Inventor · disambiguated record
Carl Galewski
Also filed as: GALEWSKI CARL · GALEWSKI CARL J
26 granted patents·7 pending applications·3,739 citations·filing 1992–2018
97Inventor score
Top patents by PatentIndex Score
33 records- 0199US6540838B2Apparatus and concept for minimizing parasitic chemical vapor deposition during atomic layer depositionGENUS INC·Filed 2002·Granted Apr 1, 2003·447 cites·10 claims
- 0299US6503330B1Apparatus and method to achieve continuous interface and ultrathin film during atomic layer depositionGENUS INC·Filed 1999·Granted Jan 7, 2003·616 cites·15 claims
- 0399US6305314B1Apparatus and concept for minimizing parasitic chemical vapor deposition during atomic layer depositionGENUS INC·Filed 1999·Granted Oct 23, 2001·487 cites·20 claims
- 0498US6451119B2Apparatus and concept for minimizing parasitic chemical vapor deposition during atomic layer depositionGENUS INC·Filed 2000·Granted Sep 17, 2002·341 cites·8 claims
- 0598US6368954B1Method of copper interconnect formation using atomic layer copper depositionADVANCED MICRO DEVICES INC·Filed 2000·Granted Apr 9, 2002·312 cites·28 claims
- 0698US6174377B1Processing chamber for atomic layer deposition processesGENUS INC·Filed 1999·Granted Jan 16, 2001·639 cites·9 claims
- 0797US6638859B2Apparatus and method to achieve continuous interface and ultrathin film during atomic layer depositionGENUS INC·Filed 2002·Granted Oct 28, 2003·154 cites·31 claims
- 0896US6387185B2Processing chamber for atomic layer deposition processesGENUS INC·Filed 2001·Granted May 14, 2002·123 cites·10 claims
- 0995US5855675AMultipurpose processing chamber for chemical vapor deposition processesGENUS INC·Filed 1997·Granted Jan 5, 1999·230 cites·19 claims
- 1094US8697197B2Methods for plasma processingSAVAS STEPHEN EDWARD·Filed 2010·Granted Apr 15, 2014·23 cites·31 claims
- 1194US6818067B2Processing chamber for atomic layer deposition processesGENUS INC·Filed 2002·Granted Nov 16, 2004·75 cites·1 claims
- 1294US6479902B1Semiconductor catalytic layer and atomic layer deposition thereofADVANCED MICRO DEVICES INC·Filed 2000·Granted Nov 12, 2002·85 cites·12 claims
- 1391US6897119B1Apparatus and method to achieve continuous interface and ultrathin film during atomic layer depositionGENUS INC·Filed 2003·Granted May 24, 2005·46 cites·3 claims
- 1488US5324684AGas phase doping of semiconductor material in a cold-wall radiantly heated reactor under reduced pressurePROCESSING TECHNOLOGIES INC AG·Filed 1992·Granted Jun 28, 1994·118 cites·78 claims
- 1581US9443702B2Methods for plasma processingAIXTRON SE·Filed 2015·Granted Sep 13, 2016·2 cites·17 claims
- 1681US9096933B2Methods for plasma processingAIXTRON INC·Filed 2014·Granted Aug 4, 2015·3 cites·21 claims
- 1776US6538327B1Method of copper interconnect formation using atomic layer copper deposition and a device thereby formedADVANCED MICRO DEVICES INC·Filed 2002·Granted Mar 25, 2003·16 cites·13 claims
- 1871US9831466B2Method for depositing a multi-layer moisture barrier on electronic devices and electronic devices protected by a multi-layer moisture barrierAIXTRON SE·Filed 2014·Granted Nov 28, 2017·2 cites·29 claims
- 1971US8765232B2Apparatus and method for dielectric depositionSAVAS STEPHEN EDWARD·Filed 2012·Granted Jul 1, 2014·2 cites·20 claims
- 2070US9299956B2Method for deposition of high-performance coatings and encapsulated electronic devicesAIXTRON INC·Filed 2013·Granted Mar 29, 2016·2 cites·21 claims
- 2170US9096932B2Methods for plasma processingAIXTRON INC·Filed 2014·Granted Aug 4, 2015·1 cites·34 claims
- 2269US10526708B2Methods for forming thin protective and optical layers on substratesAIXTRON SE·Filed 2018·Granted Jan 7, 2020·1 cites·20 claims
- 2369US9359674B2Apparatus and method for dielectric depositionAIXTRON INC·Filed 2014·Granted Jun 7, 2016·0 cites·5 claims
- 2466US10049859B2Plasma generating units for processing a substrateSAVAS STEPHEN EDWARD·Filed 2010·Granted Aug 14, 2018·1 cites·24 claims
- 2550US2013337657A1Apparatus and method for forming thin protective and optical layers on substratesPLASMASI INC·Filed 2013·Application pending·0 cites
- 2648US2009325386A1Process and System For Varying the Exposure to a Chemical Ambient in a Process ChamberMATTSON TECH INC·Filed 2009·Application pending·0 cites
- 2747US2016289837A1Apparatus and method for forming thin protective and optical layers on substratesAIXTRON INC·Filed 2016·Application pending·0 cites
- 2842US2003183171A1Apparatus and concept for minimizing parasitic chemical vapor deposition during atomic layer depositionFiled 2003·Application pending·0 cites
- 2941US10294562B2Exhaust manifold in a CVD reactorAIXTRON SE·Filed 2016·Granted May 21, 2019·0 cites·11 claims
- 3041US6635570B1PECVD and CVD processes for WNx depositionFiled 1999·Granted Oct 21, 2003·13 cites·11 claims
- 3141US2007095283A1Pumping System for Atomic Layer DepositionGALEWSKI CARL J·Filed 2006·Application pending·0 cites
- 3238US2004238008A1Systems and methods for cleaning semiconductor substrates using a reduced volume of liquidFiled 2003·Application pending·0 cites
- 3337US2007107523A1Distributed Pressure Sensoring SystemGALEWSKI CARL J·Filed 2006·Application pending·0 cites
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