997·Granted Jul 27, 1999·41 cites·20 claims
- 0468US6031264ANitride spacer technology for flash EPROMTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Feb 29, 2000·26 cites·17 claims
- 0565US6524959B1Chemical mechanical polish (CMP) planarizing method employing derivative signal end-point monitoring and controlTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Feb 25, 2003·11 cites·13 claims
- 0663US7772625B2Image sensor having an RPO layer containing nitrogenTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Aug 10, 2010·1 cites·7 claims
- 0756US6897147B1Solution for copper hillock induced by thermal strain with buffer zone for strain relaxationTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted May 24, 2005·8 cites·19 claims
- 0846US6110843AEtch back method for smoothing microbubble-generated defects in spin-on-glass interlayer dielectricTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Aug 29, 2000·12 cites·20 claims
- 0944US6248661B1Method for monitoring bubble formation and abnormal via defects in a spin-on-glass planarization, etchback processTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Jun 19, 2001·11 cites·14 claims
- 1042US7481910B2Method and apparatus for stabilizing plating film impuritiesTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Jan 27, 2009·1 cites·8 claims
- 1138US2006213778A1Method for electrochemical plating on semiconductor wafersTAIWAN SEMICONDUCTOR MFG·Filed 2005·Application pending·0 cites
- 1237US7122471B2Method for preventing voids in metal interconnectsTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Oct 17, 2006·0 cites·20 claims
- 1331US6376156B1Prevent defocus issue on wafer with tungsten coating on back-sideTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Apr 23, 2002·2 cites·10 claims
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