Inventor · disambiguated record
Naoki Tomori
Also filed as: TOMORI NAOKI
16 granted patents·2 pending applications·8 citations·filing 2008–2022
87Inventor score
Top patents by PatentIndex Score
18 records- 0169US11251055B2Temporary protective film for semiconductor encapsulation molding, lead frame provided with temporary protective film, encapsulated molded body provided with temporary protective film, and method for manufacturing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2019·Granted Feb 15, 2022·1 cites·16 claims
- 0263US11682564B2Temporary protective film for semiconductor encapsulation molding, lead frame provided with temporary protective film, encapsulated molded body provided with temporary protective film, and method for manufacturing semiconductor deviceSHOWA DENKO MATERIALS CO LTD·Filed 2021·Granted Jun 20, 2023·0 cites·22 claims
- 0361US12227379B2Adhesive film production apparatus and reel bodiesSHOWA DENKO MATERIALS CO LTD·Filed 2021·Granted Feb 18, 2025·0 cites·20 claims
- 0460USD962883STemporary protective film for manufacturing semiconductor devicesSHOWA DENKO MATERIALS CO LTD·Filed 2021·Granted Sep 6, 2022·2 cites·1 claims
- 0557USD962882STemporary protective film for manufacturing semiconductor devicesSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Sep 6, 2022·2 cites·1 claims
- 0656USD946540STemporary protective film for manufacturing semiconductor devicesSHOWA DENKO MATERIALS CO LTD·Filed 2021·Granted Mar 22, 2022·2 cites·1 claims
- 0754US12060239B2Reel body, method for manufacturing reel body, and method for manufacturing articleRESONAC CORP·Filed 2021·Granted Aug 13, 2024·0 cites·9 claims
- 0854USD999179STemporary protective film for manufacturing semiconductor devicesSHOWA DENKO MATERIALS CO LTD·Filed 2022·Granted Sep 19, 2023·1 cites·1 claims
- 0952US12435248B2Temporary protective film for semiconductor encapsulation molding, lead frame provided with temporary protective film, encapsulation molded body, and method for manufacturing semiconductor packageRESONAC CORP·Filed 2021·Granted Oct 7, 2025·0 cites·8 claims
- 1050US12134534B2Adhesive film production apparatus and adhesive film production methodRESONAC CORP·Filed 2021·Granted Nov 5, 2024·0 cites·20 claims
- 1149US11908762B2Temporary protective film for semiconductor sealing molding, lead frame with temporary protective film, sealed molded body with temporary protective film, and method for producing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2019·Granted Feb 20, 2024·0 cites·16 claims
- 1248US11195728B2Temporary protective film for semiconductor sealing moldingHITACHI CHEMICAL CO LTD·Filed 2018·Granted Dec 7, 2021·0 cites·14 claims
- 1347US2023178385A1Temporary protection film for semiconductor encapsulation, production method therefor, lead frame with temporary protection film, temporarily protected encapsulation object, and method for producing semiconductor packageSHOWA DENKO MATERIALS CO LTD·Filed 2021·Application pending·0 cites
- 1444US12398298B2Temporary protective film for producing semiconductor device, reel body, and method for producing semiconductor deviceRESONAC CORP·Filed 2019·Granted Aug 26, 2025·0 cites·11 claims
- 1544US8771828B2Sealing film and a semiconductor device using the sameKAWAKAMI HIROYUKI·Filed 2008·Granted Jul 8, 2014·0 cites·16 claims
- 1643US8715454B2Sealing film and a semiconductor device using the sameKAWAKAMI HIROYUKI·Filed 2012·Granted May 6, 2014·0 cites·22 claims
- 1742USD998577STemporary protective film for manufacturing semiconductor devicesSHOWA DENKO MATERIALS CO LTD·Filed 2022·Granted Sep 12, 2023·0 cites·1 claims
- 1842US2022285200A1Temporary protective film, reel body, packaging body, package body, temporary protective body, and method for producing semiconductor deviceSHOWA DENKO MATERIALS CO LTD·Filed 2019·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →