Inventor · disambiguated record
Owen R. Fay
Also filed as: FAY OWEN · FAY OWEN R · FAY OWEN RICHARD
110 granted patents·32 pending applications·835 citations·filing 1999–2025
99Inventor score
Files withMICRON TECHNOLOGY INC115FREESCALE SEMICONDUCTOR INC9LODESTAR LICENSING GROUP LLC6FAY OWEN R4MOTOROLA INC2
Top patents by PatentIndex Score
142 records- 0198US11868253B2Memory device interface and methodLODESTAR LICENSING GROUP LLC·Filed 2022·Granted Jan 9, 2024·3 cites·20 claims
- 0298US11574820B2Semiconductor devices with flexible reinforcement structureMICRON TECHNOLOGY INC·Filed 2020·Granted Feb 7, 2023·4 cites·20 claims
- 0398US11386004B2Memory device interface and methodMICRON TECHNOLOGY INC·Filed 2020·Granted Jul 12, 2022·12 cites·20 claims
- 0497US11824010B2Interposers for microelectronic devicesMICRON TECHNOLOGY INC·Filed 2022·Granted Nov 21, 2023·3 cites·20 claims
- 0596US11456284B2Microelectronic device assemblies and packages and related methodsMICRON TECHNOLOGY INC·Filed 2020·Granted Sep 27, 2022·5 cites·18 claims
- 0696US11362070B2Microelectronic device assemblies and packages including multiple device stacks and related methodsMICRON TECHNOLOGY INC·Filed 2020·Granted Jun 14, 2022·5 cites·31 claims
- 0796US9418926B1Package-on-package semiconductor assemblies and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2015·Granted Aug 16, 2016·19 cites·5 claims
- 0896US7595226B2Method of packaging an integrated circuit dieFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Sep 29, 2009·65 cites·20 claims
- 0996US7425464B2Semiconductor device packagingFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Sep 16, 2008·85 cites·18 claims
- 1095US10872835B1Semiconductor assemblies including vertically integrated circuits and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2019·Granted Dec 22, 2020·8 cites·20 claims
- 1194US11552045B2Semiconductor assemblies with redistribution structures for die stack signal routingMICRON TECHNOLOGY INC·Filed 2020·Granted Jan 10, 2023·3 cites·24 claims
- 1293US9595513B2Proximity coupling of interconnect packaging systems and methodsMICRON TECHNOLOGY INC·Filed 2014·Granted Mar 14, 2017·11 cites·21 claims
- 1393US7872332B2Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2008·Granted Jan 18, 2011·20 cites·21 claims
- 1493US7015075B2Die encapsulation using a porous carrierFREESCALE SEMICONUCTOR INC·Filed 2004·Granted Mar 21, 2006·200 cites·34 claims
- 1593US6953985B2Wafer level MEMS packagingFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Oct 11, 2005·127 cites·29 claims
- 1693US2025391670A1Semiconductor devices with flexible reinforcement structureMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 1792US10529592B2Semiconductor device assembly with pillar arrayMICRON TECHNOLOGY INC·Filed 2017·Granted Jan 7, 2020·7 cites·17 claims
- 1892US10297561B1Interconnect structures for preventing solder bridging, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2017·Granted May 21, 2019·10 cites·22 claims
- 1992US6780751B2Method for eliminating voiding in plated solderFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Aug 24, 2004·27 cites·18 claims
- 2091US11990446B2Semiconductor assemblies with redistribution structures for die stack signal routingMICRON TECHNOLOGY INC·Filed 2023·Granted May 21, 2024·1 cites·20 claims
- 2191US11018098B2Fabricated two-sided millimeter wave antenna using through-silicon-viasMICRON TECHNOLOGY INC·Filed 2018·Granted May 25, 2021·6 cites·19 claims
- 2290US10032703B2Package-on-package semiconductor assemblies and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2016·Granted Jul 24, 2018·5 cites·12 claims
- 2390US8435836B2Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methodsFAY OWEN R·Filed 2011·Granted May 7, 2013·9 cites·14 claims
- 2489US2025379185A1Semiconductor assemblies with redistribution structures for die stack signal routingMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 2588US12400877B2Semiconductor devices with flexible reinforcement structureMICRON TECHNOLOGY INC·Filed 2024·Granted Aug 26, 2025·0 cites·20 claims
- 2688US11791315B2Semiconductor assemblies including thermal circuits and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2021·Granted Oct 17, 2023·1 cites·20 claims
- 2788US11482504B2Edge-notched substrate packaging and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2020·Granted Oct 25, 2022·2 cites·20 claims
- 2888US11171118B2Semiconductor assemblies including thermal circuits and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2019·Granted Nov 9, 2021·4 cites·21 claims
- 2988US8659153B2Pillar on pad interconnect structures, semiconductor dice and die assemblies including such interconnect structures, and related methodsFAY OWEN R·Filed 2012·Granted Feb 25, 2014·9 cites·29 claims
- 3087US10840229B2Graphics processing unit and high bandwidth memory integration using integrated interface and silicon interposerMICRON TECHNOLOGY INC·Filed 2018·Granted Nov 17, 2020·3 cites·16 claims
- 3187US10600750B2Interconnect structures for preventing solder bridging, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Mar 24, 2020·5 cites·20 claims
- 3287US10381297B2Package-on-package semiconductor assemblies and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2018·Granted Aug 13, 2019·3 cites·12 claims
- 3387US9165888B2Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2014·Granted Oct 20, 2015·5 cites·11 claims
- 3486US11081460B2Methods and systems for manufacturing pillar structures on semiconductor devicesMICRON TECHNOLOGY INC·Filed 2018·Granted Aug 3, 2021·5 cites·22 claims
- 3586US6930032B2Under bump metallurgy structural design for high reliability bumped packagesFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Aug 16, 2005·43 cites·17 claims
- 3686US2024339390A1Package-on-package semiconductor assemblies and methods of manufacturing the sameLODESTAR LICENSING GROUP LLC·Filed 2024·Application pending·0 cites
- 3785US12253943B2Memory device interface and methodLODESTAR LICENSING GROUP LLC·Filed 2023·Granted Mar 18, 2025·0 cites·20 claims
- 3885US11664291B2Semiconductor assemblies including vertically integrated circuits and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2020·Granted May 30, 2023·1 cites·19 claims
- 3985US11177222B2Semiconductor packages and associated methods with antennas and EMI isolation shieldsMICRON TECHNOLOGY INC·Filed 2019·Granted Nov 16, 2021·3 cites·20 claims
- 4085US11139229B2Package-on-package semiconductor assemblies and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2019·Granted Oct 5, 2021·2 cites·20 claims
- 4185US10062678B2Proximity coupling of interconnect packaging systems and methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Aug 28, 2018·3 cites·14 claims
- 4285US2025118722A1Graphics Processing Unit and High Bandwidth Memory Integration Using Integrated Interface and Silicon InterposerMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 4385US2025112105A1Semiconductor assemblies including vertically integrated circuits and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 4483US12394750B2Semiconductor assemblies with redistribution structures for die stack signal routingMICRON TECHNOLOGY INC·Filed 2024·Granted Aug 19, 2025·0 cites·20 claims
- 4583US11990350B2Semiconductor devices with flexible reinforcement structureMICRON TECHNOLOGY INC·Filed 2023·Granted May 21, 2024·0 cites·20 claims
- 4683US11264332B2Interposers for microelectronic devicesMICRON TECHNOLOGY INC·Filed 2019·Granted Mar 1, 2022·2 cites·26 claims
- 4782US12277056B2Memory device interface and methodMICRON TECHNOLOGY INC·Filed 2023·Granted Apr 15, 2025·0 cites·17 claims
- 4882US12199001B2Semiconductor assemblies including vertically integrated circuits and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2023·Granted Jan 14, 2025·0 cites·20 claims
- 4982US10770398B2Graphics processing unit and high bandwidth memory integration using integrated interface and silicon interposerMICRON TECHNOLOGY INC·Filed 2018·Granted Sep 8, 2020·3 cites·17 claims
- 5082US7078796B2Corrosion-resistant copper bond pad and integrated deviceFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Jul 18, 2006·41 cites·27 claims
Showing the top 50 of 142 patent records by PatentIndex Score.
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