Inventor · disambiguated record
Voya R. Markovich
Also filed as: MARKOVICH VOYA · MARKOVICH VOYA R · MARKOVICH VOYA RISTA
251 granted patents·23 pending applications·8,484 citations·filing 1982–2012
99Inventor score
Top patents by PatentIndex Score
274 records- 0198US7800916B2Circuitized substrate with internal stacked semiconductor chips, method of making same, electrical assembly utilizing same and information handling system utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Sep 21, 2010·80 cites·31 claims
- 0298US7301108B2Multi-layered interconnect structure using liquid crystalline polymer dielectricIBM·Filed 2004·Granted Nov 27, 2007·105 cites·10 claims
- 0398US5487218AMethod for making printed circuit boards with selectivity filled plated through holesIBM·Filed 1994·Granted Jan 30, 1996·284 cites·2 claims
- 0498US5435057AInterconnection method and structure for organic circuit boardsIBM·Filed 1994·Granted Jul 25, 1995·290 cites·9 claims
- 0598US5191174AHigh density circuit board and method of making sameIBM·Filed 1990·Granted Mar 2, 1993·332 cites·21 claims
- 0697US7508076B2Information handling system including a circuitized substrate having a dielectric layer without continuous fibersENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Mar 24, 2009·56 cites·18 claims
- 0797US7025607B1Capacitor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrateENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Apr 11, 2006·51 cites·18 claims
- 0897US6753612B2Economical high density chip carrierIBM·Filed 2001·Granted Jun 22, 2004·123 cites·20 claims
- 0997US6608757B1Method for making a printed wiring boardIBM·Filed 2002·Granted Aug 19, 2003·120 cites·12 claims
- 1097US5822856AManufacturing circuit board assemblies having filled viasIBM·Filed 1996·Granted Oct 20, 1998·223 cites·10 claims
- 1196US8446707B1Circuitized substrate with low loss capacitive material and method of making sameDAS RABINDRA N·Filed 2011·Granted May 21, 2013·18 cites·11 claims
- 1296US7501839B2Interposer and test assembly for testing electronic devicesENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Mar 10, 2009·39 cites·22 claims
- 1396US6929900B2Tamper-responding encapsulated enclosure having flexible protective mesh structureIBM·Filed 2003·Granted Aug 16, 2005·127 cites·6 claims
- 1496US6664485B2Full additive process with filled plated through holesIBM·Filed 2001·Granted Dec 16, 2003·66 cites·19 claims
- 1596US6451509B2Composite laminate circuit structure and method of forming the sameIBM·Filed 2001·Granted Sep 17, 2002·117 cites·10 claims
- 1696US6407341B1Conductive substructures of a multilayered laminateIBM·Filed 2000·Granted Jun 18, 2002·138 cites·3 claims
- 1796US6204453B1Two signal one power plane circuit boardIBM·Filed 1998·Granted Mar 20, 2001·173 cites·6 claims
- 1896US6178093B1Information handling system with circuit assembly having holes filled with filler materialIBM·Filed 1998·Granted Jan 23, 2001·168 cites·33 claims
- 1996US6175087B1Composite laminate circuit structure and method of forming the sameIBM·Filed 1998·Granted Jan 16, 2001·170 cites·8 claims
- 2096US5229550AEncapsulated circuitized power core alignment and laminationIBM·Filed 1992·Granted Jul 20, 1993·170 cites·7 claims
- 2195US6686539B2Tamper-responding encapsulated enclosure having flexible protective mesh structureIBM·Filed 2001·Granted Feb 3, 2004·109 cites·17 claims
- 2295US5374454AMethod for conditioning halogenated polymeric materials and structures fabricated therewithIBM·Filed 1993·Granted Dec 20, 1994·71 cites·39 claims
- 2395US5129142AEncapsulated circuitized power core alignment and laminationIBM·Filed 1990·Granted Jul 14, 1992·135 cites·14 claims
- 2494US7738249B2Circuitized substrate with internal cooling structure and electrical assembly utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Jun 15, 2010·32 cites·22 claims
- 2594US6268016B1Manufacturing computer systems with fine line circuitized substratesIBM·Filed 1996·Granted Jul 31, 2001·89 cites·21 claims
- 2694US5557844AMethod of preparing a printed circuit boardIBM·Filed 1995·Granted Sep 24, 1996·138 cites·1 claims
- 2794US5185073AMethod of fabricating nendritic materialsIBM·Filed 1991·Granted Feb 9, 1993·173 cites·4 claims
- 2893US6809269B2Circuitized substrate assembly and method of making sameENDICOTT INTERCONNECT TECH INC·Filed 2002·Granted Oct 26, 2004·36 cites·15 claims
- 2993US5420520AMethod and apparatus for testing of integrated circuit chipsIBM·Filed 1993·Granted May 30, 1995·128 cites·3 claims
- 3093US4448804AMethod for selective electroless plating of copper onto a non-conductive substrate surfaceIBM·Filed 1983·Granted May 15, 1984·80 cites·20 claims
- 3192US8288857B2Anti-tamper microchip package based on thermal nanofluids or fluidsDAS RABINDRA N·Filed 2010·Granted Oct 16, 2012·16 cites·25 claims
- 3292US6826830B2Multi-layered interconnect structure using liquid crystalline polymer dielectricIBM·Filed 2002·Granted Dec 7, 2004·42 cites·15 claims
- 3392US6479093B2Composite laminate circuit structure and methods of interconnecting the sameIBM·Filed 2002·Granted Nov 12, 2002·50 cites·17 claims
- 3492US6370012B1Capacitor laminate for use in printed circuit board and as an interconnectorIBM·Filed 2000·Granted Apr 9, 2002·77 cites·6 claims
- 3592US5298685AInterconnection method and structure for organic circuit boardsIBM·Filed 1992·Granted Mar 29, 1994·79 cites·10 claims
- 3691US7348677B2Method of providing printed circuit board with conductive holes and board resulting therefromENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Mar 25, 2008·19 cites·16 claims
- 3791US6828514B2High speed circuit board and method for fabricationENDICOTT INTERCONNECT TECH INC·Filed 2003·Granted Dec 7, 2004·47 cites·17 claims
- 3891US6695623B2Enhanced electrical/mechanical connection for electronic devicesIBM·Filed 2001·Granted Feb 24, 2004·54 cites·10 claims
- 3991US6630743B2Copper plated PTH barrels and methods for fabricatingIBM·Filed 2001·Granted Oct 7, 2003·53 cites·11 claims
- 4091US5316788AApplying solder to high density substratesIBM·Filed 1991·Granted May 31, 1994·182 cites·10 claims
- 4191US5137461ASeparable electrical connection technologyIBM·Filed 1990·Granted Aug 11, 1992·134 cites·8 claims
- 4290US8063315B2Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrateDAS RABINDRA N·Filed 2007·Granted Nov 22, 2011·15 cites·17 claims
- 4390US7687722B2Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Mar 30, 2010·25 cites·33 claims
- 4490US7442879B2Circuitized substrate with solder-coated microparticle paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same and method of making said substrateENDICOTT INTERCONECT TECHNOLOG·Filed 2005·Granted Oct 28, 2008·23 cites·40 claims
- 4590US7235745B2Resistor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said ciruitized substrate, and information handling system utilizing said ciruitized substrateENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Jun 26, 2007·15 cites·10 claims
- 4689US7541058B2Method of making circuitized substrate with internal optical pathwayENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Jun 2, 2009·20 cites·18 claims
- 4789US7293355B2Apparatus and method for making circuitized substrates in a continuous mannerENDICOTT INTERCONNECT TECH INC·Filed 2005·Granted Nov 13, 2007·18 cites·12 claims
- 4889US6524352B2Method of making a parallel capacitor laminateIBM·Filed 2002·Granted Feb 25, 2003·56 cites·11 claims
- 4989US6388204B1Composite laminate circuit structure and methods of interconnecting the sameIBM·Filed 2000·Granted May 14, 2002·75 cites·12 claims
- 5089US5450290APrinted circuit board with aligned connections and method of making sameIBM·Filed 1994·Granted Sep 12, 1995·153 cites·22 claims
Showing the top 50 of 274 patent records by PatentIndex Score.
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