Inventor · disambiguated record
Hsiao Ching-Wen
Also filed as: CHING-WEN HSIAO
3 granted patents·1 pending application·3 citations·filing 2021–2024
57Inventor score
Technology areasH10W
Files withTAIWAN SEMICONDUCTOR MFG CO LTD4
Top patents by PatentIndex Score
4 records- 0195US11728262B2Metal plate corner structure on metal insulator metalTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 15, 2023·3 cites·20 claims
- 0278US12142582B2Organic interposer including a dual-layer inductor structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 12, 2024·0 cites·20 claims
- 0378US12107041B2Metal plate corner structure on metal insulator metalTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 1, 2024·0 cites·20 claims
- 0477US2024379529A1Metal plate corner structure on metal insulator metalTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →