Inventor · disambiguated record
Masanori Onodera
Also filed as: ONODERA MASANORI
63 granted patents·10 pending applications·2,041 citations·filing 1996–2023
99Inventor score
Files withFUJITSU LTD22SPANSION LLC21ONODERA MASANORI10VALLEY DEVICE MAN4CYPRESS SEMICONDUCTOR CORP3
Top patents by PatentIndex Score
73 records- 0199US6072239ADevice having resin package with projectionsFUJITSU LTD·Filed 1996·Granted Jun 6, 2000·241 cites·14 claims
- 0298US5656550AMethod of producing a semicondutor device having a lead portion with outer connecting terminalFUJITSU LTD·Filed 1996·Granted Aug 12, 1997·366 cites·24 claims
- 0394US7626253B2Computing device including a stacked semiconductor deviceSPANSION LLC·Filed 2006·Granted Dec 1, 2009·19 cites·4 claims
- 0494US6025650ASemiconductor device including a frame terminalFUJITSU LTD·Filed 1997·Granted Feb 15, 2000·220 cites·15 claims
- 0593US7285848B2Carrier for stacked type semiconductor device and method of fabricating the sameSPANSION LLC·Filed 2005·Granted Oct 23, 2007·19 cites·10 claims
- 0693US6159770AMethod and apparatus for fabricating semiconductor deviceFUJITSU LTD·Filed 1998·Granted Dec 12, 2000·212 cites·9 claims
- 0792US6881611B1Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the deviceFUJITSU LTD·Filed 2000·Granted Apr 19, 2005·85 cites·24 claims
- 0892US6255740B1Semiconductor device having a lead portion with outer connecting terminalsFUJITSU LTD·Filed 1997·Granted Jul 3, 2001·122 cites·7 claims
- 0992US6218281B1Semiconductor device with flip chip bonding pads and manufacture thereofFUJITSU LTD·Filed 1998·Granted Apr 17, 2001·162 cites·29 claims
- 1091US9418940B2Structures and methods for stack type semiconductor packagingHOSHINO MASATAKA·Filed 2008·Granted Aug 16, 2016·35 cites·20 claims
- 1191US7605457B2Semiconductor device and method of manufacturing the sameSPANSION LLC·Filed 2006·Granted Oct 20, 2009·18 cites·8 claims
- 1289US6329711B1Semiconductor device and mounting structureFUJITSU LTD·Filed 1998·Granted Dec 11, 2001·122 cites·13 claims
- 1386US7834470B2Semiconductor device and programming methodSPANSION LLC·Filed 2009·Granted Nov 16, 2010·9 cites·18 claims
- 1486US7683473B2Semiconductor device, fabrication method therefor, and film fabrication methodSPANSION LLC·Filed 2006·Granted Mar 23, 2010·14 cites·29 claims
- 1586US6541848B2Semiconductor device including stud bumps as external connection terminalsFUJITSU LTD·Filed 1998·Granted Apr 1, 2003·58 cites·9 claims
- 1685US7884630B2IC carrie, IC socket and method for testing IC deviceMICRONICS JAPAN CO LTD·Filed 2005·Granted Feb 8, 2011·15 cites·20 claims
- 1784US7859096B2Semiconductor deviceSPANSION LLC·Filed 2009·Granted Dec 28, 2010·6 cites·20 claims
- 1884US6798031B2Semiconductor device and method for making the sameFUJITSU LTD·Filed 2002·Granted Sep 28, 2004·39 cites·42 claims
- 1984US5930603AMethod for producing a semiconductor deviceFUJITSU LTD·Filed 1997·Granted Jul 27, 1999·77 cites·10 claims
- 2082US8030179B2Semiconductor device and method of manufacturing the sameSPANSION LLC·Filed 2009·Granted Oct 4, 2011·8 cites·9 claims
- 2181US9472540B2Methods for making semiconductor device with sealing resinVALLEY DEVICE MAN·Filed 2015·Granted Oct 18, 2016·2 cites·17 claims
- 2281US7964446B2Semiconductor device and method of manufacturing the sameSPANSION LLC·Filed 2008·Granted Jun 21, 2011·8 cites·11 claims
- 2380US8330263B2Semiconductor deviceONODERA MASANORI·Filed 2010·Granted Dec 11, 2012·3 cites·20 claims
- 2480US7846829B2Stacked solder balls for integrated circuit device packaging and assemblySPANSION LLC·Filed 2008·Granted Dec 7, 2010·8 cites·10 claims
- 2578US7566978B2Semiconductor device and programming methodSPANSION LLC·Filed 2007·Granted Jul 28, 2009·5 cites·16 claims
- 2677US7968990B2Semiconductor device and method of fabricating the sameSPANSION LLC·Filed 2007·Granted Jun 28, 2011·7 cites·11 claims
- 2776US8329562B2Methods of making a semiconductor deviceONODERA MASANORI·Filed 2010·Granted Dec 11, 2012·2 cites·20 claims
- 2876US6420213B1Method for fixing a semiconductor device having stud bumps to a substrate by an electrically non-conductive adhesiveFUJITSU LTD·Filed 2000·Granted Jul 16, 2002·27 cites·11 claims
- 2974US8531019B2Heat dissipation methods and structures for semiconductor deviceONODERA MASANORI·Filed 2007·Granted Sep 10, 2013·5 cites·13 claims
- 3074US6600217B2Mounting substrate and mounting method for semiconductor deviceFUJITSU LTD·Filed 2000·Granted Jul 29, 2003·22 cites·10 claims
- 3172US6373140B1Semiconductor deviceFUJITSU LTD·Filed 2000·Granted Apr 16, 2002·26 cites·6 claims
- 3271US7659937B2Camera module equipped with an optical filter having an edge not in contact with a fixing portionFUJITSU MICROELECTRONICS LTD·Filed 2006·Granted Feb 9, 2010·3 cites·3 claims
- 3371US7202460B2Camera module for compact electronic equipmentsFUJITSU LTD·Filed 2003·Granted Apr 10, 2007·15 cites·6 claims
- 3470US8772953B2Semiconductor device and programming methodTAYA KOJI·Filed 2009·Granted Jul 8, 2014·3 cites·24 claims
- 3570US7696616B2Stacked type semiconductor device and method of fabricating stacked type semiconductor deviceSPANSION LLC·Filed 2006·Granted Apr 13, 2010·4 cites·9 claims
- 3669US7642637B2Carrier for stacked type semiconductor device and method of fabricating the sameSPANSION LLC·Filed 2007·Granted Jan 5, 2010·2 cites·8 claims
- 3769US7282693B2Camera module for compact electronic equipmentsFUJITSU LTD·Filed 2007·Granted Oct 16, 2007·3 cites·4 claims
- 3868US8900928B2Semiconductor device and programming methodSPANSION LLC·Filed 2013·Granted Dec 2, 2014·1 cites·20 claims
- 3966US8637997B2Semiconductor device and method of manufacturing the sameONODERA MASANORI·Filed 2007·Granted Jan 28, 2014·2 cites·14 claims
- 4065US9508651B2Semiconductor device and method of manufacturing the sameONODERA MASANORI·Filed 2008·Granted Nov 29, 2016·2 cites·20 claims
- 4165US8759157B2Heat dissipation methods and structures for semiconductor deviceSPANSION LLC·Filed 2013·Granted Jun 24, 2014·1 cites·13 claims
- 4265US8530282B2Semiconductor device and programming methodTAYA KOJI·Filed 2010·Granted Sep 10, 2013·1 cites·18 claims
- 4364US8586412B1Semiconductor device and method for manufacturing thereofSPANSION LLC·Filed 2013·Granted Nov 19, 2013·1 cites·12 claims
- 4463US8466552B2Semiconductor device and method of manufacturing the sameONODERA MASANORI·Filed 2011·Granted Jun 18, 2013·1 cites·14 claims
- 4563US7489029B2Carrier structure for stacked-type semiconductor device, method of producing the same, and method of fabricating stacked-type semiconductor deviceSPANSION LLC·Filed 2005·Granted Feb 10, 2009·1 cites·8 claims
- 4662US11018105B2Semiconductor device and method of manufacturing the sameCYPRESS SEMICONDUCTOR CORP·Filed 2019·Granted May 25, 2021·0 cites·8 claims
- 4762US10347618B2Non-volatile memory with stacked semiconductor chipsVALLEY DEVICE MAN·Filed 2017·Granted Jul 9, 2019·0 cites·6 claims
- 4862US9293441B2Semiconductor device and method of manufacturing the sameHOSHINO MASATAKA·Filed 2011·Granted Mar 22, 2016·1 cites·11 claims
- 4959US9837397B2Non-volatile memory and devices that use the sameVALLEY DEVICE MAN·Filed 2016·Granted Dec 5, 2017·0 cites·10 claims
- 5059US8749039B2Semiconductor device having chip mounted on an interposerONODERA MASANORI·Filed 2008·Granted Jun 10, 2014·1 cites·6 claims
Showing the top 50 of 73 patent records by PatentIndex Score.
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