Inventor · disambiguated record
Hiroshi Ushiki
Also filed as: USHIKI HIROSHI
22 granted patents·210 citations·filing 1982–2003
95Inventor score
Top patents by PatentIndex Score
22 records- 0177US6619530B2Wire bonding apparatusSHINKAWA KK·Filed 2001·Granted Sep 16, 2003·26 cites·4 claims
- 0263US5181646ALead frame holding apparatus for use in wire bondersSHINKAWA KK·Filed 1992·Granted Jan 26, 1993·33 cites·2 claims
- 0360US6229530B1Liquid crystal driving circuitTOSHIBA KK·Filed 1999·Granted May 8, 2001·23 cites·6 claims
- 0452US5044543AWire bonding method and apparatusSHINKAWA KK·Filed 1990·Granted Sep 3, 1991·27 cites·2 claims
- 0546US6505823B2Apparatus for positioning a semiconductor pelletSHINKAWA KK·Filed 2001·Granted Jan 14, 2003·2 cites·2 claims
- 0646US4958151ADisplay control circuitTOSHIBA KK·Filed 1985·Granted Sep 18, 1990·16 cites·5 claims
- 0744US6193130B1Bump bonding apparatusSHINKAWA KK·Filed 1999·Granted Feb 27, 2001·12 cites·6 claims
- 0838US6161747ABonding apparatusSHINKAWA KK·Filed 1999·Granted Dec 19, 2000·6 cites·2 claims
- 0938US5951283ASubstrate transporting deviceSHINKAWA KK·Filed 1998·Granted Sep 14, 1999·8 cites·6 claims
- 1038US4979147AElectronic device with key switchTOSHIBA KK·Filed 1989·Granted Dec 18, 1990·5 cites·4 claims
- 1137US5220997APushing mechanism in a lead frame conveying apparatusSHINKAWA KK·Filed 1992·Granted Jun 22, 1993·12 cites·1 claims
- 1234US6793066B2Conveying apparatus for plate-form membersSHINKAWA KK·Filed 2003·Granted Sep 21, 2004·0 cites·3 claims
- 1334US4701748AKey circuitTOSHIBA KK·Filed 1986·Granted Oct 20, 1987·5 cites·6 claims
- 1433US5397213AConveying devices used in a semiconductor assembly lineSHINKAWA KK·Filed 1994·Granted Mar 14, 1995·6 cites·2 claims
- 1533US5046655ADevice for detecting height of bonding surfaceSHINKAWA KK·Filed 1989·Granted Sep 10, 1991·4 cites·1 claims
- 1631US4986460AApparatus for manufacturing semiconductor devicesSHINKAWA KK·Filed 1989·Granted Jan 22, 1991·7 cites·4 claims
- 1731US4587519AInput deviceTOKYO SHIBAURA ELECTRIC CO·Filed 1982·Granted May 6, 1986·5 cites·7 claims
- 1830US6632703B2Method and apparatus for positioning a semiconductor pelletSHINKAWA KK·Filed 1999·Granted Oct 14, 2003·1 cites·1 claims
- 1930US5217107AApparatus for feeding plate-form partsSHINKAWA KK·Filed 1992·Granted Jun 8, 1993·1 cites·2 claims
- 2029US5197022AOverflow detection calculator and method of overflow determinationTOSHIBA KK·Filed 1990·Granted Mar 23, 1993·3 cites·5 claims
- 2128US4975050AWorkpiece heating and feeding deviceSHINKAWA KK·Filed 1989·Granted Dec 4, 1990·3 cites·2 claims
- 2227US5097983ASupply device used in a semiconductor assembly apparatusSHINKAWA KK·Filed 1990·Granted Mar 24, 1992·5 cites·3 claims
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