Inventor · disambiguated record
Yun Tae Lee
Also filed as: LEE YUN TAE
46 granted patents·10 pending applications·301 citations·filing 2000–2025
98Inventor score
Files withSAMSUNG ELECTRO MECH19SAMSUNG ELECTRONICS CO LTD18LX SEMICON CO LTD5BYUN SUNG JAE2HONG SI-HOON2
Top patents by PatentIndex Score
56 records- 0196US9824988B1Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Nov 21, 2017·18 cites·20 claims
- 0291US7293183B2System for storing working context in a non-volatile memory while in a power-off suspend mode and restoring the working context when the power-off suspend mode is releasedSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Nov 6, 2007·62 cites·13 claims
- 0390US8462101B2Apparatus for and method of controlling backlight of display panel in camera systemHAN BING·Filed 2010·Granted Jun 11, 2013·13 cites·9 claims
- 0489US11488906B2Bridge embedded interposer, and package substrate and semiconductor package comprising the sameSAMSUNG ELECTRO MECH·Filed 2019·Granted Nov 1, 2022·6 cites·20 claims
- 0589US8140935B2ECC controller for use in flash memory device and memory system including the sameHONG SI-HOON·Filed 2011·Granted Mar 20, 2012·12 cites·27 claims
- 0688US7725746B2Apparatus and method for restoring working contextSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted May 25, 2010·17 cites·28 claims
- 0784US10453821B2Connection system of semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 22, 2019·4 cites·25 claims
- 0883US7873822B2System comprising electronic device and external device storing boot code for booting systemSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jan 18, 2011·10 cites·28 claims
- 0982US8112689B2ECC controller for use in flash memory device and memory system including the sameHONG SI-HOON·Filed 2007·Granted Feb 7, 2012·13 cites·30 claims
- 1081US8291210B2Methods of booting application processors from external devicesKIM YONG-HOON·Filed 2011·Granted Oct 16, 2012·5 cites·18 claims
- 1180US10257426B2Image sensor modules, methods of manufacturing the same, and image processing systems including the image sensor modulesLEE YUN TAE·Filed 2016·Granted Apr 9, 2019·4 cites·16 claims
- 1280US8020081B2Multi-level cell memory devices using trellis coded modulation and methods of storing data in and reading data from the memory devicesSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Sep 13, 2011·12 cites·21 claims
- 1379US10304791B2Electronic component packageSAMSUNG ELECTRO MECH·Filed 2017·Granted May 28, 2019·2 cites·4 claims
- 1479US10020272B2Electronic component packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Jul 10, 2018·2 cites·13 claims
- 1578US10026703B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Jul 17, 2018·2 cites·21 claims
- 1678US6976108B2System on a chip having a system bus, an external bus, and a bus arbiter with programmable priorities for both buses, software, and method for assigning programmable prioritiesSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Dec 13, 2005·26 cites·38 claims
- 1776US10943878B2Semiconductor packageSAMSUNG ELECTRO MECH·Filed 2019·Granted Mar 9, 2021·2 cites·20 claims
- 1876US7882344B2Memory system having a communication channel between a first processor and a second processor and memory management method that uses the communication channelSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Feb 1, 2011·6 cites·31 claims
- 1976US7594126B2Processor system and method for reducing power consumption in idle modeSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Sep 22, 2009·24 cites·36 claims
- 2076US7155556B2Devices and methods for converting remote device formats to host device formats for access to host associated resourcesSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Dec 26, 2006·21 cites·17 claims
- 2173US6654874B1Microcomputer systems having compressed instruction processing capability and methods of operating sameSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Nov 25, 2003·19 cites·11 claims
- 2272US9036051B2Image processing apparatus and interpolation method operable to calculate a luminance and interpolate color by adjusting a signal output from at least one low-luminance pixel and at least one high-luminance pixelAHN JUNG CHAK·Filed 2012·Granted May 19, 2015·2 cites·18 claims
- 2369US11163211B2Camera module actuatorSAMSUNG ELECTRO MECH·Filed 2017·Granted Nov 2, 2021·1 cites·23 claims
- 2469US8209527B2Memory system and memory management method including the sameIM JEON-TAEK·Filed 2009·Granted Jun 26, 2012·5 cites·18 claims
- 2568US11417631B2Semiconductor packageSAMSUNG ELECTRO MECH·Filed 2019·Granted Aug 16, 2022·1 cites·21 claims
- 2667US8984237B2Memory system and memory management method including the sameBYUN SUNG-JAE·Filed 2011·Granted Mar 17, 2015·2 cites·13 claims
- 2767US7539825B2Multi-port memory device providing protection signalSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted May 26, 2009·4 cites·14 claims
- 2866US8171378B2Flash memory system having encrypted error correction code and encryption method for flash memory systemCHOI SUNG-UP·Filed 2008·Granted May 1, 2012·4 cites·13 claims
- 2965US9257467B2Image sensor modules, methods of manufacturing the same, and image processing systems including the image sensor modulesLEE YUN TAE·Filed 2010·Granted Feb 9, 2016·2 cites·32 claims
- 3064US11791298B2Semiconductor package including plurality of semiconductor chips on common connection structureSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 17, 2023·0 cites·20 claims
- 3164US9291849B2Liquid crystal displaySAMSUNG DISPLAY CO LTD·Filed 2014·Granted Mar 22, 2016·0 cites·28 claims
- 3263US12412822B2Semiconductor chip and semiconductor package including the sameSAMSUNG ELECTRO MECH·Filed 2022·Granted Sep 9, 2025·0 cites·23 claims
- 3361US10209590B2Liquid crystal displaySAMSUNG DISPLAY CO LTD·Filed 2016·Granted Feb 19, 2019·0 cites·17 claims
- 3460US2025310793A1Ai terminal of providing ai features and method thereofLX SEMICON CO LTD·Filed 2025·Application pending·0 cites
- 3558US11081283B2Multi-layered ceramic electronic component and mounting board thereofSAMSUNG ELECTRO MECH·Filed 2019·Granted Aug 3, 2021·0 cites·19 claims
- 3658US10923464B2Connection system of semiconductor packages using a printed circuit boardSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 16, 2021·0 cites·20 claims
- 3758US10734335B2Electronic component packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 4, 2020·0 cites·6 claims
- 3857US2025252028A1On-device artificial intelligence processing distributed processing device and methodLX SEMICON CO LTD·Filed 2025·Application pending·0 cites
- 3956US12022186B2Camera for vehicleSAMSUNG ELECTRO MECH·Filed 2020·Granted Jun 25, 2024·0 cites·19 claims
- 4054US11164838B2Semiconductor package including plurality of semiconductor chips on common connection structureSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 2, 2021·0 cites·17 claims
- 4154US2025252274A1On-device artificial intelligence (ai) device of providing multi-way interpretation service and method thereofLX SEMICON CO LTD·Filed 2025·Application pending·0 cites
- 4253US11858528B2Driving control system with driving assistance control and autonomous driving controlSAMSUNG ELECTRO MECH·Filed 2019·Granted Jan 2, 2024·0 cites·24 claims
- 4353US11076243B2Terminal with hearing aid setting, and setting method for hearing aidSAMSUNG ELECTRO MECH·Filed 2020·Granted Jul 27, 2021·0 cites·19 claims
- 4452US10535643B2Connection system of semiconductor packages using a printed circuit boardSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jan 14, 2020·0 cites·18 claims
- 4551US11190884B2Terminal with hearing aid setting, and method of setting hearing aidSAMSUNG ELECTRO MECH·Filed 2020·Granted Nov 30, 2021·0 cites·16 claims
- 4651US10930593B2Package on package and package connection system comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 23, 2021·0 cites·17 claims
- 4747US8423755B2Memory system and memory management method including the sameBYUN SUNG-JAE·Filed 2011·Granted Apr 16, 2013·0 cites·15 claims
- 4845US2020126924A1Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2019·Application pending·0 cites
- 4943US10840228B2Semiconductor packageSAMSUNG ELECTRO MECH·Filed 2019·Granted Nov 17, 2020·0 cites·31 claims
- 5043US2025259909A1A heat dissipation substrate for a power semiconductor module, a power semiconductor module including the same and a power converter including the same, and manufacturing method of the heat dissipation substrate for a power semiconductor moduleLX SEMICON CO LTD·Filed 2025·Application pending·0 cites
Showing the top 50 of 56 patent records by PatentIndex Score.
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