Inventor · disambiguated record
Michael F. Mcallister
Also filed as: MCALLISTER MICHAEL · MCALLISTER MICHAEL F · MCALLISTER MICHAEL FORD
32 granted patents·2 pending applications·750 citations·filing 1983–2013
98Inventor score
Top patents by PatentIndex Score
34 records- 0193US8796140B1Hybrid conductor through-silicon-via for power distribution and signal transmissionIBM·Filed 2013·Granted Aug 5, 2014·15 cites·10 claims
- 0293US5523619AHigh density memory structureIBM·Filed 1993·Granted Jun 4, 1996·158 cites·15 claims
- 0391US8785289B2Integrated decoupling capacitor employing conductive through-substrate viasIBM·Filed 2013·Granted Jul 22, 2014·11 cites·18 claims
- 0491US4734046ACoaxial converter with resilient terminalIBM·Filed 1986·Granted Mar 29, 1988·75 cites·16 claims
- 0590US8558345B2Integrated decoupling capacitor employing conductive through-substrate viasKIM TAE HONG·Filed 2009·Granted Oct 15, 2013·18 cites·9 claims
- 0689US8791550B1Hybrid conductor through-silicon-via for power distribution and signal transmissionIBM·Filed 2013·Granted Jul 29, 2014·10 cites·11 claims
- 0788US5757079AMethod for repairing defective electrical connections on multi-layer thin film (MLTF) electronic packages and the resulting MLTF structureIBM·Filed 1995·Granted May 26, 1998·90 cites·8 claims
- 0887US7344919B2Method for using gel package structure enhancing thermal dissipation between compressed printed circuit board and heat sink mechanical stiffenerIBM·Filed 2005·Granted Mar 18, 2008·15 cites·10 claims
- 0986US7284992B2Electronic package structures using land grid array interposers for module-to-board interconnectionIBM·Filed 2006·Granted Oct 23, 2007·13 cites·14 claims
- 1080US7543373B2Gel package structural enhancement of compression system board connectionsIBM·Filed 2005·Granted Jun 9, 2009·10 cites·11 claims
- 1175US7363688B2Land grid array structures and methods for engineering changeIBM·Filed 2006·Granted Apr 29, 2008·7 cites·20 claims
- 1274US6462573B1System interface assembly and methodIBM·Filed 2000·Granted Oct 8, 2002·11 cites·7 claims
- 1374US5354955ADirect jump engineering change systemIBM·Filed 1992·Granted Oct 11, 1994·51 cites·11 claims
- 1473US4603023AMethod of making a hybrid dielectric probe interposerIBM·Filed 1983·Granted Jul 29, 1986·28 cites·4 claims
- 1572US7987587B2Method of forming solid vias in a printed circuit boardIBM·Filed 2008·Granted Aug 2, 2011·5 cites·15 claims
- 1672US5378927AThin-film wiring layout for a non-planar thin-film structureIBM·Filed 1993·Granted Jan 3, 1995·46 cites·15 claims
- 1771US6954984B2Land grid array structureIBM·Filed 2002·Granted Oct 18, 2005·12 cites·17 claims
- 1868US7930820B2Method for structural enhancement of compression system board connectionsIBM·Filed 2005·Granted Apr 26, 2011·5 cites·13 claims
- 1965US5747095AMethod for repairing defective electrical connections on multi-layer thin film (MLTF) electronic packagesIBM·Filed 1997·Granted May 5, 1998·28 cites·10 claims
- 2064US6529023B2Application and test methodology for use with compression land grid array connectorsIBM·Filed 2001·Granted Mar 4, 2003·11 cites·8 claims
- 2162US6444919B1Thin film wiring scheme utilizing inter-chip site surface wiringIBM·Filed 1995·Granted Sep 3, 2002·29 cites·21 claims
- 2261US6342788B1Probing systems for chilled environmentIBM·Filed 1999·Granted Jan 29, 2002·23 cites·19 claims
- 2358US5264664AProgrammable chip to circuit board connectionIBM·Filed 1992·Granted Nov 23, 1993·26 cites·12 claims
- 2456US6549024B2Method of interconnecting with a system boardIBM·Filed 2002·Granted Apr 15, 2003·4 cites·1 claims
- 2556US6429644B1Method and apparatus of interconnecting with a system boardIBM·Filed 2000·Granted Aug 6, 2002·4 cites·6 claims
- 2651US6252391B1High frequency probeIBM·Filed 1998·Granted Jun 26, 2001·16 cites·11 claims
- 2751US5817543AMethod of constructing an integrated circuit memoryIBM·Filed 1997·Granted Oct 6, 1998·16 cites·7 claims
- 2849US7077660B2Land grid array structures and methods for engineering changeIBM·Filed 2004·Granted Jul 18, 2006·2 cites·1 claims
- 2949US2008089024A1Multi-Chip Module (MCM) of a Computer SystemIBM·Filed 2007·Application pending·0 cites
- 3047US6538460B1Method and apparatus for enhancing a system boardIBM·Filed 2000·Granted Mar 25, 2003·2 cites·8 claims
- 3147US6433562B1Method and apparatus of interconnecting with a system boardIBM·Filed 1998·Granted Aug 13, 2002·8 cites·24 claims
- 3243US6605953B2Method and apparatus of interconnecting with a system boardIBM·Filed 2002·Granted Aug 12, 2003·1 cites·1 claims
- 3343US2007072450A1Gel package structural enhancement of compression system board connectionsIBM·Filed 2005·Application pending·0 cites
- 3436US8929086B2Gel package structural enhancement of compression system board connectionsMCALLISTER MICHAEL F·Filed 2005·Granted Jan 6, 2015·0 cites·13 claims
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