Inventor · disambiguated record
Leslie Edward Stark
Also filed as: STARK LESLIE · STARK LESLIE E · STARK LESLIE EDWARD
25 granted patents·7 pending applications·222 citations·filing 1996–2025
95Inventor score
Top patents by PatentIndex Score
32 records- 0192US6583515B1Ball grid array package for enhanced stress toleranceTEXAS INSTRUMENTS INC·Filed 2000·Granted Jun 24, 2003·77 cites·19 claims
- 0283US5783025AOptical diebonding for semiconductor devicesTEXAS INSTRUMENTS INC·Filed 1996·Granted Jul 21, 1998·63 cites·4 claims
- 0381US12198995B2Covers for semiconductor package componentsTEXAS INSTRUMENTS INC·Filed 2023·Granted Jan 14, 2025·0 cites·20 claims
- 0478US11972994B2Film covers for sensor packagesTEXAS INSTRUMENTS INC·Filed 2023·Granted Apr 30, 2024·0 cites·19 claims
- 0573US12347738B2Sensor package cavities with polymer filmsTEXAS INSTRUMENTS INC·Filed 2022·Granted Jul 1, 2025·0 cites·36 claims
- 0673US6689678B2Process for fabricating ball grid array package for enhanced stress toleranceTEXAS INSTRUMENTS INC·Filed 2003·Granted Feb 10, 2004·19 cites·7 claims
- 0772US8816513B2Electronic assembly with three dimensional inkjet printed tracesROMIG MATTHEW DAVID·Filed 2012·Granted Aug 26, 2014·4 cites·15 claims
- 0872US2025149394A1Covers for semiconductor package componentsTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 0972US2024178184A1Proximity sensorTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 1070US11784103B2Covers for semiconductor package componentsTEXAS INSTRUMENTS INC·Filed 2020·Granted Oct 10, 2023·0 cites·15 claims
- 1170US11658083B2Film covers for sensor packagesTEXAS INSTRUMENTS INC·Filed 2020·Granted May 23, 2023·0 cites·20 claims
- 1270US8945986B2Electronic assembly with three dimensional inkjet printed tracesTEXAS INSTRUMENTS INC·Filed 2014·Granted Feb 3, 2015·2 cites·7 claims
- 1367US12203776B2Miniature sensor cavitiesTEXAS INSTRUMENTS INC·Filed 2020·Granted Jan 21, 2025·0 cites·16 claims
- 1467US11894339B2Proximity sensorTEXAS INSTRUMENTS INC·Filed 2020·Granted Feb 6, 2024·0 cites·14 claims
- 1567US11476175B2Sensor package cavities with polymer filmsTEXAS INSTRUMENTS INC·Filed 2020·Granted Oct 18, 2022·0 cites·10 claims
- 1666US2025164296A1Miniature sensor cavitiesTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 1765US8847349B2Integrated circuit package with printed circuit layerTEXAS INSTRUMENTS INC·Filed 2012·Granted Sep 30, 2014·2 cites·1 claims
- 1859US11410913B2Multi-layer die attachmentTEXAS INSTRUMENTS INC·Filed 2020·Granted Aug 9, 2022·0 cites·8 claims
- 1959US2025372548A1Inductor module with packaged semiconductor dieTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 2055US10636727B2Multi-layer die attachmentTEXAS INSTRUMENTS INC·Filed 2018·Granted Apr 28, 2020·0 cites·16 claims
- 2154US9111845B2Integrated circuit package with printed circuit layerTEXAS INSTRUMENTS INC·Filed 2014·Granted Aug 18, 2015·0 cites·13 claims
- 2249US6227353B1System for applying a rotary force to strips of varying widthsTEXAS INSTRUMENTS INC·Filed 2000·Granted May 8, 2001·2 cites·4 claims
- 2348US2022173256A1Optical sensor packages with glass membersTEXAS INSTRUMENTS INC·Filed 2020·Application pending·0 cites
- 2447US5846476AOptical curing process for intergrated circuit package assemblyTEXAS INSTRUMENTS INC·Filed 1997·Granted Dec 8, 1998·18 cites·1 claims
- 2546US9899339B2Discrete device mounted on substrateTEXAS INSTRUMENTS INC·Filed 2012·Granted Feb 20, 2018·0 cites·9 claims
- 2645US6234296B1System for positioning a carrier relative to a travel pathTEXAS INSTRUMENTS INC·Filed 2000·Granted May 22, 2001·1 cites·6 claims
- 2745US6069342AAutomated multiple lead frame strip radiant die attach material curing apparatusTEXAS INSTRUMENTS INC·Filed 1997·Granted May 30, 2000·10 cites·10 claims
- 2838US6226452B1Radiant chamber for simultaneous rapid die attach and lead frame embed for ceramic packagingTEXAS INSTRUMENTS INC·Filed 1998·Granted May 1, 2001·8 cites·12 claims
- 2938US5960307AMethod of forming ball grid array contactsTEXAS INSTRUMENTS INC·Filed 1997·Granted Sep 28, 1999·7 cites·10 claims
- 3037US5993591ACoring of leadframes in carriers via radiant heat sourceTEXAS INSTRUMENTS INC·Filed 1997·Granted Nov 30, 1999·9 cites·22 claims
- 3137US2002114143A1Chip-scale packages stacked on folded interconnector for vertical assembly on substratesFiled 2002·Application pending·0 cites
- 3235US2017018483A1Integrated circuit chip fabrication leadframeTEXAS INSTRUMENTS INC·Filed 2015·Application pending·0 cites
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