Inventor · disambiguated record
Richard Leigh Bumann
Also filed as: BUMANN RICHARD L · BUMANN RICHARD LEIGH
5 granted patents·168 citations·filing 1974–1998
82Inventor score
Top patents by PatentIndex Score
5 records- 0186US5839191AVibrating template method of placing solder balls on the I/O pads of an integrated circuit packageUNISYS CORP·Filed 1997·Granted Nov 24, 1998·101 cites·14 claims
- 0263US6116331AMechanical assembly for regulating the temperature of an electronic device which incorporates a single leaf spring for self-alignment plus a low initial contact force and a low profileUNISYS CORP·Filed 1998·Granted Sep 12, 2000·29 cites·14 claims
- 0359US5816481APin block method of dispensing solder flux onto the I/O pads of an integrated circuit packageUNISYS CORP·Filed 1997·Granted Oct 6, 1998·27 cites·13 claims
- 0436US3974920AMachine loader and unloaderBURROUGHS CORP·Filed 1974·Granted Aug 17, 1976·5 cites·3 claims
- 0530US4544003ATerminal straightener for an integrated circuit packageBURROUGHS CORP·Filed 1984·Granted Oct 1, 1985·6 cites·12 claims
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