Inventor · disambiguated record
Yuichi Morita
Also filed as: MORITA YUICHI
21 granted patents·2 pending applications·350 citations·filing 1995–2023
95Inventor score
Top patents by PatentIndex Score
23 records- 0193US6440602B1Battery packNEC CORP·Filed 2000·Granted Aug 27, 2002·58 cites·2 claims
- 0292US5681176AHinge connector suitable for use in a hinge portion included in an electronic deviceNEC CORP·Filed 1995·Granted Oct 28, 1997·89 cites·11 claims
- 0391US8102039B2Semiconductor device and manufacturing method thereofNOMA TAKASHI·Filed 2007·Granted Jan 24, 2012·25 cites·8 claims
- 0491US7508072B2Semiconductor device with pad electrode for testing and manufacturing method of the sameSANYO ELECTRIC CO·Filed 2006·Granted Mar 24, 2009·19 cites·13 claims
- 0589US6680459B2Laser beam machining apparatus and laser beam machining methodNIPPEI TOYAMA CORP·Filed 2002·Granted Jan 20, 2004·76 cites·14 claims
- 0683US7633133B2Semiconductor device and manufacturing method of the sameSANYO ELECTRIC CO·Filed 2006·Granted Dec 15, 2009·12 cites·10 claims
- 0782US6954653B2Cellular phone simultaneously mounting two IC cards and including a lock button for selectively releasing the two IC cardsNEC CORP·Filed 2001·Granted Oct 11, 2005·31 cites·25 claims
- 0879US7986021B2Semiconductor deviceSANYO ELECTRIC CO·Filed 2006·Granted Jul 26, 2011·9 cites·12 claims
- 0975US7575994B2Semiconductor device and manufacturing method of the sameSANYO ELECTRIC CO·Filed 2006·Granted Aug 18, 2009·7 cites·4 claims
- 1068US7123886B2Handheld mobile phone with a detachable battery packNEC CORP·Filed 2002·Granted Oct 17, 2006·10 cites·8 claims
- 1166US7589388B2Semiconductor device and method of manufacturing the sameSANYO ELECTRIC CO·Filed 2007·Granted Sep 15, 2009·3 cites·4 claims
- 1263US7919353B2Semiconductor device and manufacturing method thereofSANYO ELECTRIC CO·Filed 2007·Granted Apr 5, 2011·2 cites·11 claims
- 1362US9034729B2Semiconductor device and method of manufacturing the sameYAMADA HIROSHI·Filed 2007·Granted May 19, 2015·1 cites·9 claims
- 1457US8766408B2Semiconductor device and manufacturing method thereofNOMA TAKASHI·Filed 2007·Granted Jul 1, 2014·1 cites·11 claims
- 1557US8035215B2Semiconductor device and manufacturing method of the sameSEMICONDUCTOR COMPONENTS IND·Filed 2006·Granted Oct 11, 2011·1 cites·10 claims
- 1654US2023373524A1Automatic driving device and radar deviceMITSUBISHI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 1749US11591025B2Front vehicle-body structure of vehicleMAZDA MOTOR·Filed 2021·Granted Feb 28, 2023·0 cites·17 claims
- 1848US11608017B2Vehicle front body structureMAZDA MOTOR·Filed 2021·Granted Mar 21, 2023·0 cites·7 claims
- 1948US11554811B2Vehicle lower body structureMAZDA MOTOR·Filed 2021·Granted Jan 17, 2023·0 cites·19 claims
- 2047US11548558B2Front vehicle-body structure of vehicleMAZDA MOTOR·Filed 2021·Granted Jan 10, 2023·0 cites·20 claims
- 2146US11591024B2Vehicle side body structureMAZDA MOTOR·Filed 2021·Granted Feb 28, 2023·0 cites·15 claims
- 2242US2006289991A1Semiconductor device and manufacturing method of the sameSANYO ELECTRIC CO·Filed 2006·Application pending·0 cites
- 2335US6323758B1Vibration generating unitNEC CORP·Filed 1999·Granted Nov 27, 2001·6 cites·13 claims
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