Inventor · disambiguated record

Eunhaeng Lee

Also filed as: LEE EUNHAENG

1 granted patent·1 citations·filing 2021–2021

16Inventor score

Technology areasH10P

Files withSAMSUNG ELECTRONICS CO LTD1

Top patents by PatentIndex Score

1 record

0174US12136563B2Semiconductor manufacturing apparatus including bonding headSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 5, 2024·1 cites·20 claims

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