Inventor · disambiguated record
Goro Nakatani
Also filed as: NAKATANI GORO
60 granted patents·18 pending applications·313 citations·filing 2000–2024
98Inventor score
Top patents by PatentIndex Score
78 records- 0194US6724084B1Semiconductor chip and production thereof, and semiconductor device having semiconductor chip bonded to solid deviceROHM CO LTD·Filed 2000·Granted Apr 20, 2004·85 cites·8 claims
- 0289US7735368B2Acceleration sensorROHM CO LTD·Filed 2007·Granted Jun 15, 2010·18 cites·3 claims
- 0388US6462420B2Semiconductor chip and semiconductor device having a chip-on-chip structureROHM CO LTD·Filed 2000·Granted Oct 8, 2002·52 cites·9 claims
- 0487US8809980B2Infrared sensorNAKATANI GORO·Filed 2011·Granted Aug 19, 2014·8 cites·33 claims
- 0587US8608296B2Inkjet printer headNAKATANI GORO·Filed 2010·Granted Dec 17, 2013·4 cites·11 claims
- 0687US8174085B2Method of manufacturing MEMS sensor and MEMS sensorNAKATANI GORO·Filed 2009·Granted May 8, 2012·15 cites·4 claims
- 0784US8049343B2Semiconductor device and method of manufacturing the sameROHM CO LTD·Filed 2010·Granted Nov 1, 2011·6 cites·15 claims
- 0883US8513746B2MEMS sensor and method for producing MEMS sensor, and MEMS packageNAKATANI GORO·Filed 2011·Granted Aug 20, 2013·6 cites·52 claims
- 0983US7880367B2MEMS sensorROHM CO LTD·Filed 2008·Granted Feb 1, 2011·10 cites·10 claims
- 1082US7825483B2MEMS sensor and production method of MEMS sensorROHM CO LTD·Filed 2008·Granted Nov 2, 2010·11 cites·11 claims
- 1180US8807712B2Inkjet printer headROHM CO LTD·Filed 2013·Granted Aug 19, 2014·2 cites·11 claims
- 1280US7845229B2Acceleration sensorROHM CO LTD·Filed 2007·Granted Dec 7, 2010·8 cites·15 claims
- 1380US7045900B2Semiconductor chip and production thereof, and semiconductor device having semiconductor chip bonded to solid deviceROHM CO LTD·Filed 2004·Granted May 16, 2006·26 cites·3 claims
- 1477US7898048B2MEMS sensorROHM CO LTD·Filed 2008·Granted Mar 1, 2011·6 cites·11 claims
- 1575US8039911B2MEMS sensorROHM CO LTD·Filed 2009·Granted Oct 18, 2011·7 cites·6 claims
- 1672US8991262B2Capacitive pressure sensor, manufacturing method thereof, and pressure sensor packageROHM CO LTD·Filed 2013·Granted Mar 31, 2015·4 cites·18 claims
- 1771US2025074838A1Insulating substrateROHM CO LTD·Filed 2024·Application pending·0 cites
- 1870US10139456B2MEMS sensor, method for manufacturing the same, and MEMS package including the sameROHM CO LTD·Filed 2015·Granted Nov 27, 2018·1 cites·46 claims
- 1970US8975714B2Capacitive pressure sensor and method of manufacturing the sameROHM CO LTD·Filed 2013·Granted Mar 10, 2015·2 cites·10 claims
- 2070US8829629B2Capacitance type sensorROHM CO LTD·Filed 2013·Granted Sep 9, 2014·2 cites·15 claims
- 2168US12358302B2Thermal print head, manufacturing method of the same, and thermal printerROHM CO LTD·Filed 2023·Granted Jul 15, 2025·0 cites·11 claims
- 2267US8776602B2Acceleration sensor, semiconductor device and method of manufacturing semiconductor deviceNAKATANI GORO·Filed 2010·Granted Jul 15, 2014·2 cites·5 claims
- 2366US7898044B2MEMS sensor and production method of MEMS sensorROHM CO LTD·Filed 2010·Granted Mar 1, 2011·2 cites·13 claims
- 2465US11279145B2Thermal print head and method of manufacturing the sameROHM CO LTD·Filed 2020·Granted Mar 22, 2022·0 cites·16 claims
- 2564US7759803B2Semiconductor device and method of manufacturing the sameROHM CO LTD·Filed 2007·Granted Jul 20, 2010·2 cites·7 claims
- 2663US11633959B2Thermal print headROHM CO LTD·Filed 2021·Granted Apr 25, 2023·0 cites·18 claims
- 2763US11400731B2Thermal printheadROHM CO LTD·Filed 2020·Granted Aug 2, 2022·0 cites·20 claims
- 2863US9520505B2Capacitance type MEMS sensorNAKATANI GORO·Filed 2012·Granted Dec 13, 2016·1 cites·10 claims
- 2963US8269347B2Semiconductor chip, electrode structure therefor and method for forming sameNAKATANI GORO·Filed 2011·Granted Sep 18, 2012·1 cites·22 claims
- 3063US6847117B2Semiconductor device including a passivation film to cover directly an interface of a bump and an intermediated layerROHM CO LTD·Filed 2002·Granted Jan 25, 2005·8 cites·8 claims
- 3162US11458739B2Thermal print head, manufacturing method of thermal print head, and thermal printerROHM CO LTD·Filed 2021·Granted Oct 4, 2022·0 cites·19 claims
- 3261US7795128B2Method of manufacturing a semiconductor device having an enhanced electrode pad structureROHM CO LTD·Filed 2004·Granted Sep 14, 2010·7 cites·9 claims
- 3361US6794732B2Semiconductor device and method of manufacturing the sameROHN CO LTD·Filed 2002·Granted Sep 21, 2004·8 cites·7 claims
- 3461US2024268018A1Insulating substrate, electrical wiring substrate, thermal print head and manufacturing methods thereofROHM CO LTD·Filed 2024·Application pending·0 cites
- 3560US2025058566A1Thermal print head and method for manufacturing thereofROHM CO LTD·Filed 2024·Application pending·0 cites
- 3659US11850870B2Thermal print head and manufacturing method thereofROHM CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·18 claims
- 3759US8970242B2Method for manufacturing probe card, probe card, method for manufacturing semiconductor device, and method for forming probeNAKATANI GORO·Filed 2009·Granted Mar 3, 2015·2 cites·8 claims
- 3859US2025018731A1Thermal print headROHM CO LTD·Filed 2024·Application pending·0 cites
- 3959US2025018730A1Thermal print head and method for manufacturing thermal print headROHM CO LTD·Filed 2024·Application pending·0 cites
- 4058US8080835B2Semiconductor device including a capacitance type sensor and method of manufacturing the sameNAKATANI GORO·Filed 2008·Granted Dec 20, 2011·1 cites·15 claims
- 4157US8723279B2MEMS sensor, and MEMS sensor manufacturing methodNAKATANI GORO·Filed 2008·Granted May 13, 2014·1 cites·13 claims
- 4257US8148792B2Pressure sensor and method for manufacturing the pressure sensorNAKATANI GORO·Filed 2009·Granted Apr 3, 2012·3 cites·5 claims
- 4357US2023101361A1Method for manufacturing diffusion cover, diffusion cover, and semiconductor light-emitting device comprising sameROHM CO LTD·Filed 2021·Application pending·0 cites
- 4456US11097554B2Thermal printhead and method of manufacturing the sameROHM CO LTD·Filed 2020·Granted Aug 24, 2021·0 cites·16 claims
- 4555US12036801B2Thermal print head, thermal printer and methods fabricating thereofROHM CO LTD·Filed 2022·Granted Jul 16, 2024·0 cites·20 claims
- 4655US11642894B2Manufacturing method of thermal print headROHM CO LTD·Filed 2021·Granted May 9, 2023·0 cites·17 claims
- 4755US8975090B2Method for manufacturing a MEMS sensorROHM CO LTD·Filed 2014·Granted Mar 10, 2015·0 cites·17 claims
- 4854US8276449B2Acceleration sensor and method of manufacturing acceleration sensorNAKATANI GORO·Filed 2009·Granted Oct 2, 2012·1 cites·13 claims
- 4952US2015214259A1Photoelectric converter and method for manufacturing the sameROHM CO LTD·Filed 2015·Application pending·0 cites
- 5051US8908250B2MEMS mirror device and method for manufacturing the sameNAKATANI GORO·Filed 2012·Granted Dec 9, 2014·1 cites·15 claims
Showing the top 50 of 78 patent records by PatentIndex Score.
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