Inventor · disambiguated record
Michirou Kawanishi
Also filed as: KAWANISHI MICHIROU
7 granted patents·13 pending applications·271 citations·filing 1989–2013
88Inventor score
Top patents by PatentIndex Score
20 records- 0193US5466325AResist removing method, and curable pressure-sensitive adhesive, adhesive sheets and apparatus used for the methodNITTO DENKO CORP·Filed 1994·Granted Nov 14, 1995·83 cites·2 claims
- 0287US5609954AStrippable pressure-sensitive adhesive and adhesive material using the sameNITTO DENKO CORP·Filed 1995·Granted Mar 11, 1997·70 cites·19 claims
- 0385US4966281AElectronic component carrierNITTO DENKO CORP·Filed 1989·Granted Oct 30, 1990·59 cites·27 claims
- 0471US8299402B2Disassemblable structure, electric equipment and non-electric equipment having disassemblable structure, and disassembling methodYAMANAKA EIJI·Filed 2009·Granted Oct 30, 2012·2 cites·10 claims
- 0564US4966282AElectronic component carrierNITTO DENKO CORP·Filed 1989·Granted Oct 30, 1990·36 cites·9 claims
- 0658US5959011AResist removing method, and curable pressure-sensitive adhesive, adhesive sheets and apparatus used for the methodNITTO DENKO CORP·Filed 1996·Granted Sep 28, 1999·17 cites·8 claims
- 0753US2012270042A1Pressure-sensitive adhesive tape for electrochemical deviceHANAI HIROOMI·Filed 2011·Application pending·0 cites
- 0853US2012270036A1Pressure-sensitive adhesive tape for electrochemical deviceKIUCHI KAZUYUKI·Filed 2011·Application pending·0 cites
- 0951US7332219B2Tape-shaped insulating material, insulated product and aqueous dispersion type acrylic pressure-sensitive adhesive for insulating materialNITTO DENKO CORP·Filed 2002·Granted Feb 19, 2008·4 cites·12 claims
- 1051US2014158300A1Protective sheet for glass etchingHAYATA MAIKO·Filed 2012·Application pending·0 cites
- 1150US2007111392A1Method for thermally releasing chip cut piece from thermal release type pressure sensitive adhesive sheet, electronic component and circuit boardNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 1249US2008008831A1Heat-peelable pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 1349US2008073034A1Method for thermally releasing adherend and apparatus for thermally releasing adherendNITTO DENKO CORP·Filed 2007·Application pending·0 cites
- 1441US2005136251A1Heat-peelable pressure-sensitive adhesive sheetNITTO DENKO CORP·Filed 2004·Application pending·0 cites
- 1540US2004177918A1Method of heat-peeling chip cut pieces from heat peel type adhesive sheet, electronic part, and circuit boardFiled 2002·Application pending·0 cites
- 1640US2013220532A1Self-rolling adhesive filmNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 1740US2013224418A1Self-rolling adhesive filmNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 1839US2013011634A1Pressure-sensitive adhesive sheet and laminateNITTO DENKO CORP·Filed 2012·Application pending·0 cites
- 1938US2005236107A1Method of thermal adherend release and apparatus for thermal adherend releaseNITTO DENKO CORP·Filed 2005·Application pending·0 cites
- 2037US2002195199A1Method for thermally releasing adherend and apparatus for thermally releasing adherendNITTO DENKO CORP·Filed 2002·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →