Inventor · disambiguated record
Nicholas C. M. Fuller
Also filed as: FULLER NICHOLAS · FULLER NICHOLAS C · FULLER NICHOLAS C M
71 granted patents·21 pending applications·500 citations·filing 2003–2019
99Inventor score
Top patents by PatentIndex Score
92 records- 0199US9324650B2Interconnect structures with fully aligned viasIBM·Filed 2014·Granted Apr 26, 2016·79 cites·7 claims
- 0296US10467586B2Blockchain ledgers of material spectral signatures for supply chain integrity managementIBM·Filed 2017·Granted Nov 5, 2019·15 cites·11 claims
- 0396US9405582B2Dynamic parallel distributed job configuration in a shared-resource environmentIBM·Filed 2014·Granted Aug 2, 2016·35 cites·18 claims
- 0495US7435671B2Trilayer resist scheme for gate etching applicationsIBM·Filed 2006·Granted Oct 14, 2008·24 cites·14 claims
- 0594US8633117B1Sputter and surface modification etch processing for metal patterning in integrated circuitsIBM·Filed 2012·Granted Jan 21, 2014·14 cites·20 claims
- 0693US8084825B2Trilayer resist scheme for gate etching applicationsFULLER NICHOLAS C·Filed 2008·Granted Dec 27, 2011·22 cites·14 claims
- 0792US9911690B2Interconnect structures with fully aligned viasIBM·Filed 2016·Granted Mar 6, 2018·6 cites·12 claims
- 0892US8871107B2Subtractive plasma etching of a blanket layer of metal or metal alloyIBM·Filed 2013·Granted Oct 28, 2014·13 cites·24 claims
- 0992US7943480B2Sub-lithographic dimensioned air gap formation and related structureIBM·Filed 2008·Granted May 17, 2011·18 cites·13 claims
- 1092US7402463B2Adopting feature of buried electrically conductive layer in dielectrics for electrical anti-fuse applicationIBM·Filed 2005·Granted Jul 22, 2008·21 cites·1 claims
- 1190US10685323B2Blockchain ledgers of material spectral signatures for supply chain integrity managementIBM·Filed 2017·Granted Jun 16, 2020·6 cites·9 claims
- 1290US8618036B2Aqueous cerium-containing solution having an extended bath lifetime for removing mask materialAFZALI-ARDAKANI ALI·Filed 2011·Granted Dec 31, 2013·11 cites·23 claims
- 1390US8367556B1Use of an organic planarizing mask for cutting a plurality of gate linesIBM·Filed 2011·Granted Feb 5, 2013·10 cites·23 claims
- 1489US9633948B2Low energy etch process for nitrogen-containing dielectric layerGLOBALFOUNDRIES INC·Filed 2015·Granted Apr 25, 2017·5 cites·19 claims
- 1588US7816275B1Gate patterning of nano-channel devicesIBM·Filed 2009·Granted Oct 19, 2010·13 cites·18 claims
- 1688US7371461B2Multilayer hardmask scheme for damage-free dual damascene processing of SiCOH dielectricsIBM·Filed 2005·Granted May 13, 2008·13 cites·20 claims
- 1787US7739218B2Systems and methods for building and implementing ontology-based information resourcesIBM·Filed 2005·Granted Jun 15, 2010·26 cites·23 claims
- 1886US10721328B2Offering application program interfaces (APIs) for sale in cloud marketplaceIBM·Filed 2015·Granted Jul 21, 2020·6 cites·21 claims
- 1986US8455366B1Use of an organic planarizing mask for cutting a plurality of gate linesFULLER NICHOLAS C M·Filed 2012·Granted Jun 4, 2013·7 cites·17 claims
- 2084US9582189B2Dynamic tuning of memory in MapReduce systemsIBM·Filed 2014·Granted Feb 28, 2017·7 cites·20 claims
- 2184US9190316B2Low energy etch process for nitrogen-containing dielectric layerBRINK MARKUS·Filed 2011·Granted Nov 17, 2015·6 cites·15 claims
- 2284US8431995B2Methodology for fabricating isotropically recessed drain regions of CMOS transistorsFULLER NICHOLAS C·Filed 2010·Granted Apr 30, 2013·6 cites·4 claims
- 2384US8159042B2Adopting feature of buried electrically conductive layer in dielectrics for electrical anti-fuse applicationYANG CHIH-CHAO·Filed 2008·Granted Apr 17, 2012·9 cites·22 claims
- 2483US8768338B2Base station power control in a mobile networkIBM·Filed 2012·Granted Jul 1, 2014·5 cites·24 claims
- 2583US7960096B2Sublithographic patterning method incorporating a self-aligned single mask processIBM·Filed 2008·Granted Jun 14, 2011·8 cites·18 claims
- 2682US8652969B2High aspect ratio and reduced undercut trench etch process for a semiconductor substrateFULLER NICHOLAS C M·Filed 2011·Granted Feb 18, 2014·6 cites·25 claims
- 2782US7435676B2Dual damascene process flow enabling minimal ULK film modification and enhanced stack integrityIBM·Filed 2006·Granted Oct 14, 2008·9 cites·9 claims
- 2880US8716798B2Methodology for fabricating isotropically recessed source and drain regions of CMOS transistorsFULLER NICHOLAS C·Filed 2010·Granted May 6, 2014·4 cites·12 claims
- 2979US9006108B2Methodology for fabricating isotropically recessed source and drain regions of CMOS transistorsFULLER NICHOLAS C·Filed 2012·Granted Apr 14, 2015·4 cites·5 claims
- 3079US7811926B2Multilayer hardmask scheme for damage-free dual damascene processing of SiCOH dielectricsIBM·Filed 2008·Granted Oct 12, 2010·6 cites·12 claims
- 3177US8916054B2High fidelity patterning employing a fluorohydrocarbon-containing polymerBRINK MARKUS·Filed 2011·Granted Dec 23, 2014·4 cites·12 claims
- 3276US9064727B2Sputter and surface modification etch processing for metal patterning in integrated circuitsIBM·Filed 2013·Granted Jun 23, 2015·2 cites·19 claims
- 3376US8445948B2Gate patterning of nano-channel devicesFULLER NICHOLAS C M·Filed 2010·Granted May 21, 2013·4 cites·14 claims
- 3475US10325998B2High selectivity nitride removal process based on selective polymer depositionIBM·Filed 2017·Granted Jun 18, 2019·1 cites·11 claims
- 3575US10269924B2High selectivity nitride removal process based on selective polymer depositionIBM·Filed 2017·Granted Apr 23, 2019·1 cites·7 claims
- 3675US10204856B2Interconnect structures with fully aligned viasIBM·Filed 2017·Granted Feb 12, 2019·1 cites·6 claims
- 3775US7298935B1Waveguide polarization beam splitters and method of fabricating a waveguide wire-grid polarization beam splitterIBM·Filed 2006·Granted Nov 20, 2007·6 cites·20 claims
- 3874US10043153B2Pattern-based product identification with feedbackIBM·Filed 2014·Granted Aug 7, 2018·1 cites·7 claims
- 3974US7914970B2Mixed lithography with dual resist and a single pattern transferIBM·Filed 2007·Granted Mar 29, 2011·6 cites·16 claims
- 4073US11195145B2Blockchain ledgers of material spectral signatures for supply chain integrity managementIBM·Filed 2019·Granted Dec 7, 2021·1 cites·20 claims
- 4173US9886310B2Dynamic resource allocation in MapReduceIBM·Filed 2014·Granted Feb 6, 2018·3 cites·11 claims
- 4271US9263393B2Sputter and surface modification etch processing for metal patterning in integrated circuitsGLOBALFOUNDRIES INC·Filed 2015·Granted Feb 16, 2016·1 cites·10 claims
- 4371US8768337B2Base station power control in a mobile networkIBM·Filed 2012·Granted Jul 1, 2014·2 cites·12 claims
- 4470US10216486B2Automatic generation of license terms for service application marketplacesIBM·Filed 2016·Granted Feb 26, 2019·1 cites·19 claims
- 4570US9627533B2High selectivity nitride removal process based on selective polymer depositionIBM·Filed 2015·Granted Apr 18, 2017·1 cites·10 claims
- 4670US8928124B2High aspect ratio and reduced undercut trench etch process for a semiconductor substrateIBM·Filed 2013·Granted Jan 6, 2015·2 cites·14 claims
- 4770US8765613B2High selectivity nitride etch processCHANG JOSEPHINE B·Filed 2011·Granted Jul 1, 2014·2 cites·5 claims
- 4868US9766940B2Enabling dynamic job configuration in mapreduceIBM·Filed 2014·Granted Sep 19, 2017·2 cites·18 claims
- 4968US8232171B2Structure with isotropic silicon recess profile in nanoscale dimensionsENGELMANN SEBASTIAN ULRICH·Filed 2009·Granted Jul 31, 2012·2 cites·9 claims
- 5068US7767587B2Method of forming an interconnection structure in a organosilicate glass having a porous layer with higher carbon content located between two lower carbon content non-porous layersIBM·Filed 2008·Granted Aug 3, 2010·3 cites·8 claims
Showing the top 50 of 92 patent records by PatentIndex Score.
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