Inventor · disambiguated record
Dalson Ye Seng Kim
Also filed as: KIM DALSON YE SENG
7 granted patents·108 citations·filing 2003–2010
86Inventor score
Technology areasH10W
Top patents by PatentIndex Score
7 records- 0196US7205656B2Stacked device package for peripheral and center device pad layout deviceMICRON TECHNOLOGY INC·Filed 2005·Granted Apr 17, 2007·58 cites·30 claims
- 0280US7425463B2Stacked die package for peripheral and center device pad layout deviceMICRON TECHNOLOGY INC·Filed 2006·Granted Sep 16, 2008·7 cites·36 claims
- 0377US6903449B2Semiconductor component having chip on board leadframeMICRON TECHNOLOGY INC·Filed 2003·Granted Jun 7, 2005·20 cites·48 claims
- 0476US7846768B2Stacked die package for peripheral and center device pad layout deviceMICRON TECHNOLOGY INC·Filed 2008·Granted Dec 7, 2010·5 cites·20 claims
- 0573US7049173B2Method for fabricating semiconductor component with chip on board leadframeMICRON TECHNOLOGY INC·Filed 2004·Granted May 23, 2006·15 cites·27 claims
- 0668US7459778B2Chip on board leadframe for semiconductor components having area arrayMICRON TECHNOLOGY INC·Filed 2006·Granted Dec 2, 2008·3 cites·28 claims
- 0743US8269328B2Stacked die package for peripheral and center device pad layout deviceKIM DALSON YE SENG·Filed 2010·Granted Sep 18, 2012·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →