Inventor · disambiguated record
Chia-Ling Wang
Also filed as: WANG CHIA L · WANG CHIA-LING
16 granted patents·1 pending application·187 citations·filing 1991–2024
91Inventor score
Files withUNITED MICROELECTRONICS CORP8GENCORP INC4WANG CHIA L2WANG CHIA-LING2JPMORGAN CHASE BANK NA1
Top patents by PatentIndex Score
17 records- 0194US5175228ATwo-component primerless urethane-isocyanurate adhesive compositions having high temperature resistanceGENCORP INC·Filed 1991·Granted Dec 29, 1992·98 cites·37 claims
- 0285US8703896B2Polyurethane systems having non-sag, paintability, and primerless adhesion on concreteWANG CHIA L·Filed 2012·Granted Apr 22, 2014·7 cites·26 claims
- 0374US5340901ATwo-component, primerless, organic phosphorus containing polyurethane adhesiveGENCORP INC·Filed 1993·Granted Aug 23, 1994·34 cites·12 claims
- 0473US12310071B2Semiconductor structure and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2024·Granted May 20, 2025·0 cites·13 claims
- 0566US8697188B2Polyurethane systems having non-sag and paintabilityWANG CHIA L·Filed 2012·Granted Apr 15, 2014·1 cites·18 claims
- 0665US5354609ATwo-component primerless modified urethane adhesive for powder coatingsGENCORP INC·Filed 1992·Granted Oct 11, 1994·25 cites·17 claims
- 0762US12342585B2Semiconductor structure and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2022·Granted Jun 24, 2025·0 cites·5 claims
- 0856US10475903B2Method of forming transistor with dual spacerUNITED MICROELECTRONICS CORP·Filed 2019·Granted Nov 12, 2019·0 cites·10 claims
- 0954US12046596B2Semiconductor structure and forming method thereofUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jul 23, 2024·0 cites·14 claims
- 1053US10453938B2Transistor with dual spacer and forming method thereofUNITED MICROELECTRONICS CORP·Filed 2017·Granted Oct 22, 2019·0 cites·7 claims
- 1152US8967658B1Folding ball trolleyWANG CHIA-LING·Filed 2014·Granted Mar 3, 2015·3 cites·18 claims
- 1252US2024395883A1Semiconductor structure with flush shallow trench isolation and gate oxide and method of manufacturing the sameUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 1351US12183809B2Manufacturing method of semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2022·Granted Dec 31, 2024·0 cites·17 claims
- 1450US12100624B2Semiconductor device and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Sep 24, 2024·0 cites·3 claims
- 1550US5606003APrimerless urethane adhesive compositionsGENCORP INC·Filed 1994·Granted Feb 25, 1997·18 cites·21 claims
- 1647US9168938B2Folding ball trolley having minimized volumeWANG CHIA-LING·Filed 2013·Granted Oct 27, 2015·1 cites·22 claims
- 1740US11436134B2Method and apparatus for data integration frameworkJPMORGAN CHASE BANK NA·Filed 2020·Granted Sep 6, 2022·0 cites·19 claims
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