Inventor · disambiguated record
Ming-Han Wang
Also filed as: WANG MING-HAN
8 granted patents·1 pending application·15 citations·filing 2017–2025
80Inventor score
Files withADVANCED SEMICONDUCTOR ENG9
Top patents by PatentIndex Score
9 records- 0194US11901252B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Feb 13, 2024·2 cites·16 claims
- 0288US11410902B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Aug 9, 2022·4 cites·12 claims
- 0384US11375124B2Optical measurement equipment and method for measuring warpage of a workpieceADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jun 28, 2022·4 cites·21 claims
- 0483US12300560B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2024·Granted May 13, 2025·0 cites·6 claims
- 0582US10522508B2Semiconductor device package and a method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Dec 31, 2019·4 cites·20 claims
- 0681US2025266313A1Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 0765US11152274B2Multi-moldings fan-out package and processADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Oct 19, 2021·1 cites·11 claims
- 0860US11598625B2Apparatus and method for deformation measurementADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Mar 7, 2023·0 cites·18 claims
- 0954US11869828B2Semiconductor package through hole with lever arms and insulating layers with different coefficient of thermal expansionADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Jan 9, 2024·0 cites·17 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →