Inventor · disambiguated record
Patrick A. Coico
Also filed as: COICO PATRICK A · COICO PATRICK ANTHONY
26 granted patents·3 pending applications·743 citations·filing 1995–2013
97Inventor score
Top patents by PatentIndex Score
29 records- 0197US8687364B2Directly connected heat exchanger tube section and coolant-cooled structureCHAINER TIMOTHY J·Filed 2011·Granted Apr 1, 2014·33 cites·18 claims
- 0295US6354844B1Land grid array alignment and engagement designIBM·Filed 1999·Granted Mar 12, 2002·120 cites·19 claims
- 0394US7518235B2Method and structure to provide balanced mechanical loading of devices in compressively loaded environmentsIBM·Filed 2005·Granted Apr 14, 2009·42 cites·6 claims
- 0493US7724527B2Method and structure to improve thermal dissipation from semiconductor devicesIBM·Filed 2008·Granted May 25, 2010·24 cites·20 claims
- 0592US7468886B2Method and structure to improve thermal dissipation from semiconductor devicesIBM·Filed 2007·Granted Dec 23, 2008·21 cites·1 claims
- 0688US6278193B1Optical sensing method to place flip chipsIBM·Filed 1998·Granted Aug 21, 2001·95 cites·16 claims
- 0786US9132519B2Directly connected heat exchanger tube section and coolant-cooled structureIBM·Filed 2012·Granted Sep 15, 2015·5 cites·11 claims
- 0885US5773561APolymer sealants/adhesives and use thereof in electronic package assemblyIBM·Filed 1996·Granted Jun 30, 1998·43 cites·21 claims
- 0981US9402334B2Method for controlling airflow of directional flow perforated tileIBM·Filed 2013·Granted Jul 26, 2016·4 cites·8 claims
- 1081US5968670AEnhanced ceramic ball grid array using in-situ solder stretch with springIBM·Filed 1997·Granted Oct 19, 1999·63 cites·17 claims
- 1174US6278184B1Solder disc connectionIBM·Filed 1999·Granted Aug 21, 2001·35 cites·14 claims
- 1274US5964396AEnhanced ceramic ball grid array using in-situ solder stretch with clipIBM·Filed 1997·Granted Oct 12, 1999·36 cites·15 claims
- 1369US6339534B1Compliant leads for area array surface mounted componentsIBM·Filed 1999·Granted Jan 15, 2002·29 cites·14 claims
- 1468US5975409ACeramic ball grid array using in-situ solder stretchIBM·Filed 1997·Granted Nov 2, 1999·36 cites·5 claims
- 1567US6253986B1Solder disc connectionIBM·Filed 1999·Granted Jul 3, 2001·25 cites·5 claims
- 1663US6111314AThermal cap with embedded particlesIBM·Filed 1998·Granted Aug 29, 2000·23 cites·48 claims
- 1762US6964885B2Stress resistant land grid array (LGA) module and method of forming the sameIBM·Filed 2004·Granted Nov 15, 2005·9 cites·33 claims
- 1862US6955543B2Method and apparatus to form a reworkable seal on an electronic moduleIBM·Filed 2003·Granted Oct 18, 2005·11 cites·24 claims
- 1962US6333209B1One step method for curing and joining BGA solder ballsIBM·Filed 1999·Granted Dec 25, 2001·27 cites·14 claims
- 2060US6070321ASolder disc connectionIBM·Filed 1997·Granted Jun 6, 2000·20 cites·12 claims
- 2159US6255139B1Method for providing a thermal path through particles embedded in a thermal capIBM·Filed 1999·Granted Jul 3, 2001·19 cites·51 claims
- 2258US6703560B2Stress resistant land grid array (LGA) module and method of forming the sameIBM·Filed 2001·Granted Mar 9, 2004·7 cites·7 claims
- 2348US2008076690A1Non-hermetic encapsulant removal for module reworkIBM·Filed 2007·Application pending·0 cites
- 2447US2013000736A1Adjustable and directional flow perforated tilesIBM·Filed 2011·Application pending·0 cites
- 2546US6908025B2Preparing MCM hat for removalIBM·Filed 2003·Granted Jun 21, 2005·1 cites·20 claims
- 2644US6049456AElectronic module adjustment design and process using shimsIBM·Filed 1998·Granted Apr 11, 2000·12 cites·45 claims
- 2739US2005066995A1Non-hermetic encapsulant removal for module reworkIBM·Filed 2003·Application pending·0 cites
- 2832US5977625ASemiconductor package with low strain sealIBM·Filed 1997·Granted Nov 2, 1999·2 cites·12 claims
- 2931US5723905ASemiconductor package with low strain sealIBM·Filed 1995·Granted Mar 3, 1998·1 cites·2 claims
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