Inventor · disambiguated record
Wu-Cheng Kuo
Also filed as: KUO WU-CHENG
22 granted patents·7 pending applications·117 citations·filing 2002–2017
94Inventor score
Top patents by PatentIndex Score
29 records- 0191US7521724B2Light emitting diode package and process of making the sameIND TECH RES INST·Filed 2005·Granted Apr 21, 2009·26 cites·37 claims
- 0289US9837455B2Image sensorVISERA TECHNOLOGIES CO LTD·Filed 2016·Granted Dec 5, 2017·7 cites·17 claims
- 0388US9219893B2Method for correcting pixel information of color pixels on a color filter array of an image sensorVISERA TECHNOLOGIES CO LTD·Filed 2014·Granted Dec 22, 2015·7 cites·20 claims
- 0486US9876995B2Image sensorVISERA TECHNOLOGIES CO LTD·Filed 2015·Granted Jan 23, 2018·4 cites·19 claims
- 0586US8866944B2Method for correcting pixel information of color pixels on a color filter array of an image sensorVISERA TECHNOLOGIES CO LTD·Filed 2012·Granted Oct 21, 2014·6 cites·19 claims
- 0683US12009379B2Image sensorVISERA TECHNOLOGIES CO LTD·Filed 2017·Granted Jun 11, 2024·2 cites·11 claims
- 0781US10319760B2Image sensorVISERA TECHNOLOGIES CO LTD·Filed 2015·Granted Jun 11, 2019·4 cites·20 claims
- 0880US10224357B1Image sensor packagesVISERA TECHNOLOGIES CO LTD·Filed 2017·Granted Mar 5, 2019·3 cites·20 claims
- 0977US8735913B2Light emitting semiconductor structureKUO WU-CHENG·Filed 2011·Granted May 27, 2014·5 cites·7 claims
- 1076US6771158B2Micro electromechanical differential actuatorIND TECH RES INST·Filed 2002·Granted Aug 3, 2004·35 cites·11 claims
- 1170US8138509B2Light emitting device having luminescent layer with opening to exposed bond pad on light emitting die for wire bonding pad to substrateLIN TZY-YING·Filed 2009·Granted Mar 20, 2012·5 cites·11 claims
- 1266US9825078B2Camera device having an image sensor comprising a conductive layer and a reflection layer stacked together to form a light pipe structure accommodating a filter unitVISERA TECHNOLOGIES CO LTD·Filed 2014·Granted Nov 21, 2017·1 cites·19 claims
- 1362US7133185B2MEMS optical switch with self-assembly structureIND TECH RES INST·Filed 2004·Granted Nov 7, 2006·8 cites·7 claims
- 1454US8029160B2Illumination device having bi-convex lens assembly and coaxial concave reflectorIND TECH RES INST·Filed 2006·Granted Oct 4, 2011·1 cites·14 claims
- 1552US9516286B2Color correction devices and methodsVISERA TECHNOLOGIES CO LTD·Filed 2014·Granted Dec 6, 2016·0 cites·14 claims
- 1651US2014191260A1Light emitting semiconductor structureSEMILEDS OPTOELECTRONICS CO·Filed 2014·Application pending·0 cites
- 1748US6950224B1Electrostatic movable micro mirror chipIND TECH RES INST·Filed 2004·Granted Sep 27, 2005·3 cites·16 claims
- 1847US9332235B2Imaging capture apparatus having plurality of image sensors generating respective image signals based on emitted light areasVISERA TECHNOLOGIES CO LTD·Filed 2013·Granted May 3, 2016·0 cites·16 claims
- 1947US8502257B2Light-emitting diode packageCHANG KUO-CHING·Filed 2009·Granted Aug 6, 2013·0 cites·17 claims
- 2046US9948839B2Image sensor and image capture deviceVISERA TECHNOLOGIES CO LTD·Filed 2016·Granted Apr 17, 2018·0 cites·10 claims
- 2146US2010127288A1Light-emitting diode devices and methods for fabricating the sameVISERA TECHNOLOGIES CO LTD·Filed 2008·Application pending·0 cites
- 2244US10347678B2Image sensor with shifted microlens arrayVISERA TECHNOLOGIES CO LTD·Filed 2017·Granted Jul 9, 2019·0 cites·16 claims
- 2344US10148919B2Image sensor having yellow filter unitsVISERA TECHNOLOGIES CO LTD·Filed 2015·Granted Dec 4, 2018·0 cites·17 claims
- 2443US2011089447A1Light-emiting device chip with micro-lenses and method for fabricating the sameKUO WU-CHENG·Filed 2009·Application pending·0 cites
- 2543US2010237379A1Light emitting deviceKUO WU-CHENG·Filed 2009·Application pending·0 cites
- 2643US2010237378A1Light emitting diode package structure and fabrication thereofLIN TZU-HAN·Filed 2009·Application pending·0 cites
- 2742US2015064629A1Manufacturing method for microlensesVISERA TECHNOLOGIES CO LTD·Filed 2013·Application pending·0 cites
- 2842US2011037081A1White light-emitting diode packages with tunable color temperatureKUO WU-CHENG·Filed 2009·Application pending·0 cites
- 2939US8399969B2Chip package and fabricating method thereofCHANG KUO-CHING·Filed 2010·Granted Mar 19, 2013·0 cites·19 claims
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